Thanks to the advancement of Ball Grid Array (BGA) technology, microelectronic packaging has become smaller, thinner and of a higher density and resilience than traditional packing technology. Ball Grid Array plays an important role in this technology and is utilized in many packages, such as Chip Scale Packaging (CSP), Wafer Level Packaging (WLP), Flip Chip (FC),and so on. Due to the requirements for miniaturization and the low cost, BGA has been widely applied in many applications. However, the solder joint fatigue life diminishes during mechanical loading. As microelectronic packaging is becoming more and more miniaturized, the solder joint fatigue life is getting worse in the strategy environment. It is therefore necessary to find a solution to this problem. In this study, a simulation-based design optimization methodology was developed for improving solder joint fatigue life in microelectronic packaging.
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