Effect of Chelating Agent on the Galvanic Corrosion between Copper and Tantalum based Alkaline Polishing Surry

摘要

Galvanic corrosion (gc) will be occurred at the interface of copper and tantalum contact polishing slurry during chemical mechanical planarization (CMP). In this paper, a kind of chelating agent was proposed to reduce the gc between Cu and Ta by investigating the potential of corrosion, static corrosion rate. Galvanic corrosion potential would be reduced which reveal that chelating agent can reduce the galvanic corrosion.