High thermal resistant polyimide coating applications on intelligent electronic devices

摘要

Since starting high volume production of plastic mold packaging for IC/LSI, polyimide coatings has been using as of reliable passivation stress buffer (PSB) layer with over 20years history. The times have changed, modified / customize designed polyimide coatings are added more functionality resulting innovate usage and applications in electronics industry. This paper is examine variety of polyimide application examples and molecular design concept for control end properties, functionalities e.g. residual stress, Cu compatibility examples of new application and requirements. Also examine new adhesive concept and test results for 3D integrated package application.