Design, Packaging and Reliability of MEMS S&A Components and Systems

摘要

Technology refinements to the packaging process, as well as assuring the highest possible yield of serviceable F/S&A systems, are specifically addressed. The primary objective of this research project is to provide a basic physics based understanding of the behavior and performance of Safe and Arm (S & A) systems. The research covers a broad range of activities ranging from basic materials characterization to overall system level models. The research is conducted as a collaborative effort between Binghamton University, (BU), the Bennington Micro technology Center (BMC), and the Indian Head Division of the Naval Surface Warfare (IHDIV). BU focused on applied research related to the materials properties, the mechanical and thermal behavior of the system and the overall system performance and reliability under field conditions. BMC focused on process and manufacturing issues and help with the implementation of design changes and the exploration of additional applications.