Zero-Level Packaging for MEMS or MST Devices: The IRS Method

摘要

A variety of MEMS or MST devices requires encapsulation of their crucial parts in a hermetically sealed cavity for reasons of protection, reliability and tuning of performance. Chances for damaging the fragile movable parts are minimized if the cavity is realized at a very early packaging stage, conveniently referred to as the 0-level or wafer-level packaging. In this article, a novel 0-level packaging method, called the "indent-reflow-sealing (IRS) technique," will briefly be described. Application of the IRS method to the fabrication of a "MEMS relay" will be illustrated. More details on the IRS method can be found in ref.