DETERMINING THE THERMAL ATTRIBUTES OF CMP THROUGH CONTROLLED REMOVAL RATE vs. TEMPERATURE STUDIES

摘要

This study has shown that information regarding the relative magnitude of the thermally dependent and thermally independent aspects of the ILD and copper CMP processes (as triggered by controlled thermal changes in the system) can be critical in designing novel pads and slurries with controlled chemical and mechanical actions. For example, a chemically resistant novel pad that enhances the chemical attributes of the process while suppressing its mechanical attributes may have a longer pad life due to less mechanical wear. Similarly, alternative balances between the mechanical and chemical attributes of a slurry might lead to lower dishing and erosion for copper CMP applications.