The Interfacial Interaction of Ti/Ni/Ag/Au Multilayer under Thermal Cycling Test

摘要

The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between -40oC and 125oC. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.