A general platform structure for 8-inch and 12-inch substrates. In a case in which device components are not replaced, two production modes of products can be rapidly switched. The platform structure comprises a general device front-end module (2), a general load module (3), and a general wafer transfer module (4). General mechanical arm fingers (5) are used on a mechanical arm of the general device front-end module (2). The fingers have two layers of steps, a step B (9) is used for holding 8-inch wafers (7), and a step A (8) is used for holding 12-inch wafers (6), and accordingly, the general device front-end module (2) can take the 8-inch/12-inch wafer raw materials out of a wafer box and transfer the 8-inch/12-inch wafer raw materials to the load module (3), and can take the finished wafer products out of the load module and place the finished wafer products into the wafer box. Diversification of produced products can be achieved, one machine for multiple purposes meets different manufacturing requirements, and device purchase cost is reduced. The general platform structure has the characteristics: the general platform structure has a simple and practical structure, saves device adjustment time and improves the production capacity. The general platform structure can be widely used in the technical field of semiconductor film devices.
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