PACKAGED MEMS DEVICE AND METHOD OF CALIBRATING A PACKAGED MEMS DEVICE

摘要

A method of calibrating a packaged MEMS device and a packaged MEMS device is disclosed. In one embodiment, a packaged MEMS device includes a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a verification circuit disposed on the carrier, and encapsulation disposed on the carrier, Encapsulation encapsulates MEMS devices, signal processing devices, and memory elements.