Mold - housing structure with adhesive - outlet stopper for sealing a mems - component and a process for packaging an mems - component

摘要

A semi-conductor package comprising an electrically conductive leadframe, a first chip carrier with a first opening and a plurality of electrically conductive lines, a web, which can pivot around a circumference of the first opening is formed, and an electrically insulating moulding mass. The electrically insulating moulding mass comprises an inner hollow space, which by means of a planar base surface and outer side walls is defined, a second opening, which is formed in the base surface, and an inner side wall in the interior cavity. The moulding mass of the leadframe with the first chip carrier in the interior hollow space is formed. The first and the second opening are aligned in relation to one another so that they form a passage, which provides access to the inner cavity. The web and the inner side wall form a dam, which is configured to receive liquefied sealing means and to prevent that the liquefied sealing means in the passage or which is applied to the regions of the inner cavity flows.