INTEGRATED MULTISCALE AND MULTISTEP PROCESS SIMULATION

摘要

This paper describes the integration of process simulations on several scales and for several process steps in the fabrication of a simple damascene structure. Starting with a blanket silicon dioxide substrate and a patterned mask, we perform simulations of plasma etching, barrier deposition, seed layer deposition, electrochemical deposition of copper using an additive containing bath, and chemical mechanical polishing. This virtual process sequence demonstrates the use of process simulation to study not just individual process steps, but process flows. CMP is used to focus the discussion of integrated multiscale process simulation (IMPS).