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Adhesive bonding of MEMS and MOEMS with support of substrate inherent functional structures : design of a fault-tolerant adhesive bonding technique for microsystem technology by use of component integrated micro structured bonding aids

机译：MEMS和MOEMS的粘合结合，并支持基底固有的功能结构：使用组件集成的微结构化粘合助剂设计用于微系统技术的容错粘合结合技术

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Wagner Mario; Böhm Stefan; Dilger Klaus;
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年度 2011
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正文语种 eng
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Adhesive bonding of MEMS and MOEMS with support of substrate inherent functional structures : design of a fault-tolerant adhesive bonding technique for microsystem technology by use of component integrated micro structured bonding aids

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