Enabling Future Packaging Innovation Through New Materials

摘要

DuPont is a leading global supplier of materials used in the manufacture of a broad array of electronic components spanning from semiconductors to plasma display panels and photovoltaic modules. We are a science company with very diverse capabilities and a strong heritage of innovation in high performance materials. DuPont's newest innovations in dielectric materials and embedded passives will enable next generation IC substrates and modules by offering continued form factor reduction and electrical performance improvement. Newer extensions of dry film photoresist, polyimide, cleaners and other material technologies offer "One DuPont" solutions to future wafer level and 3D TSV packaging. Novel new thermal substrates enable packaging of high power devices for LED lighting, hybrid vehicles and photovoltaics. Across these different applications are increasingly more demanding electrical, thermal, mechanical and environmental performance requirements on new materials. At DuPont we see these as excellent opportunities to exploit our existing broad technology toolbox in polymers, ceramics, dispersions, coatings and films together with newer areas, in particular nanotechnology.