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China Semiconductor Technology International Conference

召开年：2019
召开地：Shanghai(CN)
出版时间：-

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1.Study on Infrared Spectrum Detection and Analysis of BTA Residual after Copper CMP

机译：铜CMP后BTA残留的红外光谱检测与分析研究
- 作者：Qi Wang;Baimei Tan;Siyu Tian;Chunyu Han;Liu Yang;Baohong Gao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
2.Impact of Hot-Carrier Stress on Oxide Trap Switching Activity in Nanoscale FETs

机译：热载流应力对纳米级FET中氧化物陷阱开关活性的影响
- 作者：Xin Ju;D. S. Ang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- electron traps;
- hot carriers;
- interface states;
- MOSFET;
- semiconductor device reliability;
3.Adjustable Arbiter Physical Unclonable Function with Flexible Response Distribution

机译：具有灵活响应分配的可调仲裁器物理不可克隆功能
- 作者：Jing Ye;Xiaowei Li;Huawei Li;Yu Hu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- flexible electronics;
- integrated circuit reliability;
- integrated circuit testing;
4.High Efficiency and Low Cost Solution on RFID Tag Measurement

机译：RFID标签测量的高效低成本解决方案
- 作者：Lei Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- Internet of Things;
- radiofrequency identification;
5.High-Resolution High-Sensitivity Human-Computer Algorithm and Gesture Control SOC Chip for Artificial Intelligence Applications

机译：人工智能应用的高分辨率高灵敏度人机算法和手势控制SOC芯片
- 作者：Chen Li;Tao Zhou;Jianxin Wen;Yuhang Zhao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- feature extraction;
- gesture recognition;
- human computer interaction;
- low-power electronics;
- system-on-chip;
6.A Low Power 0.4-1 Ghz Receiver Front-End with an Enhanced Third-Order-Harmonic-Rejecting Series N-Path Filter

机译：具有增强型三阶谐波抑制系列N路径滤波器的低功率0.4-1 Ghz接收器前端
- 作者：Zexue Liu;Heyi Li;Yi Tan;Haoyun Jiang;Junhua Liu;Huailin Liao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS integrated circuits;
- field effect MMIC;
- harmonics suppression;
- low-power electronics;
- microwave filters;
- MMIC mixers;
- radio receivers;
- UHF filters;
7.Study on the Properties of Nano-Silica Colloid with Mixed Particle Size in Sapphire Substrate CMP

机译：蓝宝石衬底CMP中纳米粒径混合纳米胶体的性能研究
- 作者：Weiwei Li;Zhen Liang;Zhilin Zhao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
8.Effect of Chelating Agent on the Galvanic Corrosion between Copper and Tantalum based Alkaline Polishing Surry

机译：螯合剂对铜和钽基碱性抛光剂电偶腐蚀的影响
- 作者：Jiacheng Qi;Guofeng Pan;Chenwei Wang;Chao Huang;Lianjun Hu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- copper;
- corrosion;
- galvanising;
- slurries;
- tantalum;
9.Effective Mask Patterning Strategy as Design Complexity and CD Stability

机译：作为设计复杂性和CD稳定性的有效掩模图案化策略
- 作者：Young Ham;Yohan Choi;Michael Green;Mohamed Ramadan;Chris Progler
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- design for manufacture;
- masks;
- proximity effect (lithography);
10.Semi-Implicit Mask Synthesis with Additive Operator Splitting

机译：具有加法运算符拆分的半隐式掩模合成
- 作者：Yijiang Shen;Fei Peng
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- nonlinear equations;
- optimisation;
- partial differential equations;
11.Exposure System Improvement for Greater Productivity

机译：曝光系统改进以提高生产率
- 作者：Takahiro Takiguchi;Kenta Kita;Yosuke Takarada;Ryo Kasai;Satoru Sugiyama;Tsuneari Fukada
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
12.High Performance NLDMOS with Optimized Channel and Drift

机译：具有优化通道和漂移的高性能NLDMOS
- 作者：Wensheng Qian;Zhaozhao Xu;Ziquan Fang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
13.Impact of Forming Voltage Polarity on HfO2-based RRAM Performance

机译：电压极性的形成对基于HfO 2 的RRAM性能的影响
- 作者：Jian Kang;Zongwei Wang;Yishao Chen;Yichen Fang;Qilin Zheng;Yuchao Yang;Jintong Xu;Yimao Cai;Ru Huang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- aluminium;
- electrical resistivity;
- hafnium compounds;
- resistive RAM;
- tantalum compounds;
14.Optimization of Passivation and Top Metal Layer Crack in Temperature Cycle Test of RF-LDMOS

机译：RF-LDMOS温度循环测试中钝化层和顶层金属层裂纹的优化
- 作者：Ying Cai;Jingfeng Huang;Han Yu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
15.Study on Chemical Mechanical Polishing of R-Plane Sapphire by Different Additives

机译：不同添加剂对R面蓝宝石进行化学机械抛光的研究
- 作者：Yaqi Cui;Xinhuan Niu;Jianchao Wang;Da Yin;Jiakai Zhou;Zhi Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- abrasives;
- additives;
- catalysts;
- chemical mechanical polishing;
- machining;
- magnesium compounds;
- potassium compounds;
- precision engineering;
- sapphire;
- slurries;
- surfactants;
16.Effect of Chelation and Oxidation on Reducing Galvanic Corrosion between Cobalt and Copper in Alkaline Slurry

机译：螯合和氧化对降低碱液中钴和铜之间电偶腐蚀的影响
- 作者：Chao Huang;Guofeng Pan;Jiacheng Qi;Chenwei Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- chemical mechanical polishing;
- cobalt;
- copper;
- corrosion;
- dissolving;
- hydrogen compounds;
- oxidation;
- passivation;
- slurries;
- thin films;
17.65nm Node Possibility Study in 200mm FABS

机译：200mm FABS中的65nm节点可能性研究
- 作者：Weifeng Li;Huiping Shen;Yili Gu;Lei Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- nanolithography;
- nanopatterning;
- photolithography;
- pricing;
- proximity effect (lithography);
- ultraviolet lithography;
18.Inductive Coupled Downstream Plasma CD Trim Process Stability Study

机译：电感耦合下游等离子体CD修饰工艺稳定性研究
- 作者：Yali Fu;Shawming Ma;Yi Wang;Linda Sui;Lu Chen;Vijay Vaniapura;Li Diao;Mingjie Jiao;Hongwei Chen
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- photoresists;
- plasma materials processing;
- sputter etching;
19.Advanced Semiconductor Packaging Materials – Copper with Bamboo Structure

机译：先进的半导体封装材料–竹结构铜
- 作者：Jing Wang;Peipei Dong;Xingxing Zhang;Yun Zhang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- annealing;
- copper;
- corrosion resistance;
- electrical resistivity;
- etching;
- grain size;
- mechanical stability;
- surface roughness;
- tensile strength;
- thermal stability;
20.Study of 7V Device Application based on 0.18um Platform Process

机译：基于0.18um平台工艺的7V器件应用研究
- 作者：Jun Hu;Jike Wu;Xiuliang Cao;Wensheng Qian
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS integrated circuits;
- semiconductor device breakdown;
- semiconductor doping;
21.Chemical Mechanical Material Removal of Silicon Dioxide by a Single Pad Asperity

机译：单垫凹凸技术去除二氧化硅的化学机械材料
- 作者：Shuo Yang;Lin Wang;Ping Zhou;Ying Yan;Zhuji Jin
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- borosilicate glasses;
- chemical mechanical polishing;
- optical elements;
- optical fabrication;
- silicon compounds;
- surface morphology;
22.Effect of Ammonium Ion on Chemical Mechanical Polishing of Ru

机译：铵离子对Ru化学机械抛光的影响
- 作者：Ziyan Wang;Jianwei Zhou;Chenwei Wang;Jiajie Zhang;Qingwei Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- chemical mechanical polishing;
- electrochemistry;
- hydrogen compounds;
- oxidation;
- ruthenium;
- X-ray photoelectron spectra;
23.Product design optimization for prevent Bias Highly Accelerated Stress failure of RF-LDMOS

机译：产品设计优化，可防止RF-LDMOS的偏置高度加速应力失效
- 作者：Han Yu;Jingfeng Huang;Ying Cai
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
24.Investigation of Tungsten Rich Residue Defects Induced by Electron Beam Inspection post Contact Tungsten Chemical and Mechanical Polish

机译：电子束检查接触钨化学机械抛光后引起的富钨残留物缺陷的研究
- 作者：Rongwei Fan;Hunglin Chen;Kai Wang;Yin Long;Qiliang Ni;Xiaofang Gu
- 会议名称：《》 | 2019年
- bonds (chemical);
- chemical mechanical polishing;
- electron beam applications;
- failure analysis;
- inspection;
- surface cleaning;
- tungsten;
25.Quick Development of High Throughput RF Tests on HVM ATE

机译：在HVM ATE上快速开发高通量RF测试
- 作者：Ping. Wang;Goh. Frank;Chuansheng. Du;Chenpeng. Huang;Haixia. Guo;Haocheng. Yuan
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
26.6T6TPPNN Cell Legalization Considering Complex Minimum width Constraint

机译：考虑复杂最小宽度约束的6T＆6TPPNN单元合法化
- 作者：Peng Yang;Yuhang Chen;Jianli Chen;Hanbin Zhou;Senhua Dong
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- integrated circuit design;
- iterative methods;
- matrix algebra;
- quadratic programming;
27.An Initial Detailed Routing Algorithm Considering Advanced Technology Nodes

机译：考虑先进技术节点的初始详细路由算法
- 作者：Xiqiong Bai;Dixiu Xiao;Wenxing Zhu;Jianli Chen
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- integrated circuit layout;
- multi-threading;
- network routing;
28.Uniformity improvement and roughness reduction by using non-ion surfactant in the weakly alkaline barrier slurry

机译：通过在弱碱性阻隔浆料中使用非离子表面活性剂来改善均匀性和降低粗糙度
- 作者：Cong Wang;Yuling Liu;Cheiwei Wang;Huihui Zhang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- chemical mechanical polishing;
- copper;
- planarisation;
- slurries;
- surface roughness;
- surfactants;
29.Potassium Tartrate as a Complexing Agent for Cobalt “Buff Step” CMP in Alkaline Slurry

机译：酒石酸钾作为碱性浆料中钴“抛光步骤” CMP的络合剂
- 作者：Tingwei Liang;Shengli Wang;Chenwei Wang;Fengxia Liu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- chemical mechanical polishing;
- cobalt;
- corrosion;
- galvanising;
- pH;
- slurries;
- titanium;
30.Effect of Ammonium sulfate and H2O2 on Cobalt Contact bulk Chemical Mechanical Polishing

机译：硫酸铵和H 2 O 2 对钴接触块化学机械抛光的影响
- 作者：Fengxia Liu;shengli Wang;Chenwei Wang;Qiyuan Tian;Tingwei Liang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- ammonium compounds;
- chemical mechanical polishing;
- cobalt;
- corrosion;
- corrosion protection;
- current density;
- dissolving;
- electrochemistry;
- hydrogen compounds;
- slurries;
31.Study on Wafer De-Chuck for High Aspect Ratio Etch Process

机译：高深宽比蚀刻工艺晶圆去卡盘的研究
- 作者：Guorong Li;Zhiqiang Liu;Michael Tsai;Zhaoxiang Wang;Ping Liu;Xing Zhang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- arcs (electric);
- etching;
- NAND circuits;
- optimisation;
32.Reactive-Ion Etching of Cr-Doped Sb2Te3 Thin Film in SF6/O2 Plasma for Non-Volatile Phase-Change Memories

机译：Cr掺杂Sb 2 Te 3 薄膜在SF 6 / O 2 等离子体中的反应离子刻蚀非易失性相变存储器
- 作者：Luguang Wang;Fang Wang;Yuxiang Li;Jinrong Huang;Wei Li;Kailiang Zhang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- antimony compounds;
- chromium;
- gas mixtures;
- phase change materials;
- sputter etching;
- surface roughness;
- thin films;
33.Practical Exploration of Yield Prediction Model

机译：产量预测模型的实践探索
- 作者：Wu Yuan;Xu Yun;Zhang Yuxiang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- integrated circuit yield;
- Poisson distribution;
34.Optimal Design of Heat Dissipation Structure of IGBT Modules Based on Graphene

机译：基于石墨烯的IGBT模块散热结构的优化设计
- 作者：Hao Zhao;Jie Bao;Yuan Xu;Wenyi Xu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- cooling;
- graphene;
- insulated gate bipolar transistors;
- temperature distribution;
- thermal conductivity;
35.A Small “Dead-Area” Packaging Approach for Front Side Illuminated Photodiode

机译：一种用于正面照明光电二极管的小型“死区”封装方法
- 作者：Wenxuan Cheng;Ru Yang;Jian Liu;Xingan Zhang;Ran He;Kun Liang;Dejun Han
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- adhesion;
- adhesives;
- chip scale packaging;
- elemental semiconductors;
- flip-chip devices;
- packaging;
- photodetectors;
- photodiodes;
- photomultipliers;
- photoresists;
- silicon;
- three-dimensional integrated circuits;
36.Permanent Bonding Process Development Using Gapless Glue for CIS-TSV Wafer Level Packaging

机译：使用无间隙胶水进行CIS-TSV晶圆级封装的永久粘合工艺开发
- 作者：Chengqian Wang;Yi Liu;Meng Zhang;Shuying Ma;Zhiyi Xiao;Daquan Yu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
37.Delamination Improvement for a QFN Package with Stacked Dies by Finite Element Simulation

机译：有限元模拟对带有裸片的QFN封装的分层改进
- 作者：Weidong Huang;Jian Jin;April Yang;Wei Wu;Jacky Wu;Grass Dong;CF Oo
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- delamination;
- design of experiments;
- electronics packaging;
- finite element analysis;
38.Studies of the Influence of FOWLP Dimensions on the Flexure Strength

机译：FOWLP尺寸对弯曲强度影响的研究
- 作者：Cheng Xu;Zhao-Wei Zhong;Won-Kyoung Choi
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- bending strength;
- wafer level packaging;
39.Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications

机译：具有多种综合特性的先进多功能临时粘合材料，适用于各种先进包装应用
- 作者：Xiao Liu;Dongshun Bai;Lisa Kirchner;Rama Puligadda;Tony Flaim
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
40.Analysis of JFC Adsorption Effect on Surface Roughness of Aluminum For Alkaline CMP By EIS

机译：EIS分析JFC对碱性CMP铝表面粗糙度的吸附效应。
- 作者：Zhi Wang;Ming Sun;Xinhuan Niu;Jiakai Zhou;Yaqi Cui
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- adsorption;
- aluminium;
- chemical mechanical polishing;
- contact angle;
- electrochemical impedance spectroscopy;
- hydrophilicity;
- slurries;
- surface roughness;
- surface tension;
- surfactants;
41.Electrochemical and Surface Analysis of the Chemical Induced Defects with Aluminum Gate CMP

机译：铝栅CMP的化学诱导缺陷的电化学和表面分析
- 作者：Ming Sun;Zhi Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- adsorption;
- aluminium;
- chemical mechanical polishing;
- corrosion;
- electrochemical impedance spectroscopy;
- hydrophilicity;
- optical microscopy;
- passivation;
- surface chemistry;
- thin films;
42.Optimize of High-k Capping Layer Loss Thickness in DPRM Process to Avoid Vth Shift

机译：DPRM工艺中高k封盖层损耗厚度的优化以避免Vth偏移
- 作者：Meng Shi;Cheng Liu;Haitao Yan;Haiyang Mao;Baodong Han;Guangmei Xia
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- high-k dielectric thin films;
- MOSFET;
- plasma materials processing;
- sputter etching;
- titanium compounds;
- work function;
43.NBTI-Aware Digital LDO Design for Edge Devices in IoT Systems

机译：面向物联网系统边缘设备的NBTI感知数字LDO设计
- 作者：Yu-Guang Chen;Yu-Yi Lin
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- digital control;
- MOS integrated circuits;
- negative bias temperature instability;
- voltage regulators;
44.Efficient Energy Delivery and Dynamic Control for SOC High Power Supply

机译：SOC大功率电源的高效能量传输和动态控制
- 作者：Boping Wu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- microprocessor chips;
- system-on-chip;
- system-on-package;
45.Optimization on Chemical Mechanical Planarization of Chromium Doped Antimony Telluride (Cr-SbTe) for PCM Devices

机译：用于PCM器件的铬掺杂碲化锑（Cr-SbTe）化学机械平面化的优化
- 作者：Luguang Wang;Fang Wang;Yuxiang Li;Jinrong Huang;Wei Li;Kailiang Zhang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- antimony compounds;
- chemical mechanical polishing;
- chromium;
- electrical resistivity;
- oxidation;
- pH;
- phase change memories;
- planarisation;
- slurries;
- surface roughness;
46.Within Wafer Wafer to Wafer Thickness Uniformity Controllable Study on ILD-CMP Via Polishing Pad’s Physical Property Analysis and Linear Interval Feedback APC’s Implementation

机译：通过抛光垫的物理特性分析和线性间隔反馈APC的实施，在晶片内部和晶片到晶片之间的厚度均匀性可控性研究ILD-CMP
- 作者：Zhijie Zhang;Hongdi Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- chemical mechanical polishing;
- feedback;
- hardness;
- materials testing;
- planarisation;
- process control;
- semiconductor technology;
- shear modulus;
- slurries;
- thickness control;
47.A High-Sensitivity Low-Noise HDR CMOS Image Sensor Based on Novel 6-TR. 1-CAP. Pixel for Scientific Applications

机译：基于新型6-TR的高灵敏度低噪声HDR CMOS图像传感器。 1-CAP。科学应用像素
- 作者：Chen Li;Jiebin Duan;Xueqiang Gu;Yong Wang;Jianxin Wen;Shoumian Chen;Yuhang Zhao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS image sensors;
- image resolution;
- integrated circuit noise;
- photodetectors;
48.Z²-FET: a multi-functional device used for photodetection

机译：Z ^{2 -FET：用于光电检测的多功能设备}
- 作者：J. Liu;XY. Cao;BR. Lu;YF. Chen;A. Zaslavsky;S. Cristoloveanu;M. Bawedin;J. Wan
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS image sensors;
- elemental semiconductors;
- field effect transistors;
- photodetectors;
- silicon;
- technology CAD (electronics);
49.A Low Power Analog Baseband for IoT Applications in 40 nm CMOS

机译：用于40 nm CMOS的物联网应用的低功耗模拟基带
- 作者：Yi Tan;Zexue Liu;Junhua Liu;Huailin Liao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
50.Overview of a FPGA-Based Overlay Processor

机译：基于FPGA的覆盖处理器概述
- 作者：Yunxuan Yu;Chen Wu;Xiao Shi;Lei He
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- convolutional neural nets;
- field programmable gate arrays;
- reconfigurable architectures;
51.Input Voltage Scheme for DOT Product Engine Using NAND Flash Cells

机译：使用NAND闪存单元的DOT产品引擎的输入电压方案
- 作者：Sung-Tae Lee;Suhwan Lim;Nagyong Choi;Jong-Ho Bae;Dongseok Kwon;Hyeong-Su Kim;Byung-Gook Park;Jong-Ho Lee
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- feedforward neural nets;
- flash memories;
- NAND circuits;
52.The Implementation of Semiconductor Based Biosensors Into Point of Need Systems for the Automatized Analysis of Complex Samples

机译：基于半导体的生物传感器到复杂样品自动分析的需求系统中的实现
- 作者：Sascha Geidel;Andreas Morschhauser;Thomas Otto
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- bioMEMS;
- biosensors;
- integrated optics;
- lab-on-a-chip;
- microfluidics;
53.Numerical Simulation on Filtration Performance of Fibrous Filter Media with Different Structures

机译：不同结构纤维滤料过滤性能的数值模拟
- 作者：Yang Xu;Bin Zhou;Lan Zhu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- air cleaners;
- filtration;
- flow simulation;
- glass fibres;
- lattice Boltzmann methods;
- log normal distribution;
- numerical analysis;
54.Geometry Optimization of Current-Mode Full Symmetric Vertical Hall Device by TCAD Simulation

机译：基于TCAD仿真的电流模式全对称垂直霍尔器件的几何优化
- 作者：Xingxing Hu;Lei Jiang;Zixuan Wang;Yue Xu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS integrated circuits;
- electronic engineering computing;
- Hall effect devices;
- technology CAD (electronics);
55.Batch Atomic Layer Deposition of Aluminum Nitride for RF-MEMS and GAN Power-Devices

机译：用于RF-MEMS和GAN功率器件的氮化铝批量原子层沉积
- 作者：Zhen Zhu;Erik Østreng;Iiris Tuoriniemi;Zhenzi Chen;Kalle Niiranen;Sami Sneck
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
56.A MMIC Ultra-Low Noise Amplifier for S-Band Application

机译：适用于S频段应用的MMIC超低噪声放大器
- 作者：Yuchen Wang;Jiangtao Sun;Gaopeng Chen;Dunshan Yu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS integrated circuits;
- high electron mobility transistors;
- low noise amplifiers;
- MMIC amplifiers;
- UHF amplifiers;
57.A 32-Kb High–Speed 8T SRAM with Fine-Grained Bitline Stacking for Leakage Reduction in 7nm Technology

机译：带有细晶粒位线堆叠的32Kb高速8T SRAM，可减少7nm技术中的泄漏
- 作者：Fei Zhou;Xiaoli Hu;Guoxing Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- CMOS memory circuits;
- SRAM chips;
58.A Compact SPAD Pixel With Active Quenching And Recharging

机译：具有主动淬火和充电功能的紧凑型SPAD像素
- 作者：Jiyuan Lu;Bin Li;Feng Yuan;Yue Xu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- avalanche photodiodes;
- CMOS integrated circuits;
- photodetectors;
- photon counting;
59.A Low-Computational Complexity System for EEG Signals Compression and Classification

机译：用于脑电信号压缩和分类的低计算复杂度系统
- 作者：Qinming Zhang;Jia Zhang;Cheng Zhuo
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
60.A Novel Compact Time-To-Amplitude Conveter for Spad Detector

机译：一种适用于Spad检测器的新型紧凑型时间幅度转换器
- 作者：Zhong Wu;Ding Li;Feng Yuan;Xinchun Ji;Yue Xu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- avalanche diodes;
- avalanche photodiodes;
- biomedical electronics;
- CMOS integrated circuits;
- convertors;
- low-power electronics;
- MOSFET;
- photodetectors;
61.Redistribution-Layers for Fan-Out Wafer-Level Packaging and Heterogeneous Integrations

机译：扇出晶圆级封装和异构集成的重新分发层
- 作者：John H Lau
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
62.Wafer Thinning and Dicing Technology for 3D Nand Flash

机译：用于3D Nand Flash的晶圆减薄和划片技术
- 作者：Qian Ma;Jiantao Lin;Hao Liu;Jeroen van Borkulo
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- flash memories;
- integrated circuit packaging;
- NAND circuits;
63.The GSG-PAD Layout Optimization for Test-Key of mm-Wave Devices

机译：毫米波设备测试键的GSG-PAD布局优化
- 作者：Quan Wang;Linlin Liu;Yueyi Feng;Wei Zhou;Ao Guo;Hongbo Ye;Yingjia Guo
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- circuit optimisation;
- CMOS integrated circuits;
- integrated circuit layout;
- integrated circuit testing;
- MIMIC;
64.A Study of Deep Silicon Etching for Power Device Fabrication

机译：用于功率器件制造的深硅刻蚀研究
- 作者：WAN Yu;WANG Chun;ZHANG Yunge;Qiu Chunlong;ZHENG Youshan;LI Dongsan
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
65.Improvement of Cell’s Performance for Low Power Self-Aligned Split-Gate SONOS Memory Device

机译：低功耗自对准分裂门SONOS存储设备的单元性能改进
- 作者：Jun Hu;Zhaozhao Xu;Kegang Zhang;Wei Xiong;Donghua Liu;Hualun Chen;Wensheng Qian
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- carrier mobility;
- low-power electronics;
- random-access storage;
- semiconductor device reliability;
- silicon compounds;
66.Local Layout Effect Impact to Single Device in SRAM 6T Cell

机译：局部布局效应对SRAM 6T单元中单个器件的影响
- 作者：Yijun Zhang;Nan Wang;Yu Li;Yuan Wang;Xiaohua Li;Guiying Ma;Yongcheng Zhai;Jianhua Ju
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- cache storage;
- integrated circuit layout;
- integrated circuit manufacture;
- SRAM chips;
67.A 1μw-to-100μw Output Range Boost DC-DC with Pseudo Open Loop Structure and Power Efficient Ring Oscillator for Wireless Energy Harvesting

机译：具有伪开环结构和高能效环形振荡器的1μw至100μw输出范围升压DC-DC，用于无线能量收集
- 作者：Le Ye;Xiaolong Chen;Libo Yang;Hao Zhang;Peiyu Chen;Zhixuan Wang;Enbin Gong
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- DC-DC power convertors;
- energy harvesting;
- feedback;
- open loop systems;
- oscillators;
- pulse frequency modulation;
- voltage control;
- voltage regulators;
68.Single Particle Inductivley Coupled Plasma Mass Spectrometry Metrology for Advanced Semiconductor Process Development

机译：用于先进半导体工艺开发的单粒子电感耦合等离子体质谱计量学
- 作者：Qilin Chan;Waldo Wang;Larry Zazzera;Alex Simpson;Jaimie Stomberg;Majid Entezarian;Daniel Lei;Mark Ellefson;Brian Mader;Jinsheng Zhou
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- mass spectroscopy;
- membranes;
- nanoparticles;
- particle size;
- planarisation;
69.Study of Ultra High Voltage 500V NLDMOS with Aggressive Design of Drift Region

机译：漂移区激进设计的超高压500V NLDMOS研究
- 作者：Wenting Duan;Chunyu Yuan;Zhaozhao Xu;Wensheng Qian;Donghua Liu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- power MOSFET;
- semiconductor device breakdown;
- semiconductor device models;
- semiconductor doping;
70.A Study of Inductor and its Model in SiGe BICMOS Process

机译：SiGe BICMOS工艺中的电感及其模型的研究
- 作者：Zhang Jian;Donghua Liu
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
71.Integrated Circuit Back End of Line Defect Detection

机译：集成电路线路尾部缺陷检测
- 作者：Wang Wei;Zhu Zhenhua;Zhang Chao;Bei DuoHui;Yang Ming
- 会议名称：《》 | 2019年
- approximation theory;
- etching;
- integrated circuit modelling;
- integrated circuit yield;
- photolithography;
- SRAM chips;
- statistical analysis;
- stochastic processes;
72.Press-Fit Whisker and its Growth Contributing Factors-Part I

机译：压合晶须及其增长因素-第一部分
- 作者：Flora He;Shuzhao Cao;Dennis Chan;Crystal Li;Geoffrey Tong;Dennis Yee;Xi Cao;John Lehman
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- coatings;
- semiconductor device manufacture;
- titanium compounds;
- whiskers (crystal);
73.The investigation of source doping effect on on-state current in homojunction and heterojunction Tunneling FETs

机译：同质结和异质结隧穿FET中源极掺杂对通态电流的影响研究
- 作者：Shuang Xia;Qian Xie;Mingjun Liu;Zheng Wang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
74.Single-Ended Sub-threshold 9T SRAM Cell With Ground Cut-Off

机译：具有接地截止功能的单端亚阈值9T SRAM单元
- 作者：Smaran Adarsh;M. Tanmay;M S Sunita
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- SRAM chips;
75.Plasma Process Optimization of Silicon Film Deposition from Trichlorosiliane Precursor with OES Monitoring

机译：用OES监测三氯硅烷前驱物沉积硅的等离子体工艺优化。
- 作者：Chien-Chieh Lee;Song-Ho Wang;Hsueh-Er Chang;Yiin-Kuen Fuh;Tomi T. Li;Ya-Hui Chiou;Hsin-Chuan Cheng
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
76.EFA Method of AA-Bridge-Type-Defect of SONOS NOR flash

机译：SONOS NOR flash的AA桥类型缺陷的EFA方法
- 作者：Qingwen Zhang;Zhimin Zeng;Yuxiang Zhang;Yuan Wu;Chenjie Zhou
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- bridge circuits;
- failure analysis;
- flash memories;
- NOR circuits;
- random-access storage;
77.Defect Assessment in AlN Nucleation Layers Grown on Silicon and Silicon-on-Insulator Substrates

机译：硅和绝缘体上硅衬底上生长的AlN成核层中的缺陷评估
- 作者：E. Simoen;W. Zhang;J. Zhang;C. Claeys;M. Zhao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
78.EUV Mask Near-Field Synthesis

机译：EUV掩模近场合成
- 作者：Taian Fan;Xu Ma;Yayi Wei;Lisong Dong
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- learning (artificial intelligence);
- masks;
- regression analysis;
- ultraviolet lithography;
79.SRAM Standby Current Fail Analysis using OBIRCH, Voltage Contrast and Junction Stain

机译：使用OBIRCH，电压对比和结污点的SRAM待机电流故障分析
- 作者：Jinjin Xie;Xiangbai Ma;Zhimin Zeng
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
80.Fast Development of High-performance ICs in AI/IoT Era

机译：在AI / IoT时代快速开发高性能IC
- 作者：Min-hwa Chi;Richard Chang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
81.Estimating the Etching Depth Limit in Deep Silicon Etching

机译：估算深硅蚀刻中的蚀刻深度极限
- 作者：Yuanhe Zhao;Yuanwei Lin
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- elemental semiconductors;
- etching;
- mathematical analysis;
- silicon;
82.Design of Microbolometer by Polycrystalline Silicon in Standard CMOS Technology

机译：采用标准CMOS技术的多晶硅微辐射热计的设计
- 作者：Xinwen Cao;Mingcheng Luo;Wei Si;Feng Yan;Xiaoli Ji
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
83.Tube Length Effect of Anodized Aluminum Oxide Template Based Gas Sensor

机译：阳极氧化铝模板气体传感器的管长效应
- 作者：Zhipeng KANG;Huayu HU;Xiaojin ZHAO;Xiaofang PAN
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- alumina;
- anodisation;
- current density;
- gas sensors;
- surface chemistry;
84.Die Attachment Material based on Micro AG Paste for the Application of High Powder Devices

机译：基于Micro AG膏的模具附着材料在高粉装置中的应用
- 作者：Jinting Jiu;Tetsu Takemasa;Junko Seino;Yoshie Tachibana
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- electrical conductivity;
- electrical resistivity;
- mechanical strength;
- microassembling;
- powders;
- silver;
- sintering;
85.Advanced Si Etch System for 14nm and Beyond

机译：适用于14nm及更高版本的先进Si蚀刻系统
- 作者：Tomoki Suemasa;Guodong Chen;Zhongwei Jiang;Yahui Huang
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- elemental semiconductors;
- masks;
- photoresists;
- silicon;
- sputter etching;
86.A New Differential Pressure Sensor Based Mass Flow Controller for Advanced Semiconductor Processing

机译：基于新型差压传感器的质量流量控制器，用于先进半导体工艺
- 作者：Alexandra Liso;Anthony Kehoe;Mohamed Saleem
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- chemical vapour deposition;
- flow control;
- flow measurement;
- fluctuations;
- laminar flow;
- pressure measurement;
- pressure sensors;
- pressure transducers;
- semiconductor technology;
- valves;
87.Cavity Substrate Technology for SIP Application with Passive Components

机译：具有无源元件的SIP应用的腔体基板技术
- 作者：Ken Lee;Min Sung Kim;Jong Tae Lee;Dong Ju Jeon;Eun Ju Jang;Kyu Jin Lee
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- inductors;
- integrated circuit interconnections;
- system-in-package;
- wafer level packaging;
88.Not Your Father’s Timing Anymore – Novel Approaches to Timing of Digital Circuits

机译：不再是您父亲的时序-数字电路时序的新颖方法
- 作者：Ulf Schlichtmann
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- logic design;
- pipeline processing;
- security;
- sequential circuits;
- synchronisation;
89.Towards Efficient Neural Networks On-A-Chip: Joint Hardware-Algorithm Approaches

机译：面向片上高效神经网络：联合的硬件算法方法
- 作者：Xiaocong Du;Gokul Krishnan;Abinash Mohanty;Zheng Li;Gouranga Charan;Yu Cao
- 会议名称：《China Semiconductor Technology International Conference》 | 2019年
- learning (artificial intelligence);
- neural chips;