SiP Embedded Technology in 12 inch Format

摘要

SiP technology has been one of the alternative solutions to system integration. Compare to SoC, SiP has the advantages of integration of dies made from different technologies, e.g. GaAs and Silicon. In some cases, SiP technology may provide faster time to the market and at a lower cost. Despite many research activities, there are few companies actually went into mass production using SiP embedded technology due to lack of standard process and equipment. ACET has developed a SiP embedded structure and process for mass production. Current, ACET has mass production packages using 6" and 8" panel format. In order to further enhance the productivity and efficiency of the SiP embedded technology, going into a larger substrate is a next logical step. In the paper, we shall describe the development of SiP embedded technology in ACET. We also demonstrated successfully of building packages using 12 inch format in our manual line.