Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications system-on-package (SOP)

摘要

The FDTD and MRTD full-wave numerical techniques are applied to the modeling and analysis of embedded components, such as MEMS, in Silicon packages. Preliminary design rules are derived for minimized-crosstalk transmission lines, for a wideband compact transition, for a MEMS switch and that can be used in practical tuning applications and for a packaging adaptive antenna.