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EMAP 2012;International conference on Electronic Materials and Packaging

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1.Preparation of MWCNT-Ni0.5Zn0.5Fe2O4-Epoxy Composites with both Dielectric and Ferromagnetic Properties

机译：具有介电和铁磁性性质的MWCNT-Ni0.5Zn0.5Fe2O4-环氧复合材料的制备
- 作者：Qi Zheng;Pengli Zhu;Rong Sun;Ching-Ping Wong
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Dielectric;
- Ferromagnetic Properties;
2.Electrochemical deposition of Galfenol

机译：加仑酚的电化学沉积
- 作者：Robert W. Kay;Jack Hoyd-Gigg Ng;Chris Popov;Paul Record;Marc P. Y. Desmulliez
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Electrochemical;
- Galfenol;
- Gallium;
- Galfenol;
- Gallium;
3.Development of thermal fatigue sensor for electrical and electronic equipment

机译：电气和电子设备热疲劳传感器的开发
- 作者：Yuya MINAKATA;Qiuang YU;Kanji Takagi
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- thermal;
- Fatigue;
- Sensor;
4.Supply Chains for 3D IC Integration Manufacturing

机译：3D IC集成制造的供应链
- 作者：John H. Lau
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Supply;
- Integration;
- Manufacturing;
5.Through Silicon Via (TSV) Redundancy - A High Reliability, Networking Product Perspective

机译：通过硅通孔（TSV）冗余 - 高可靠性，网络产品的视角
- 作者：Poh Choon Chew;Li Li;Jie Xue;William Eklow
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Networking;
- Product;
- Perspective;
6.Effect of Gold Concentration Through A Single Dynamic Wave Soldering Process

机译：金浓度通过单一动态波焊过程的影响
- 作者：F. Che Ani;M.S. Abdul Aziz;A. Jalar;M.Z. Abdullah;Rethinasamy. P
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Effect;
- Gold;
- Concentration;
7.Effect of the Lattice Mismatch between Copper Thin-film Interconnection and Base Material on the Crystallinity of the Interconnection

机译：铜薄膜互连与基材之间的晶格错配对互连结晶度的影响
- 作者：Chuanhong Fan;Osamu Asai;Ken Suzuki;Hideo Miura
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Lattice;
- Mismatch;
- Copper;
8.Hygrothermal Analysis for the Electrochemical Migration Failure in Multi-Chip Packages during a Highly Accelerated Stress Test

机译：高加速应力测试期间多芯片封装中电化学迁移失效的湿热分析
- 作者：Jongguk Choe;Jae-Won Jang;Nam-Seog Kim;Soon-Bok Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Electrochemical;
- Migration;
- Failure;
9.Feasibility of PBGA Packaging for High Random Vibration Applications

机译：高随机振动应用PBGA包装的可行性
- 作者：Yeong K. Kim;Do Soon Hwang;Jae Hyuk Lim
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Feasibility;
- PBGA;
- Packaging;
10.Color Consistence Improvement in LED packages

机译：LED封装的颜色一致改善
- 作者：Cell K.Y. Wong;Stanley Y.Y. Leung;LinNiu;Gongqi Fan;Xiang Zhou;Cadmus C.A. Yuan;Guoqi Zhang;Yanglin Li;Menglong Tu;Shaofang Wang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Color;
- Consistence;
- Improvement in;
11.Importance of Cu/Al Intermetallic Coverage in Copper Wire Bonding with Sensitive Pad Structure

机译：Cu / Al金属间覆盖与敏感垫结构的CU / Al金属间覆盖的重要性
- 作者：Tracy Jia Lin Yap;Yin Kheng Au;Poh Leng Eu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Intermetallic;
- Coverage;
- Copper;
12.Low-Temperature Bonding Method Based On Metallic Microcone Array For Interconnection Application

机译：基于金属微通阵互连应用的低温键合方法
- 作者：Qin Lu;Zhuo Chen;Liming Gao;Ming Li
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Low-Temperature;
- Bonding;
- Method;
13.A Thermal Performance Assessment of Panel Type Packaging (PTP) Technology for High Efficiency LED

机译：用于高效LED的面板型包装（PTP）技术的热性能评估
- 作者：Yen-Fu Su;Yu-Hsiang Yang;Wen-Kun Yang;Kuo-Ning Chiang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Thermal;
- Performance;
- Assessment;
14.High Bright White LED Packaging Systems Using Unique Vacuum Printing Technology (VPES)

机译：高亮白LED包装系统采用独特的真空印刷技术（VPES）
- 作者：Atsushi Okuno;IEEE Senior Member;Yoshiteru Miyawaki;Dongxu Wang;Osamu Tanaka
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- High;
- Bright;
- White;
15.Convenient fabrication of Composites with, Aqueous Synthesized Quantum Dots for LED Encapsulation

机译：用于LED封装的含水合成量子点的复合材料的方便制造
- 作者：Lei Zhang;Haibin Chen;Jingshen Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Convenient;
- fabrication;
- Composites;
16.An Atomistic Scale Study on Solidification in Ultrafine Interconnects

机译：超细互连凝固原子规模研究
- 作者：Zhiyong Wu;Zhiheng Huang;Paul Conway;Qingfeng Zeng
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Solidification;
- Ultrafine;
- Interconnects;
17.Packaging of Microelectronics for Thermo-Mechanical Environments

机译：用于热电区的微电子包装
- 作者：Ming-Han Wang;Mei-Ling Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Packaging;
- Microelectronics;
- Thermo-Mechanical;
18.Anomaly Detection for Chromaticity shift of High Power White LED with Mahalanobis Distance Approach

机译：用Mahalanobis距离方法对高功率白色LED的色度偏移的异常检测
- 作者：Jiajie Fan;Kam-Chuen Yung;Michael Pecht
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Anomaly;
- Detection;
- Chromaticity;
19.Study on Thermal Design due to Downsizing of Power Module Using Coupled Electrical-Thermal-Mechanical Analysis

机译：电力模块缩小电力模块的尺寸耦合电力 - 热机械分析研究
- 作者：Yasutaka YAMADA;Qiang YU;Tomohiro TAKAHASHI;Yusuke TAKAGI
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Thermal;
- Design;
- Downsizing;
20.Fabrication of One-dimensional CuO Nanocrystals via Pulsed Wire Explosion: Structural,Optical and Electronic Characterizations

机译：通过脉冲线爆炸制造一维CuO纳米晶体：结构，光学和电子表征
- 作者：Shutesh Krishnan;A.S.M.A Haseeb;Mohd. Rafie
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Fabrication;
- One-dimensional;
- Nanocrystals;
21.IGBT Power Module Packaging for EV Applications

机译：IGBT电源模块包装用于EV应用
- 作者：Chun-Kai Liu;Yu-Lin Chao;June-Chien Chang;Wei Li;Chih-Ming Tzeng;Rong-Chang Fang;Kuo-Shu Kao;Tao-Chih Chang;Chang-Sheng Chen;Wei-Chung Lo
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Power;
- Module;
- Packaging;
22.Optical Module for Healthcare Electronics

机译：医疗保健电子的光学模块
- 作者：Lydia Leung;Sunny Chu;Luis Ng;Raymond To;Enboa Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Module;
- Healthcare;
- Electronics;
23.Laminates for MEMS and BioMEMS

机译：用于MEMS和BIOMEM的层压板
- 作者：Mark Bachman;G.-P. Li
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Laminates;
- MEMS;
- BioMEMS;
24.Joint Properties of Micro Sn-58Bi Solder Bumps on Flexible Substrate

机译：柔性基板上的微Sn-58Bi焊料凸块的关节性能
- 作者：Min-Su Kim;Yong-Ho Ko;Sehoon Yoo;Chang-Woo Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Joint;
- Properties;
- Micro;
25.Thin Packages Enabling Thin Mobile Products

机译：薄包启用薄移动产品
- 作者：William T. Chen;Andy Tseng;Bernd K. Appelt
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Thin;
- Packages;
- Enabling;
26.Microstructural Analysis of Lead-free Solder Joint under Thermo-mechanical Loading

机译：热机械负载下无铅焊点的微观结构分析
- 作者：Kuo-Kang Hung;Mei-Ling Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Microstructural;
- Analysis;
- Lead-free Solder;
27.Micro-Texture and Physical Properties of the Cold-sprayed Copper Deposit

机译：冷喷涂铜矿的微观纹理和物理性质
- 作者：Yusuke Watanabe;Yuji Ichikawa;Isamu Nonaka;Hideo Miura
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Micro-Texture;
- Physical;
- Properties;
28.Research on Temperature Gradient Effect to Solder Joint Reliability

机译：焊接接头可靠性温度梯度效应研究
- 作者：Zheming Zhang;Jingshen Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Temperature;
- Gradient;
- Effect;
29.Reliability Simulation and Structural Optimization for Mechanical Loading

机译：机械加载的可靠性模拟与结构优化
- 作者：Jia-Shen Lan;Mei-Ling Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Reliability;
- Simulation;
- Structural;
30.Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects

机译：超声波检查包内缺陷考虑多界面效应
- 作者：Minshu Zhang;C. C. Jeffery. Lo;Shi-Wei Ricky Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Ultrasonic;
- Inspection;
- Package;
31.The Role of Thermal Properties of PCB Substrates in Heat Dissipation of LED Back Light Bars

机译：PCB基板的热性能在LED背灯散热中的作用
- 作者：C. Y. Tang;J. J. Huang;Y. L. Peng;M. Y. Tsai;Peter Liang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Role;
- Thermal;
- Properties;
32.Low Temperature Bonding of Piezoelectric Single Crystal Materials for Miniaturized High Resolution Ultrasound Transducers

机译：用于小型高分辨率超声换能器的压电单晶材料的低温粘合
- 作者：Jack Hoy-Gig Ng;Robert T. Ssekitoleko;Hoang-Vu Nguyen;Knut E. Aasmundtveit;Christine E. M. Demoré;Sandy Cochran;Marc P.Y. Desmulliez
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Temperature;
- Bonding;
- Piezoelectric;
33.Highly Sensitive Strain Sensor Using Carbon Nanotube

机译：使用碳纳米管的高敏感应变传感器
- 作者：Hiroshi Kawakami;Ken Suzuki;Hideo Miura
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Highly;
- Sensitive;
- Strain;
34.Pressureless Low Temperature Sintering of Ag Nanoparticles for Interconnects

机译：用于互连的Ag纳米粒子的无压力低温烧结
- 作者：Shuai Wang;Hongjun Ji;Mingyu Li;Jongmyung Kim;Hongbae Kim
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Pressureless;
- Temperature;
- Sintering;
35.Effect of Chemical Etching Solution on Cu/Al IMC Result

机译：化学蚀刻溶液对Cu / Al IMC结果的影响
- 作者：Wong Boh Kid;Yap Jia Lin;Eu Poh Leng;Yow Kai Yun;Yong C.C.
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Chemical;
- Etching;
- Solution;
36.Effects of Moisture Absorption and Temperature on the Adhesion Strength between Die Attach Film (DAF) and Silicon Die

机译：吸湿和温度对模具附着膜（DAF）和硅模具的粘合强度的影响
- 作者：Chunhua Guan;Martin Li;Kewei Chen;Haibin Chen;Jingshen Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Moisture;
- Absorption;
- Temperature;
37.Improvement of Pick Place Yield in Carrier Tape Packaging System through Materials Selection and Cavity Structure Optimization

机译：通过材料选择和腔结构优化改进载体胶带包装系统中的拾取产量
- 作者：Chenxiao Qiao;Yuning Shi;Nelson G. Vicera;Matthew Poon;Weiqiang Li;Haibin Chen;Jingshen Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Materials;
- Selection;
- Cavity;
38.Generation of Arbitrary Vector Beams with a Spatial Light Modulator

机译：用空间光调制器产生任意矢量梁
- 作者：Mengnan Zhao;Xiangsheng Xie
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Arbitrary;
- Vector;
- Beams;
39.Effect of Additive Elements on Tensile, Creep and Low Cycle Fatigue Strength for SnBi Solders

机译：添加剂元素对SNBI焊料拉伸，蠕变和低循环疲劳强度的影响
- 作者：Sho NAKANO;Masao SAKANE;Hiroaki HOKAZONO;Mitsuo YAMASHITA
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Effect;
- Additive;
- Elements;
40.Opportunities on Prolong Battery Stand-by Time

机译：延长电池待机时间的机会
- 作者：Tarn Yee Kam Daphne;Chen Haibin;Wu JingShen
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Opportunities;
- Prolong;
- Battery;
41.Warpage,Stresses and KOZ of 3D TSV DRAM Package During Manufacturing Processes

机译：制造过程中3D TSV DRAM包装的翘曲，应力和KOZ
- 作者：P. S. Huang;M. Y. Tsai;C. Y. Huang;P. C. Lin;Lawrence Huang;Steven Shih;J.P. Lin
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- During;
- Manufacturing;
- Processes;
42.A 3D Integration Testing Vehicle with TSV Interconnects

机译：具有TSV互连的3D集成测试车辆
- 作者：Tiwei Wei;Qian Wang;Ziyu Liu;Yinan Li;Dejun Wang;Tao Wang;Jian Cai
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Integration;
- Testing;
- Vehicle;
43.High-Speed, Low-Power Device Trend and Low-k Layer Delamination

机译：高速，低功耗器件趋势和低k层分层
- 作者：Hirofumi Nakajima
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Low-k;
- Layer;
- Delamination;
44.The Interfacial Interaction of Ti/Ni/Ag/Au Multilayer under Thermal Cycling Test

机译：热循环试验下Ti / Ni / Ag / Au Multidayer的界面相互作用
- 作者：Fu-Jung Yeh;Tsung-Chieh Chiu;Kwang-Lung Lin
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Interfacial;
- Interaction;
- Multilayer;
45.Parametric Modeling Study of Basic Electrodeposition in Microvias

机译：微疏松基本电沉积的参数建模研究
- 作者：Nadezhda Strusevich;Mayur Patel;Christopher Bailey
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Basic;
- Electrodeposition;
- Microvias;
46.The Evolution of IMCs' Morphologies and Types in SAC and SAC+ Solder Bumps during Thermal Shock Process

机译：热冲击过程中SAC和SAC +焊料凸块中IMCS形态和类型的演变
- 作者：Ying Zhong;Chun Qing Wang;J.F.J.M. Caers;Xiujuan Zhao
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Evolution;
- IMCs';
- Morphologies;
47.Localized Heating and Bond Formation at Solder/Cu Interface Induced by Ultrasonic Friction

机译：通过超声波摩擦诱导的焊料/ Cu接口处的局部加热和键合
- 作者：Zhuolin Li;Mingyu Lil;Jongmyung Kim;Hongbae Kim
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Localized;
- Heating:;
- Bond;
48.Volume Effect on Interfacial Microstructure and Mechanical Properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) Joints

机译：Ni（UBM）/sn3.0Ag0.5Cu/ni（UBM）关节界面微观结构和力学性能的体积效应
- 作者：Jing-Bo Zeng;Guang-Sui Xu;Min-Bo Zhou;Xin-Ping Zhang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Interfacial;
- Microstructure;
- Mechanical;
49.Carbon Nanotubes Based Composites with High Dielectric Constant and Low Loss

机译：基于介电常数和低损耗的碳纳米管基复合材料
- 作者：Imtiaz Madni;Shuhui Yu;Rong Sun
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Carbon;
- Nanotubes;
- Based;
50.Effects of Surface Treatments on the Performance of High Thermal Conductive Die Attach Adhesives (DAAs)

机译：表面处理对高导热模具粘合剂性能的影响（DAAS）
- 作者：Chenmin LIU;Dong Lu;Xianxin LANG;Ashley Choi;Peter WM Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Effects;
- Surface;
- Treatments;
51.Development of Innovative Cold Pin Pull Test Method for Solder Pad Crater Evaluation

机译：开发焊接焊盘火山口评价创新的冷销拉动试验方法
- 作者：Qiming Zhang;Chaoran Yang;Mian Tao;Fubin Song;S. W. Ricky Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Development;
- Innovative;
- Cold;
52.Transparent Functionalized Zinc Oxide/Epoxy Nanocomposite with High Thermal Performance for High-Power Light-Emitting Diodes

机译：透明官能化氧化锌/环氧纳米复合材料，具有高功率发光二极管的热性能
- 作者：Min Zhang;Kai Zhang;Xinfeng Zhang;Chen Yang;Matthew Ming-Fai Yuen
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Transparent;
- Functionalized;
- Zinc;
53.Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants

机译：纳米ZnO与透明环氧树脂包封剂性能的不同形态
- 作者：Chongnan Peng;Guoρing Zhang;Rong Sun;Ricky Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Morphologies;
- Nano-ZnO;
- Affection;
54.Development of Highly Conductive Inks for Smart Textiles

机译：开发智能纺织品的高导电墨水
- 作者：Masahiro Inoue;Yasunori Tada;Hiroaki Muta;Yamato Hayashi;Tomohiro Tokumaru
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Development;
- Highly;
- Conductive;
55.Wet-chemical Synthesis of the Size-controlled BaTiO3 Nanoparticles for Embedded Capacitors

机译：嵌入式电容器尺寸控制的BATIO3纳米粒子的湿化学合成
- 作者：Enhe Zhang;Suibin Luo;Wenhu Yang;Shuhui Yu;Rong Sun;Yubao Zhao
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Wet-chemical;
- Synthesis;
- Size-controlled;
56.Process Considerations of TC-NCP Fine-pitch Copper Pillar FC Bonding

机译：TC-NCP细间距铜柱FC键合的过程考虑
- 作者：Y.M. Cheung;Ka San Lam;Giuseppe Y. Mak;Dewen Tian Ming Li
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Process;
- Considerations;
- TC-NCP;
57.Development of Low Temperature Chip-on-Flex (COF) Bonding Process of 100°C

机译：开发低温芯片 - 弯曲（COF）粘合过程100°C
- 作者：Sun-Chul Kim;Young-Ho Kim
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Development;
- Low;
- Temperature;
58.Investigation of Rework for Straddle Mount Connectors

机译：跨跨架连接器返工的调查
- 作者：Jeffery Li;Fubin Song;Khoo KoK Wei;James Huang;Alex Chen;PK Pu;Sven Peng
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Rework;
- Straddle;
- Mount;
59.Effect of Interfacial Reaction Layer on the Brittle Fracture of the SAC305 Solder Joint on ENIG and ENEPIG Surface Finish

机译：界面反应层对SAC305焊点脆性骨折对ENIG和ENEPIG表面光洁度的影响
- 作者：Sang-Hyun Kwon;Kang-Dong Kim;Deok-Gon Han;Tae-Hyun Sung;Chang-Woo Lee;Sehoon Yoo
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Interfacial;
- Reaction;
- Layer;
60.Highly Transparent Conducting Graphene Films Produced by Langmuir Blodgett Assembly as Flexible Electrodes

机译：由Langmuir Blodgett组件产生的高度透明的导电石墨烯薄膜作为柔性电极
- 作者：Xiuyi Lin;Jingjing Jia;Nariman Yousefi;Xi Shen;Jang-Kyo Kim
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Transparent;
- Conducting;
- Graphene;
61.Novel Substrate Technology for IPM (Intelligent Power Module) Applications: Structural, Thermal and Electrical Characteristics

机译：IPM（智能电源模块）应用的新型基板技术：结构，热电特性
- 作者：Kwang-Soo Kim;Young-Ki Lee;Young-Hoon Kwak;Ji Hyun Park;Job Ha;Ga-Young Shin;Bum-Seok Suh
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Novel;
- Substrate;
- Technology;
62.Recent Advances in Anisotropic Conductive Adhesives (ACAs) Technology: Materials and Processing

机译：各向异性导电粘合剂（ACAS）技术的最新进展：材料和加工
- 作者：Kyung W. Paik
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Anisotropic;
- Conductive;
- Adhesives;
63.Controlling Fusion Zone Shape and Peak Temperature Produced by Laser or Electron Beam

机译：控制激光或电子束产生的融合区形状和峰值温度
- 作者：P. S. Wei
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Controlling;
- Fusion;
- Zone;
64.Assembly Analysis of Cu/Ni/SnAg Microbump for Stacking Thin Chips in a Fine Pitch Package Using a Wafer-level Underfill

机译：Cu / Ni / Snag Microbump用于使用晶片水平填充物堆叠薄碎片的Cu / Ni / Snag Microbips的组装分析
- 作者：Chang-Chun Lee;Tsung-Fu Yang;Kuo-Shu Kao;Ren-Chin Cheng;Chau-Jie Zhan
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Microbump;
- Stacking;
- Thin Chips;
65.Current Stressing Effects on Interfacial Reaction Characteristics of Fine-Pitch Microbump

机译：电流应力对细间距微胀气界面反应特性的影响
- 作者：Jong-Myeong Park;Jong-Jin Park;Sung-Hyuk Kim;Young-Bae Park
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Current;
- Stressing;
- Effects;
66.A Facile Fabrication Method of Silver Lines on PET with Good Adhesion at Room Temperature

机译：在室温下粘附良好的PET银线的容易制造方法
- 作者：Yunxia Jin;Dunying Deng;Yuanrong Cheng;Fei Xiao
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Facile;
- Fabrication;
- Method;
67.Impact from IMC Thickness on the Reliability of Wire Bonding

机译：IMC厚度的影响对引线键合可靠性
- 作者：J. Xiao;J. Huang;J. Liao;Y. Lin
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Reliability;
- Wire;
- Bonding;
68.LED Wafer Level Packaging with a Remote Phosphor Cap

机译：LED晶圆级包装，带有远程荧光粉帽
- 作者：Huihua Liu;Rong Zhang;Jeffery C. C. Lo;S. W. Ricky Lee
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Wafer;
- Level;
- Packaging;
69.White LED Devices With Nearly Uniform Space-color Distribution Through Nanoparticle Usage

机译：通过纳米粒子用法具有几乎均匀的空间分布的白色LED器件
- 作者：Mingyang Wu;Lilin Liu;Gang Wang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Space-color;
- Distribution;
- Nanoparticle;
70.Hard Mold UV Nanoimprint Lithography Process

机译：硬模UV纳米压印光刻工艺
- 作者：Yinsheng ZHONG;Matthew. M. F. YUEN
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Nanoimprint;
- Lithography;
- Process;
71.Mechanical fastening to enable room temperature packaging for LOCs based on biocompatible hydrogel thin film

机译：机械紧固，使基于生物相容性水凝胶薄膜的LOC的室温包装
- 作者：Weiwei Zhao;Changqing Liu;Cristina Lenardi;Tommaso Santaniello;Fengshun Wu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Mechanical;
- Fastening;
- Enable;
72.Preparation and Performance Research on the Si3N4@SiO2/PI Nanocomposite

机译：Si3N4 @ SiO2 / Pi纳米复合材料的制备与性能研究
- 作者：Jing Qin;Guoping Zhang;Rong Sun;Chingping Wong
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Preparation;
- Performance;
- Research;
73.Systematic Pd Cu Wire Bond Recipe Development Flow for Successful Qualification Result

机译：系统的PD CU线键合配谱发育流程，以获得成功的资格结果
- 作者：Law Lai Cheng;Wong Boh Kid;Hiew Pey Fang;Eu Poh Leng
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Wire;
- Bond;
- Recipe;
74.Solder Volume Effects on Fatigue Life of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects

机译：对BGA结构疲劳寿命的焊料体积效应Cu / Sn-3.0AG-0.5CU / Cu互连
- 作者：Hong-Bo QIN;Xun-Ping LI;Xin-Ping ZHANG
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Solder;
- Volume;
- Effects;
75.Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

机译：基于薄膜结晶度的控制改进薄膜互连的可靠性
- 作者：Osamu Asai;Naokazu Murata;Ken Suzuki;Hideo Miura
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Reliability;
- Thin-Film;
- Interconnections;
76.Thermal Performance and Placement Design of LED Array Package on PCB

机译：PCB上LED阵列包装的热性能和放置设计
- 作者：K.C. Yung H.M.;Liem H.S. Choy
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Thermal;
- Performance;
- Placement;
77.A Study on Evaluation Method of New Packaging Structure for High-Temperature Power Device

机译：高温动力装置新包装结构评价方法研究
- 作者：Akihiro HIGUCHI;Qiang YU;Toshikazu OSHIDARI;Mingliang CUI
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Evaluation;
- Method;
- Packaging;
78.Packaging of SiC-SBD for High Temperature Operation

机译：SIC-SBD的包装用于高温操作
- 作者：Zarel Valdez-Nava;Masahiro Kozako;Sorin Dinculescu;Ichiro Omura;Masayuki Hikita;Thierry Lebey
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Packaging;
- Temperature;
- Operation;
79.Preparation of Copper Nanoparticles with Low Sintering Temperature

机译：具有低烧结温度的铜纳米粒子的制备
- 作者：Dunying Deng;Yunxia Jin;Yuanrong Chen;Tianke Qi Fei Xiao
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Preparation;
- Copper;
- Nanoparticles;
80.Potential-assisted Assembly of Thiol-based Materials for Reliable Copper-Epoxy Interface

机译：用于可靠铜环氧界面的硫醇基材料的潜在辅助组装
- 作者：Stephen C.T. KWOK;Matthew M.F. YUEN
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Assembly;
- Thiol-based;
- Materials;
81.Air Gap Design of Current Sensor Based on Closed Loop Hall Effect

机译：基于闭环厅效应的电流传感器气隙设计
- 作者：Fuan Li;Xingguo Cheng;Sheng Liu;Xiaobing Luo
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Gap;
- Design;
- Current;
82.Inductive Link Design with Optimal Transfer Efficiency and a High CMRR

机译：具有最佳转移效率和高CMRR的归纳链接设计
- 作者：Yi-Chieh Lin;Tzyy-Sheng Horng;Lih-Tyng Hwang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Inductive;
- Link;
- Design;
83.In-line Monitoring of the Change of Residual Stress in Nano-Scale Transistors during Their Thin-Film Processing and Packaging

机译：薄膜加工和包装期间纳米晶体管残余应力变化的在线监测
- 作者：Hironori Tago;Ken Suzuki;Hideo Miura
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Monitoring;
- Change;
- Residual;
84.Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnections Embedded in TSV Structures

机译：嵌入TSV结构中电镀铜薄膜互连晶体质量的评价
- 作者：Ryosuke Furuya;Ken Suzuki;Hideo Miura
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Evaluation;
- Crystallographic;
- Quality;
85.Silicon Substrate with TSV for Light Emitting Diode Packaging

机译：具有TSV的硅衬底，用于发光二极管包装
- 作者：Zhicheng Lv;Xiaogang Liu;Liang Yang;Jiaojiao Yuan;Xuefang Wang;Sheng Liu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Emitting;
- Diode;
- Packaging;
86.Assembly and Testing of Thermal Test Chip on Silicon Interposer with Through Silicon Via

机译：通过硅通孔硅中介层的热试验芯片组装和测试
- 作者：Ziyu Liu;Jian Cai;Qian Wang;Xi He;Shuidi Wang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Assembly;
- Testing;
- Thermal;
87.Dependence of packing fraction and surface area of the particles in the composites made by the combination of aluminum oxide and nitride for improving the thermal conductivity

机译：用氧化铝和氮化物组合制备的复合材料中颗粒的填充级分和表面积的依赖性，以提高导热率
- 作者：Seran Choi;Yuseon Heo;Myeongjin Kim;Yongseon Hwang;Jooheon Kim
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Dependence;
- packing;
- fraction;
88.Molding Void Issue and Solution of a Package-in-Package

机译：塑造空隙问题和包装包装的解决方案
- 作者：Yu Chen;Jian Cai;Mian Huang;Guanqiang Song;Jing Jiang;Lin Tan;Qian Wang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Molding;
- Void;
- Issue;
89.Effects of Molding Compounds on Warpage and Damage of PBGA after Post Mold Cure

机译：模塑化合物对模具固化后PBGA翘曲和损伤的影响
- 作者：Tatiana M. Lam;Sung Yi
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Effects;
- Molding;
- Compounds;
90.Effects of Microstructure on Thermal Fatigue Life Prediction of Solder Joints

机译：微观结构对焊点热疲劳预测的影响
- 作者：Hiue Tran;Yin Fun Chua;Sung Yi;Phil Geng
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Microstructure;
- Thermal;
- Fatigue;
91.A method for geometry control of phosphor layer in high-power white LEDs by package structure

机译：封装结构用高功率白色LED荧光粉层的几何控制方法
- 作者：Huai Zheng;Xing Fu;Bulong Wu;Sheng Liu;Xiaobing Luo
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- method;
- Geometry;
- Control;
92.An Investigation on Secondary EFO Copper Wire - from a Nanoscale Perspective View

机译：次媒体铜线 - 从纳米级视角研究
- 作者：Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Cheng-Che Liu;Shen-Li Fu;Miin Shyan Bair
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Investigation;
- Secondary;
- EFO;
93.Development and Qualification of Copper Wire Bond Process for Automotive Applications

机译：汽车应用铜线键合工艺的开发与资格
- 作者：Pey Fang Hiew;Yin Kheng Au;Poh Leng Eu
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Development;
- Qualification;
- Copper;
94.Carbon Nanotubes Based Composites with High Dielectric Constant and Low Loss

机译：基于介电常数和低损耗的碳纳米管基复合材料
- 作者：Imtiaz Madni;Shuhui Yu;Rong Sun
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Carbon;
- Nanotubes;
- Based;
95.The Investigation of LED's Reliability Through Highly Accelerated Stress Testing Methods

机译：通过高加速应力测试方法调查LED可靠性
- 作者：Lilin Liu;Jianfu Yang;Gang Wang
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Investigation;
- LED's;
- Reliability;
96.Fatigue Life and Reliability Prediction of Electronic Packages under Thermal Cycling Conditions through FEM Analysis and Acceleration Models

机译：通过FEM分析和加速模型在热循环条件下电子包装疲劳寿命和可靠性预测
- 作者：Xuhua Huang;Wen-Fang Wu;Po-Lun Chou
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Reliability;
- Prediction;
- Electronic;
97.Effects of Microstructure on Vacancy and Stress Distributions in Micro Joints under Current Stressing

机译：微观结构对电流应力下微关节空位和应力分布的影响
- 作者：Hua Xiong;Zhiheng Huang;Paul Conway;Qingfeng Zeng
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Microstructure;
- Vacancy;
- Stress;
98.Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG

机译：双相固液间隔粘接，用于WBG的模具附着的溶液
- 作者：Tao-Chih Chang;Jing-Yao Chang;Tung-Han Chuang;Wei-Chung Lo
- 会议名称：《EMAP 2012;International conference on Electronic Materials and Packaging》 | 2012年
- Dual-phase;
- Solid-liquid;
- Interdiffusion;