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Packaged MEMS device and method of calibrating a packaged MEMS device
Packaged MEMS device and method of calibrating a packaged MEMS device
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机译:封装的MEMS器件和校准封装的MEMS器件的方法
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摘要
A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
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