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Microsystems,Packaging,Assembly & Circuits Technology Conference,(IMPACT),2008 3rd International

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1.A Novel Halogen-Free, Phosphorous-free and Heat Resistant Material for Copper clad laminate

机译：用于覆铜板的新型无卤，无磷，耐热材料
- 作者：Liu Chia Yu;Lu June Che;Hsu Su Wen
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
2.A Miniature Heat-Dissipation Packaging Design for GaInP Collector-Up HBTs as High-Power Amplifiers in Cellular Phone Systems

机译：GaInP集热器作为手机系统中的高功率放大器的微型散热包装设计
- 作者：Tseng Hsien-Cheng;Lee Pei-Hsuan;Chou Jung-Hua
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
3.DuPont Fluorochemical materials in TSV process

机译：TSV工艺中的杜邦含氟材料
- 作者：Lee Terry
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
4.SiP Embedded Technology in 12 inch Format

机译：12英寸格式的SiP嵌入式技术
- 作者：Hu Dyi-Chung;Yang Tsung Jen;Hu Ferry
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
5.Horizontal Reel to Reel Copper Plating with InPulse 2

机译：使用InPulse 2的水平线到线对铜电镀
- 作者：Kenny Stephen;Kostouros Demitry
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
6.Permanent Non-Etching Adhesion Promotion System for Solder Mask Applications

机译：用于阻焊膜的永久不腐蚀附着力促进系统
- 作者：Kumashiro S.;Massey R;Huelsmann T.;Sparing C.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
7.Method to Accurate Define Dimensions of Copper Traces

机译：精确定义铜迹线尺寸的方法
- 作者：Chen Smith;Hu Ferry;Hu Dyi-Chung
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
8.Enabling Future Packaging Innovation Through New Materials

机译：通过新材料实现未来的包装创新
- 作者：Irvine Peter A.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
9.'Behind the Scenes' of Effective OSP Protection in Pb-free Processing

机译：无铅加工中有效OSP保护的“幕后”
- 作者：Paw Witold;Nable Jun;Swanson John
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
10.Influence of Electroless Copper on IC Reliability

机译：化学铜对IC可靠性的影响
- 作者：Magaya Tafadzwa
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
11.Time Delay Control Methodology for High Speed Substrate Design

机译：高速基板设计的时延控制方法
- 作者：Chang Po-Hao;Hsieh Bryan;Chiang Kevin;Lai Jeng-Yuan;Wang Yu-Po
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
12.The Extraction of Dielectric Constant by Using the Metal Insulator Metal Capacitor for the Substrate Material

机译：使用金属绝缘体金属电容器提取基底材料的介电常数
- 作者：Hsieh Tsun-Lung;Jong Gwo-Jia;Wu Chih-Wei;Lee Tsung-Lun;Huang Ya-Wen
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
13.New Halogen free on6; Low Loss Material for High Frequency PCB Application

机译：全新无卤素6;用于高频PCB应用的低损耗材料
- 作者：He Sanny;Zhang Elren;Chen Jeng-I
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
14.Stacked Via Technology for Substrate

机译：通过基板堆叠技术
- 作者：Lo Larry
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
15.High thermal resistant polyimide coating applications on intelligent electronic devices

机译：高耐热性聚酰亚胺涂料在智能电子设备上的应用
- 作者：Itabashi Toshiaki
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
16.Substrate Approach for the Symphony Of IC on6; Packaging

机译：《 IC交响曲》的基板方法6;打包
- 作者：James HO V.P.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
17.An Elimination Design for drift rate effects of MEMS-Based Inertial Devices

机译：基于MEMS的惯性器件漂移速率影响的消除设计
- 作者：Chen Yung-Yue;Chang Shyang-Jye;Huang Chiung-Yau;Hsinag Chen Yung
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
18.The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates

机译：Cu基体上Sn-Ag-Bi-In焊料中金属间化合物的组成
- 作者：Chen M. H.;Jieng Y. Y.;Wu Albert T.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
19.Photoresist Removal Requirements for Advanced Wafer Level Packaging Technology

机译：先进晶圆级封装技术的光刻胶去除要求
- 作者：Yamamoto Yasuhisa
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
20.3D Integration : a technological toolbox

机译：3D集成：技术工具箱
- 作者：Poupon Gilles;Scannell Mark;di Cioccio Lea;Henry David;Leduc Patrick;Clavelier Laurent;Sillon Nicolas
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
21.Characterization of a New Epoxy Resin System for Thermal Management Application

机译：用于热管理应用的新型环氧树脂系统的特性
- 作者：Chen Wen-Ren;Chen Jeng-I
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
22.A Novel High Resolution Epoxy Based Dry Film Material for Wafer Level Packaging Application

机译：晶圆级包装应用的新型高分辨率环氧树脂基干膜材料
- 作者：Hsiung Kuma;Tsai Colin;Chen LC;Yen George
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- 3D;
- PerMX;
- adhesive;
- dry film;
- epoxy;
- passivation;
23.Embedding of Chips for System in Package realization - Technology and Applications

机译：封装中系统芯片的嵌入-技术与应用
- 作者：Boettcher Lars;Manessis Dionysios;Ostmann Andreas;Karaszkiewicz Stefan;Reichl Herbert
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- 3D packaging;
- Chip in Polymer;
- System in Package;
- embedded chips;
24.Ultra Long Needle Geometry Probe Card Development for Wafer Level Test

机译：晶圆水平测试的超长针几何探针卡开发
- 作者：Chang Hao-Yuan;Pan Wen-Fung;Shih Meng-Kai;Lai Yi-Shao;Tsao Yu-Cheng
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
25.Via2 ?? Laser Embedded Conductor Technology 2008 The 3rd IMPACT and 10th EMAP Joint Conference

机译：通过 2 ？激光嵌入式导体技术2008第三届IMPACT和第十届EMAP联合会议
- 作者：Baron Dave
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
26.Via2 - Laser Embedded Conductor Technology 2008 The 3rd IMPACT and 10th EMAP Joint Conference

机译：Via 2 -激光嵌入式导体技术2008第三届IMPACT和第十届EMAP联合会议
- 作者：Huemoeller Ron
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
27.Lighting Up Your Green Thought -Novel Research in Halogen Free Material Application

机译：点亮您的绿色思想-无卤材料应用的新研究
- 作者：Yeh Tzuoo-Lun;Chen Albert;Huang Richard
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
28.Next Generation Electroplating Process for HDI Microvia Filling and Through Hole Plating

机译：HDI微孔填充和通孔电镀的下一代电镀工艺
- 作者：Lefebvre Mark;Najjar Elie;Gomez Luis;Barstad Leon
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
29.Thermal Investigations of 3D FCBGA Packages with TSV Technology

机译：使用TSV技术的3D FCBGA封装的热研究
- 作者：Kuo Wei-Shen;Wang Mingzong;Chen Eason;Lai Jeng-Yuan;Wang Yu-Po
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- TSV;
- simulation;
30.The Investigation of Intermetallic Compound Morphology Effect on the Solder Joint Performance

机译：金属间化合物形态对焊点性能的影响研究
- 作者：Lee Chien Wei;Hung Liang Yi;Chang Chiang Cheng;Wang Yu Po;Hsiao C.S.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
31.Vibration Failure Assessment Methodology for the Fatigue Life of Ball Grid Array BGA Solder Joints

机译：球栅阵列BGA焊点疲劳寿命的振动失效评估方法
- 作者：Wu Mei-Ling
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
32.New Generation Solution for Micro Via Metallization and Through Hole Plating

机译：微型通孔金属化和通孔电镀的新一代解决方案
- 作者：Nikolova Maria;Watkowski Jim;Desalvo Donald;Blake Ron
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
33.Reworking POP Package on Package in Lead-Free Array

机译：在无铅阵列中的封装上重做POP封装
- 作者：Wood Paul
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
34.Properties of a Newly Developed Immersion Tin Coating

机译：新开发的浸锡涂层的性能
- 作者：Yau Yung-Herng;Wang Cai;Farrell Robert;Ye PingPing;Kudrak Ed;Wengenroth Karl;Abys Joseph
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
35.Peek for Lead-Free Soldering Processes and Electronics Applications

机译：探寻无铅焊接工艺和电子应用
- 作者：Chen Jeff
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- PEEK;
- lead-free solders;
- plastics;
- poly (aryl ether ether ketone);
36.Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis

机译：通过动态仿真和模态分析研究PCB对板级跌落测试的影响
- 作者：Chou Chan-Yen;Hung Tuan-Yu;Sano Masafumi;Yang Shin-Yueh;Chiang Kuo-Ning
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
37.An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model

机译：金丝/铜丝热影响区的研究及高级有限元引线键合模型
- 作者：Chang Wei-Yao;Hsu Hsiang-Chen;Fu Shen-Li;Lai Yi-Shao;Yeh Chang-Lin
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
38.CAE Analysis for Molding Design of Microchip Encapsulation

机译：微芯片封装成型设计的CAE分析
- 作者：Chou Ya-Yuen;Lin Chih-Jen;Yu Chao-Kai;Chiu Hsien-Sen
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
39.Birefringence Simulation of Annealed Ingot of Magnesium Fluoride Single Crystal

机译：氟化镁单晶退火锭的双折射模拟
- 作者：Kitamura Y.;Miyazaki N.;Mabuchi T.;Nawata T.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
40.Methods of Improving the Quality of X-Ray Image Reconstruction with Limited Projection Data

机译：利用有限的投影数据提高X射线图像重建质量的方法
- 作者：Shaw Dein;Kao Shih-Chao;Chen Shih-Liang
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Binary Steering Mechanism;
- Image Reconstruction;
- Tomography;
41.TSV/3D-TSV Package materials solution from DuPont Electronic Technologies

机译：杜邦电子技术的TSV / 3D-TSV封装材料解决方案
- 作者：Itabashi Toshiaki
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
42.A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test

机译：球冲击试验在组件级测量板级跌落冲击可靠性的研究
- 作者：Lai Yi-Shao;Wong E. H.;Rajoo R.;Seah S. K. W.;Selvanayagam C. S.;van Driel W. D.;Caers J. F. J. M.;Zhao X. J.;Owens N.;Tan L. C.;Leoni M.;Eu P. L.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
43.The Effect of Pulse-Reverse Plating Time on Blind Micro Via Filling

机译：反向电镀时间对盲孔微孔填充的影响
- 作者：Luo Jen Tsung;Lin Wen Bing;Shang Laurence
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Blind Micro Via;
- Cu Plating;
- PCB;
- Pulse Reverse plating;
44.Thermal Solutions for Multi-chip Chip Scale Packages

机译：多芯片芯片级封装的散热解决方案
- 作者：Chen M. W.;Chen Eason;Lai Jeng-Yuan;Wang Yu-Po
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
45.Liquid Optic Deflector

机译：液体偏转器
- 作者：Chen H. H.;Sheng H. Y.;Li Y. T.;Tyan W. D.;Fu C.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
46.Novel Application and Advantage of Reverse Blind Microvia (RBMV) on PCB

机译：反盲微通孔（RBMV）在PCB上的新颖应用和优势
- 作者：Chuang Po-Yao;Lu Ming-Tsun;Wu Chi-Ying
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- HDI;
- RBMV;
- reverse blind microvia;
- stacked-via;
47.The Fusion Navigation System Using the MEMS-based IMU and the Global Position System Device

机译：使用基于MEMS的IMU和全球定位系统设备的融合导航系统
- 作者：Chang Shyang-Jye;Chen Yung-Yue;Huang Chiung-Yau
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Fusion Navigation System;
- GPS;
- MEMS-based IMU;
48.Production Worthy 3D Interconnect Technology

机译：值得生产的3D互连技术
- 作者：Chiou W.C.;Yu C.H.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
49.Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package

机译：高分子材料的吸湿膨胀效应和指纹打印机包装的热湿机械设计
- 作者：Hsu Hsiang-Chen;Hsu Yu-Teng;Hsich Wen-Lo;Weng Meng-Chieh;ZhangJian Shao-Tang;Hsu Feng-Jui;Chen Yi-Feng;Fu Shen-Li
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
50.Mechanical Process Simulation of a Novel Metal-Nanowire-Film-based Flip Chip Technology

机译：一种基于金属纳米线薄膜的倒装芯片技术的机械过程仿真
- 作者：Cheng H.C.;Hsich K.Y.;Chen W.H.;Hsu Y.C.;Hsu J.S.;Uang R.H.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
51.A High Performance Leadframe Design For Memory Application

机译：面向存储器应用的高性能引线框架设计
- 作者：Kao Hsing-da;Chiang Kevin;Lai Jeng-Yuan;Wang Yu-Po;Hsiao C. S.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
52.A Novel ODT Selection for Memory Data Bus of Daisy Chain Topologies

机译：菊花链拓扑存储器数据总线的新型ODT选择
- 作者：Wu Feng-Nan;Wu Chun-Te;Lin Ding-Bing;Hung Kuo-Chiang
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
53.A High Speed Cu Pillar Bump Plating Process

机译：高速铜柱凸点电镀工艺
- 作者：Zhang Yun;Chung Stream;Walch Eric;Rietman Christian;Wang Chen;Richardson Thomas;Kuo Emile;Tseng Maggie
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- WLCSP;
- copper;
- electroplating;
- flip chip;
- thick RDL;
- wafer bumping;
54.A Thermally Enhanced Halogen Free Laminate Material to Reduce the Impact of Lead Free Process

机译：一种热增强的无卤层压材料，可减少无铅工艺的影响
- 作者：Lee Gordon;Liang Peter;Lin Jack
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
55.Thermal Measurement and Simulation of 3D stacked die packages

机译：3D堆叠芯片封装的热测量和仿真
- 作者：Liu Chun-Kai;Kuo Sheng-Liang;Yu Chin-Kuang;Chao Yu-Lin;Dai Ming-Ji;Hsu Chung-Yen
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
56.Temporary Non-Etching Adhesion Promotion System for Dry Film Applications

机译：用于干膜应用的临时非蚀刻附着力促进系统
- 作者：Huang J.;Massey R;Lutzow N.;Sparing C.;Tews D.;Thorns M.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
57.Bump Design Optimization for Copper Pillar FCBGA Package

机译：铜柱FCBGA封装的凸点设计优化
- 作者：Lin Tsung-Shu;Chen K. M.;Hu Yen-chang;Jiang Yih-jenn
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
58.Challenge on Packaging Substrate Technologies Towards Next Decade

机译：下一个十年封装基板技术的挑战
- 作者：Utsunomiya Henry Hisanobu
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
59.Effect of Underfill Mechanical Property on Cu/Low-K Delamination for Lead-Free Flip Chip Packaging

机译：底部填充机械性能对无铅倒装芯片封装的Cu /低K分层的影响
- 作者：Lin Tsung-Shu;Chen K. M.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
60.Reliability and Failure Mechanism of Current-Stressed 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu Composite Flip-Chip Solder Joints with Cu or Au/Ni/Cu Substrate Pad Metallization

机译：具有Cu或Au / Ni / Cu衬底焊盘金属化的电流应力99.3Sn-0.7Cu / 96.5Sn-3Ag-0.5Cu复合倒装芯片焊点的可靠性和失效机理
- 作者：Chiu Ying-Ta;Shao Yu-Hsiu;Lai Yi-Shao
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
61.Effect of Multiple Reflow Cycles on Ball Impact Responses of Sn-4Ag-0.5Cu Solder Joints with Immersion Tin Substrate Pad Finish

机译：多次回流对浸锡基板表面Sn-4Ag-0.5Cu焊点球冲击响应的影响
- 作者：Lai Yi-Shao;Kao C. R.;Chang Hsiao-Chuan;Lee Shu-Hua;Kao Chin-Li;Lan Wen-How
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
62.Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Developed by Diffusion Couples

机译：Cu 6 Sn 5 ，Cu 3 Sn和Ni 3 Sn 4 的纳米摩擦学特性inf>扩散对开发的金属间化合物
- 作者：Yang Ping-Feng;Jian Sheng-Rui;Lai Yi-Shao;Chen Rong-Sheng
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
63.Microstructure Study of High Lead Bump FCBGA Bending Test

机译：高铅凸点FCBGA弯曲试验的微观结构研究
- 作者：Hung Liang Yi;Chang Po Hao;Chang Chiang Cheng;Wang Yu Po;Hsiao C.S.;Kao C. Robert
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- 95Pb/5Sn bump;
- Flip Chip;
- fatigue;
64.Reliability Analysis of the Panel Base Package (PBP??) Technology with Enhanced Cover Layer

机译：具有增强覆盖层的面板基础包装（PBP ??）技术的可靠性分析
- 作者：Yew Ming-Chih;Yu Chun-Fai;Tsai Mars;Hu Dyi-Chung;Yang Wen-Kun;Chiang Kuo-Ning
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
65.Board Level Reliability Study for CSP with Polymer Cored Solder Ball

机译：带有聚合物芯焊球的CSP的板级可靠性研究
- 作者：Wang Yen-Ping;Hung Liang Yi;Chang Chiang Cheng;Wang Yu-Po;Hsiao C.S.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
66.Fatigue Life Evaluation of Ball Grid Array Packages with Sn-Ag-Cu and Rare-Earth Addition Solder under Cyclic Bending Test

机译：锡-银-铜和稀土添加焊料球栅阵列封装在循环弯曲试验下的疲劳寿命评估
- 作者：Cheng Chih-Yuan;Zhan Chau-Jie;Tung-Han Chuang
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Dynamic fatigue test;
- Rare-Earth addition solder;
- Reliability evaluation;
- Thermal cycling test;
67.Manufacturing Concepts for Stretchable Electronic Systems

机译：可伸缩电子系统的制造概念
- 作者：Ostmann Andreas;Loher Thomas;Seckel Manuel;Bottcher Lars;Reichl Herbert
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
68.The Effect on Bonding Process and Reliability for ACF Applications

机译：对ACF应用的键合过程和可靠性的影响
- 作者：Jong W. R.;Peng S. H.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
69.Characteristic of the Wire-Penetration Films for Stack-Die CSP Application

机译：叠层芯片CSP应用中的线渗透膜的特性
- 作者：Chung C.L.;Hsu H.C.;Fu S. L.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- B-stage;
- Stack-die CSP (Chip Scale Package);
- die-attach;
- film;
70.Cyclic Bending Testing condition effect on the SnAgCu Solder Interconnects in TFBGA Package on Board

机译：循环弯曲测试条件对板上TFBGA封装中SnAgCu焊料互连的影响
- 作者：Chang Graver;Yu CK;Shao Tina;Chen Cherie;Hsu Kim;Lee Jeffrey
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Board level;
- Cyclic bending;
- SnAgCu;
- TFBGA;
71.Investigate the Performance of SnCuNi (SCN) Alloy for Wave Soldering

机译：研究SnCuNi（SCN）合金在波峰焊中的性能
- 作者：Li K. C.;Huang Jay C. Y.;Ku J. L.;Lee Synger
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- SnCuNi alloy;
- copper dissolution;
- solderability;
- wave soldering;
72.Stacking Technique of Known Good Rebuilt Wafers Without Thru-Silicon Via Commercial Applications

机译：通过商业应用而无需硅的已知优质可重构晶圆的堆叠技术
- 作者：Val Christian;Couderc Pascal;Boulay Nadia
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
73.Dielectric Properties and RF characterisitics of Bismuth-Zinc-Niobium Thin Films for Embedded Capacitor in PCB

机译：PCB用嵌入式电容器铋锌铌薄膜的介电性能和RF特性。
- 作者：Lee Seung Eun;Lee Jung Won;Song Byung Ik;Lee Inhyung;Shin Yeena;Chung Yul Kyo
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
74.On the Effect of Cell Geometry on the Amorphization Process in Phase-Change Memories

机译：关于单元格几何形状对相变存储器中非晶化过程的影响
- 作者：Braga Stefania;Cabrini Alessandro;Torelli Guido
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Lance cell;
- Pillar cell;
- amorphization model;
- phase-change memory;
75.Computer Simulation of Aluminium Wirebonds with Globtop in Power Electronics Modules

机译：电力电子模块中带有Globtop的铝线键合的计算机模拟
- 作者：Lu Hua;Loh Wei-Sun;Bailey Chris;Johnson C Mark
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
76.Experimental and Molecular Dynamics Investigations of Nanoindentation-induced Phase Transformations in Monocrystalline Silicon

机译：单晶硅中纳米压痕诱导相变的实验和分子动力学研究
- 作者：Lin Yen-Hung;Yang Ping-Feng;Jian Sheng-Rui;Lai Yi-Shao;Chen Tei-Chen
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
77.The Introduction of Warpage Improvement Guidelines for BGA's Performance within SMT Temperature Profile

机译：在SMT温度曲线内介绍BGA性能的翘曲改善指南
- 作者：Yen Freedman;Chen Eason;Lai Jeng Yuan;Wang Yu Po
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
78.Halogen-Free Debate on Solderpaste : IPC Classification and Application

机译：焊膏无卤辩论：IPC分类和应用
- 作者：Poon Christine;Long Audrey;Wang James
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- halogen-free;
- solderpaste;
79.The Optimal window-BGA Design for High-Speed SDRAM

机译：高速SDRAM的最佳窗口BGA设计
- 作者：Huang Chih-Yi;Cheng Hung-Hsiang;Wang Chen-Chao;Huang Ya-Wen;Hsieh Tsun-Lung
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
80.Review on the Ball Drop-off Mechanisms of Lead-free Ball Grid Array Package

机译：无铅球栅阵列封装的落球机理研究
- 作者：Lu Charlie Tsung-hsing
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
81.Design of Multi-actuation RF MEMS Switch Using CMOS Process

机译：基于CMOS工艺的多驱动RF MEMS开关设计
- 作者：Lee Chiung-I;Ko Chih-Hsiang;Huang Tsun-Che
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
82.Analytical Linear study of Large Deflection of Simply Supported Layered-Plate under Initial Tension

机译：初始张力下简支分层板大挠度的分析线性研究
- 作者：Chen Chun-Fu;Chen John-Han
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
83.Fine Line/Space Technology for Flip Chip Substrate

机译：倒装芯片基板的精细线/空间技术
- 作者：Lin Max
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
84.Challenges and Limitations of Subtractive Processing in PWB and Substrate Fabrication

机译：PWB和基板制造中减法加工的挑战和局限性
- 作者：Dietz Karl H.
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
85.Theoretical Approach Towards Elastic Anisotropy and Strain-Induced Void Formation in Cu-Sn Crystalline Phases

机译：Cu-Sn晶相中弹性各向异性和应变诱导空隙形成的理论方法
- 作者：Chen Jiunn;Lai Yi-Shao
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
86.Coaxial Wiring Structures in Printed Circuit Boards

机译：印刷电路板中的同轴布线结构
- 作者：Aoyagi Masahiro;Kikuchi Katsuya;Shibata Kohei;Nakagawa Hiroshi;Imai Shoichi;Wada Tatsuo;Fujita Hiroyuki
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
87.Deformation of Center-Anchored Sector Plate with Double Layer Structure Caused by Induced Thermal Residual Gradient Stress

机译：残余热梯度应力引起的双层结构中心锚固扇形板变形
- 作者：Lin Meng-Ju
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
88.High Performance Base Materials Made by Powder Coating Technology

机译：粉末涂料技术制成的高性能基础材料
- 作者：Hunziker Max;Horst Gerhard
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
89.Adhesion Promotion Technology for Semi-Additive Process

机译：半添加工艺的粘合促进技术
- 作者：Chueh Bryan;Wu Cindy;Li Crystal;Tanabe Kazuo
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
90.Fast algorithm of Modal Expansion Method for Calculating Transfer Impedance of Arbitrary Shape Power Bus

机译：计算任意形状电力母线传输阻抗的模态展开法快速算法
- 作者：Lin Ding-Bing;Wu Chun-Te;Hung Kuo-Chiang;Wu Feng-Nan;Chen Yen-Hun
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》
- Modal expansion;
- segmentation method;
- transfer impedance;
91.Highly integrated flexible electronic Circuits and Modules

机译：高度集成的柔性电子电路和模块
- 作者：Loher Thomas;Seckel Manuel;Pahl Barbara;Bottcher Lars;Ostmann Andreas;Reichl Herbert
- 会议名称：《Microsystems,Packaging,Assembly Circuits Technology Conference,(IMPACT),2008 3rd International》