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IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
召开年:
2020
召开地:
Singapore(SG)
出版时间:
-
会议文集:
-
会议论文
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769
条结果
1.
Failure Mechanism of the Power-Clamp Device of Buck Converter during the Voltage Conversion
机译:
Buck转换器在电压转换过程中的钳位故障机制
作者:
Jian-Hsing Lee
;
Wu-Yang Liu
;
Chung-Yu Hung
;
Kuo-Hsuan Lo
;
Kun-Huang Yu
;
C-W Chiu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2020年
关键词:
Inductors;
Buck converters;
Transient analysis;
Capacitors;
Transistors;
Substrates;
Electric potential;
2.
Crack Identification in BEoL Stacks Using Acoustic Emission Testing and Nano X-ray Computed Tomography
机译:
利用声发射测试和纳米X射线计算机断层扫描技术识别BEoL堆栈中的裂纹
作者:
Jendrik Silomon
;
Jürgen Gluch
;
André Clausner
;
Jens Paul
;
Ehrenfried Zschech
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2020年
关键词:
Copper;
Force;
X-ray imaging;
Shearing;
Acoustic measurements;
Acoustic emission;
Semiconductor device measurement;
3.
Fault localization of IDDQ failure using External trigger Synchronous LIT technique
机译:
使用外部触发同步LIT技术对IDDQ故障进行故障定位
作者:
Nakaba Matsui
;
Yasushi Oka
;
Shinpei Tominaga
;
Akihito Uchikado
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2020年
关键词:
Fault diagnosis;
Circuit faults;
Failure analysis;
Wires;
Probes;
Optical buffering;
Thermal analysis;
4.
Accurate TDDB Lifetime Prediction Based on Intrinsic CiDSR Effect Model with Regarding Extrinsic Failures
机译:
基于内在CiDSR效应模型的关于外部故障的精确TDDB寿命预测
作者:
Akihiko Goda
;
Kenji Okada
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2020年
关键词:
Logic gates;
Stress;
Dielectrics;
Distortion;
Transistors;
Predictive models;
Capacitors;
5.
On the Mechanism of High Forward Voltage of InGaN Light Emitting Diodes
机译:
InGaN发光二极管高正向电压的机理
作者:
M. K. Dawood
;
Y. Yang
;
C. Kon
;
S. James
;
A. Yong
;
X. Luo
;
C. K. Tan
;
P. S. Quek
;
K. Teo
;
S. Huh
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2020年
关键词:
Light emitting diodes;
Resistance;
Hydrogen;
Gallium nitride;
Semiconductor diodes;
Fabrication;
Epitaxial growth;
6.
Short Term Reliability and Robustness of ultra-thin barrier, 110 nrn-gate AlN/GaN HEMTs
机译:
超薄势垒,110 nrn栅AlN / GaN HEMT的短期可靠性和耐用性
作者:
Zhan. Gao
;
Matteo. Meneghini
;
Kathia Harrouche
;
Riad Kabouche
;
Francesca Chiocchetta
;
Etienne Okada
;
Fabiana. Rampazzo
;
Carlo. De Santi
;
Farid Medjdoub
;
Gaudenzio. Meneghesso
;
Enrico. Zanoni
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2020年
关键词:
Stress;
Logic gates;
MODFETs;
HEMTs;
Reliability;
Electric breakdown;
Degradation;
7.
SIMS Analysis Methodology to Determine Sc Diffusion in Silicon Oxide
机译:
SIMS分析方法确定SC扩散在氧化硅中
作者:
Yun Wang
;
Kian Kok Ong
;
Han Wei Teo
;
Li Hong Li
;
Poh Chuan Ang
;
Zhi Qiang Mo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Silicon;
Films;
Ions;
Sputtering;
Annealing;
Rough surfaces;
Surface roughness;
8.
Seebeck Effect Imaging to Improve Short Defect Localization
机译:
Seebeck效果成像以提高短缺缺陷定位
作者:
Ming Guo
;
JingLong Li
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Metals;
Thermoelectricity;
Imaging;
Laser beams;
Silicon;
Lenses;
Semiconductor lasers;
9.
Digital Block Defect Localization using in-depth Circuit Analysis for Electrical Verification and Fault Isolation Correlation
机译:
数字块使用深入电路分析进行电气验证和故障隔离相关的数字块缺陷定位
作者:
Ronald Apolinaria
;
David Joseph Rimbon
;
Em Julius De La Cruz
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Metals;
Circuit faults;
Failure analysis;
Circuit analysis;
Multiplexing;
Integrated circuits;
Lenses;
10.
From Automotive to Space qualification: Overlaps, gaps and possible convergence
机译:
从汽车到空间资格:重叠,差距和可能的收敛
作者:
R. Enrici Vaion
;
M. Medda
;
A. Mancaleoni
;
G. Mura
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Reliability;
Qualifications;
Stress;
Automotive engineering;
Standards;
Integrated circuits;
Failure analysis;
11.
A Study of Pattern Density and Process Variations Impact on the Reliability Performance of Multi-Level Capacitance Structure in Low-k Copper Interconnects
机译:
模式密度和工艺变化对低k铜互连多级电容结构可靠性性能的影响
作者:
Qian Chen
;
Lanfei Xie
;
Ramasamy Chockalingam
;
Chee Wee Eng
;
Ushasree Katakamsetty
;
Pinghui Li
;
Li Han Chen
;
Xiaochong Guan
;
Soon Yoeng Tan
;
Juan Boon Tan
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Method of moments;
Metals;
Dielectrics;
Reliability;
Capacitance;
Leakage currents;
Shape;
12.
Copper Discoloration: Correlation Between Copper Oxidation States and Their Colors
机译:
铜变色:铜氧化状态与颜色之间的相关性
作者:
Lee Wei Cheat
;
Lim Saw Sing
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Copper;
Surface topography;
Surface morphology;
Chemicals;
Oxidation;
Rough surfaces;
Surface roughness;
13.
Heat Affected Zone Analysis of Flexible OLED Display Film by Photoluminescence and Raman Imaging Microscopy
机译:
通过光致发光和拉曼成像显微镜热影响柔性OLED显示膜的区域分析
作者:
Yun C. Park
;
Won B. Cho
;
Hyo J. Kim
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Impurities;
Measurement by laser beam;
Organic light emitting diodes;
Laser beam cutting;
Fiber lasers;
Microscopy;
14.
A Study on Effect of Top and Bottom Metal Plates on Stress Induced Voiding of Nose Type Single Via Structure
机译:
顶部和底部金属板对鼻型单通结构的压力诱导功能的研究
作者:
Aniketha Udupa Kuppar
;
Xu Zeng
;
Chai Wah Ng
;
YH James Lim
;
H. Walter Yao
;
EE jan Khor
;
Ramasamy Chockalingam
;
Juan Boon Tan
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Metals;
Stress;
Resistance;
Nose;
Temperature measurement;
Periodic structures;
Reliability;
15.
Case Study on Wire Bonding - Related Partial Discharge on High-Voltage Isolators
机译:
高压隔离器线粘合相关局部放电的案例研究
作者:
Manita Duangsang
;
Nophakam Thankham
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Polyimides;
Passivation;
Isolators;
High-voltage techniques;
Wires;
Partial discharges;
16.
Prevent Auger Analysis Misjudgment on Bond Pad Surface Element Concentration in the SPC Method
机译:
防止SPC方法中螺旋垫表面元件集中的螺旋座分析误判
作者:
Sheng-Min Chen
;
Chiu-E Tseng
;
Kuan-Chieh Huang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Fluctuations;
Corrosion;
Control charts;
Monitoring;
Databases;
Failure analysis;
17.
FBGA 28nm Scan Chain Failure Analysis
机译:
FBGA 28NM扫描链衰竭分析
作者:
Liew Chiun Ning
;
Lau Kok Heng
;
Ng Yi Jie
;
Goh Lay Lay
;
Lee Chong Haw
;
Loo Huey Wen
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Metals;
Failure analysis;
Transmission electron microscopy;
Circuit faults;
Layout;
Electron beams;
18.
Resolving Trap-caused Charges by Scanning Microwave Microscopy
机译:
通过扫描微波显微镜来解决陷阱引起的电荷
作者:
S. Hommel
;
N. Killat
;
T. Schweinboeck
;
A. Altes
;
F. Kreupl
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Capacitance;
Silicon;
Electron traps;
Semiconductor device measurement;
Semiconductor diodes;
Reliability;
Spatial resolution;
19.
DDR as KGD in 3D-IC M1 Short Failure Analysis
机译:
DDR为3D-IC M1短故障分析的KGD
作者:
D.X. Wang
;
H.Y. Chen
;
W.L. Zhang
;
S.H. Wang
;
P. Guo
;
Z. Lv
;
J.N. Cheng
;
W.H. Chen
;
X. Luo
;
X.R. Liu
;
R.M. Li
;
Box Liu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Substrates;
Integrated circuit interconnections;
Failure analysis;
Registers;
Conferences;
Routing;
Three-dimensional displays;
20.
The Development of Low-Temperature Atomic Layer Deposition of HfO2 for TEM Sample Preparation on Soft Photo-Resist Substrate
机译:
柔软光致抗蚀剂衬底上的HFO2低温原子层沉积的研制
作者:
Kang-Ping Peng
;
Ya-Chi Liu
;
I-Feng Lin
;
Chih-Chien Lin
;
Shu-Wei Huang
;
Chao-Cheng Ting
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Substrates;
Hafnium compounds;
Atomic layer deposition;
Photonic band gap;
Refractive index;
Plasma temperature;
21.
Performance Variability, Switching Mechanism, and Physical Model for Oxide Based Memristor and RRAM Device
机译:
基于氧化物函数和RRAM设备的性能变化,切换机制和物理模型
作者:
Xiaojuan Lian
;
Fei Gao
;
Xiang Wan
;
Jiafei Yao
;
Xiao Gong
;
Yufeng Guo
;
Yi Tong
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Memristors;
Hafnium compounds;
Ions;
Performance evaluation;
Optical switches;
Electrodes;
22.
Cost and Effective Way to Reduce Radiation Damage and Enhance Image Contrast of Beam Sensitive Materials in TEM
机译:
降低辐射损伤的成本和有效方法,增强TEM中光束敏感材料的图像对比
作者:
Ching-Chun Lin
;
Kim Hsu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Scattering;
Metals;
Current density;
Particle beams;
Carbon;
Acceleration;
23.
In-situ FIB PVC to Speed up Fault Isolation of Floating Metal-Insulator-Metal Capacitor Failure
机译:
原位FIB PVC加速浮动金属绝缘金属电容器故障的故障隔离
作者:
Lee Guan Siong
;
Li YunGui
;
Renee Liu Yong Qing
;
Sun WanRu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
MIM capacitors;
Ion beams;
Metals;
Failure analysis;
Inspection;
Circuit faults;
Layout;
24.
Case Study and Application on Failure Analysis for Power Device
机译:
电力装置故障分析案例研究及应用
作者:
He Sheng-Zong
;
Wang You-Liang
;
Peng Ze-Ya
;
Zhang Yin
;
Chen Jin-Tao
;
Zhu Bin-Rue
;
Jiang Jian-Feng
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Failure analysis;
Reliability;
Heating systems;
Multichip modules;
Bonding;
Power semiconductor devices;
25.
Fault Isolation of Die-to-Die Communication Error Failure
机译:
芯片到芯片通信错误故障的故障隔离
作者:
Song Jinrong
;
Tian Li
;
Ren Jun
;
Di Hairong
;
Yang Jianli
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Wires;
Semiconductor device measurement;
Failure analysis;
Current measurement;
Force measurement;
Voltage measurement;
Chemicals;
26.
A Novel Solution for Efficient in Situ TEM Cross-Section and Plan-View Analyses with An Advanced Sample Preparation Scheme
机译:
具有高级样品制备方案的新型效率的效率效率的解决方案和平面图分析
作者:
Kang-Ping Peng
;
Kim Hsu
;
Finn Ger
;
Tsung-Chang Tsai
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Inspection;
Failure analysis;
Metals;
Milling;
Tools;
Surface treatment;
Semiconductor device measurement;
27.
Research on Failure Mechanism of Chip Welding Voids for Power Semiconductor Devices
机译:
功率半导体器件芯片焊接空隙的故障机理研究
作者:
Youliang Wang
;
Zeya Peng
;
Shengzong He
;
Binruo Zhu
;
Yin Zhang
;
Jintao Chen
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Welding;
Reliability;
Power semiconductor devices;
Failure analysis;
Acoustics;
Thermal stresses;
Packaging;
28.
A Novel Electrical Evaluation Approach for Inhomogeneous Current Distribution in Parallel-Connected IGBT Modules
机译:
并联IGBT模块中非均匀电流分布的新型电气评价方法
作者:
Hongyuan Su
;
Lulu Wang
;
Fazhan Zhao
;
Lixin Wang
;
Jiajun Luo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Insulated gate bipolar transistors;
Nonhomogeneous media;
Current distribution;
Junctions;
Temperature measurement;
Temperature distribution;
29.
Can We Use EDS to Determine Fluorine Contamination Level on A Normal Al Bondpad?
机译:
我们可以使用EDS在正常的Al Bondpad上确定氟污染水平吗?
作者:
Hua Younan
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Surface contamination;
Surface cleaning;
Monitoring;
Corrosion;
Fluorine;
Spectroscopy;
30.
Integrating EOP/EOFM as a Complimentary Localization Technique for Open Via/Contact
机译:
将EOP / EOFM集成为普通通孔/联系人的互补本地化技术
作者:
NUTTHAPON Jandee
;
DAMRONG Korbsrisawat
;
FERDIE Paulino
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Transistors;
Optical switches;
Logic gates;
Inverters;
Switching circuits;
Probes;
31.
In-Situ Delayering in Atomic Force Microscope for Sub-20nm Technology Devices
机译:
原子能显微镜的原位延迟用于子20NM技术装置
作者:
Matthew Yap
;
Teo Chea Wei
;
Vinod Narang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Milling;
Probes;
Force;
Diamond;
Atomic force microscopy;
Crystals;
32.
New HTDR Phenomenon Study for 2Xnm NAND Flash Cycling Interval Time Effect
机译:
新的HTDR现象为2xnm NAND闪蒸循环间隔时间效应研究
作者:
Huang Chia-Sheng
;
Ryoichi Ogino
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Flash memories;
Integrated circuits;
Tunneling;
Reliability;
Correlation;
Temperature distribution;
Degradation;
33.
Improved Phase Data Acquisition for Thermal Emissions Analysis
机译:
改进的热排放分析的相位数据采集
作者:
Wen Oiu
;
Bernice Zee
;
Brian Lai
;
Jim Vickers
;
David Tien
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Phase measurement;
Flip-chip devices;
Standards;
Failure analysis;
Semiconductor device measurement;
Three-dimensional displays;
Time measurement;
34.
Sample Preparation on Backside Mechanical Decapsulation Methodology for Effective Failure Analysis on Non-Exposed Die Pad Package
机译:
背面机械解敷在非曝光模具垫包装有效故障分析的样品制备
作者:
Ong Pei Hoon
;
Ng Kiong Kay
;
Gwee Hoon Yen
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Copper;
Chemicals;
Etching;
Optical imaging;
Failure analysis;
Dies;
Lead compounds;
35.
A New Method in Creating Carrier Package for Repackage
机译:
一种创建Repackage的运营商包的新方法
作者:
Homg-Chang Liu
;
Chun-Hsiung Chung
;
Shou-Ming Huang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Compounds;
Lead;
Laser ablation;
Silicon;
Silver;
Coatings;
Bonding;
36.
Case Study for Backside Sample Preparation in Copper Based Dummy Package
机译:
基于铜的虚拟包装中背面样品制备的案例研究
作者:
Hao-Ting Yu
;
Horng-Chang Liu
;
Chao-Chin Huang
;
Shou-Ming Huang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Throughput;
Silicon;
Copper;
Heating systems;
Substrates;
Compounds;
Wires;
37.
Laser Assisted Device Alteration, Efficient Application for Soft Failure Localization on Advanced Node
机译:
激光辅助设备更改,高效应用在高级节点上的软故障本地化
作者:
Kuang Yuan Chao
;
Jeng Hung Pan
;
Hsin Hung Chou
;
Shih Yuan Liu Chong
;
James CC Chang
;
Jian Chang Lin
;
Chee Hong
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Tools;
Pins;
Photoconductivity;
Free electron lasers;
Nanoscale devices;
Debugging;
38.
Plan-View to Cross-Section Conversion Work-Flow for Defect Analysis
机译:
平面图对缺陷分析的横截面转换工作流程
作者:
Zdenek Kral
;
Trevan Landin
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Ion beams;
Imaging;
Carbon;
Platinum;
Three-dimensional displays;
Image resolution;
39.
Improved Delayering Method for SOI Wafer Processing
机译:
改进SOI晶片处理的延迟方法
作者:
Handie Ahmataku
;
Shahrol Mohamaddan
;
Mahshuri Yusuf
;
Aidil Azli Alias
;
Kuryati Kipli
;
Norhayati Soin
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Silicon;
Logic gates;
Etching;
Lapping;
Surface cleaning;
Silicon-on-insulator;
40.
Is Hardware Security Prepared for Unexpected Discoveries?
机译:
硬件安全是否为意想不到的发现准备了?
作者:
Sergei Skorobogatov
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Security;
Hardware;
Microcontrollers;
Data mining;
Random access memory;
Batteries;
EPROM;
41.
Opportunities and Challenges of Resistive RAM for Neuromorphic Applications
机译:
用于神经族型应用的电阻RAM的机遇与挑战
作者:
R. Degraeve
;
A. Mallik
;
D. Garbin
;
J. Doevenspeck
;
A. Fantini
;
D. Rodopoulos
;
Ph. Roussel
;
B. Govoreanu
;
P. Hendrickx
;
L. Di Piazza
;
J. Stuijt
;
S. Schaafsma
;
P. Debacker
;
G. Donadio
;
H. Hody
;
L. Goux
;
G. S. Kar
;
A. Furnemont
;
A. Mocut
;
D. Verkest
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Neuromorphics;
Immune system;
Resistive RAM;
Resistance;
Hardware;
42.
Evaluation of the Thermal Properties for the Design of the Semiconductor Device
机译:
评估半导体器件设计的热性能
作者:
Ryo Endoh
;
Hideki Hashimoto
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Thermal conductivity;
Heating systems;
Temperature measurement;
Conductivity;
Thermal resistance;
Electrical resistance measurement;
Thermal analysis;
43.
Problems of and Solutions for Coating Techniques for TEM Sample Preparation on Ultra Low-k Dielectric Devices after Progressive-FIB Cross-section Analysis
机译:
渐进式跨截面分析后超低k电介质器件上TEM样品制备涂层技术的问题及解决方案
作者:
Yanlin Pan
;
Yuzhe Zhao
;
Pik Kee Tan
;
Zhihong Mai
;
Fransiscus RIVAl
;
Jeffrey Lam
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Coatings;
Dielectrics;
Insulators;
Films;
Silicon;
Milling;
Substrates;
44.
Optimization and Application of Acoustic Imaging for Defect Detection in Stack Die Packages
机译:
堆叠芯片缺陷检测声学成像的优化与应用
作者:
Z.Y. Oh
;
F.J. Foo
;
B. Zee
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Transducers;
Image resolution;
Logic gates;
Signal resolution;
Silicon;
Acoustics;
Pins;
45.
Characterization of Dielectric Breakdown and Lifetime Analysis for Silicon Nitride Metal-Insulator-Metal Capacitors under Electrostatic Discharge Stresses
机译:
静电放电应力下氮化硅金属 - 绝缘金属电容器介电击穿和寿命分析的表征
作者:
Hang Li
;
Hobie Yun
;
Wei Liang
;
Aihua Dong
;
Meng Miao
;
Kalpathy B. Sundaram
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Stress;
Silicon compounds;
Capacitors;
Electrostatic discharges;
Temperature measurement;
46.
Application to a Failure Analysis of Ultrasonic Beam Induced Resistance Change (SOBIRCH)
机译:
超声波束诱导电阻变化失败分析的应用(Sobirch)
作者:
Toru Matsumoto
;
Y oshihiro Ito
;
Shigeru Eura
;
Naohiro Hozumi
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Acoustics;
Transducers;
Reflection;
Frequency modulation;
Resins;
Ultrasonic imaging;
Laser beams;
47.
A Simple Method of Adjusting Trigger Voltage of HBT Device for ESD Protection
机译:
调整HBT器件触发电压以进行ESD保护的简单方法
作者:
Liu Jizhi
;
Zhang Qunhao
;
Yang Kai
;
Zeng Yaohui
;
Liu Zhiwei
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Heterojunction bipolar transistors;
Junctions;
Electrostatic discharges;
Silicon germanium;
BiCMOS integrated circuits;
Current density;
Impact ionization;
48.
Failure Analysis of Multilayer-Metal-Packaged Power Devices for Abnormal Thermal Response
机译:
异常热响应的多层金属包装功率装置的失效分析
作者:
Yulong Zhang
;
Lulu Wang
;
Bo Gao
;
Lixin Wang
;
Jiajun Luo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Thermal resistance;
Thermal analysis;
Heating systems;
Junctions;
Thermal conductivity;
Temperature;
49.
Study of the Cluster Ion for Gate Oxide Nitrogen Measurement by TOF-SIMS
机译:
TOF-SIMS的栅极氧化氮测量簇离子研究
作者:
Han Wei Teo
;
Yun Wang
;
Zhi Qiang Mo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Tools;
Nitrogen;
Silicon;
Ions;
Logic gates;
Semiconductor device measurement;
Preventive maintenance;
50.
Evaluation of Gallium Phosphide Substrate for Solid Immersion Lens
机译:
基于固体浸渍透镜的磷化镓基材的评价
作者:
Ikuo Arata
;
Masanori Kobayashi
;
Shunsuke Matsuda
;
Hirotoshi Terada
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Substrates;
Optical refraction;
Optical variables control;
Optical reflection;
Optical imaging;
Refractive index;
Optical diffraction;
51.
A Study for the Effectiveness of Wire Bond Process Parameters on AI-Cu Intermetallic Compound Distributions and the Correlation between Bonded Ball Adhesions and IMC Coverage
机译:
粘合工艺参数对AI-Cu金属间化合物分布的有效性及粘结球粘连与IMC覆盖的相关性研究
作者:
Ying Sian Chen
;
Ming Tsung Lee
;
Nicolas Liu
;
Kevin Liu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Wires;
Force;
Bonding;
Analysis of variance;
Legged locomotion;
Correlation;
Tools;
52.
The Application of Advanced Nano-Techniques in Failure Analysis for Different Failure Mechanism
机译:
高级纳米技术在不同故障机制失效分析中的应用
作者:
Li Tian
;
Kuibo Lan
;
Binghai Liu
;
Jinglogn Li
;
Yi Che
;
Gaojie Wen
;
Jinrong Song
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Layout;
Failure analysis;
Metals;
Semiconductor device measurement;
Nanoscale devices;
Imaging;
Computer aided software engineering;
53.
Passive Voltage Contrast Investigation of Metal/Via Stack Connecting to Substrate
机译:
金属/通过堆叠连接到基板的被动电压对比度研究
作者:
Yi Qianz Shen
;
Tee Irene
;
Jie Zhu
;
Zhi Qianz Mo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Acceleration;
Ion beams;
Metals;
Junctions;
Substrates;
Scanning electron microscopy;
Ions;
54.
A Demonstration on the Effectiveness of Wafer-level Thermal Microscopy as A Complementary Tool to Photon Emission Microscopy Using MBIST Failure Debug
机译:
使用MBist失效调试的晶片级热显微镜作为光子发射显微镜互补工具的有效性的演示
作者:
BL Yeoh
;
SH Goh
;
MH Thor
;
Hu Hao
;
Alan Tan
;
YH Chan
;
Zhao Lin
;
SP Neo
;
Jeffrey Lam
;
CM Chua
;
SH Tan
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Microscopy;
Thermal analysis;
Metals;
Random access memory;
Photonics;
Layout;
Bridge circuits;
55.
Novel Techniques of FIB Edit on VDD Routing in Internal Circuit for IDDQ Leakage Failure Analysis
机译:
用于IDDQ泄漏故障分析的内部电路VDD路由对FIB编辑的新颖技术
作者:
Akeel Nazakat
;
Li Yungui
;
Renee Liu
;
Vincent Chew
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Logic gates;
Layout;
Scanning electron microscopy;
Routing;
Failure analysis;
Ion beams;
Contacts;
56.
Glancing Angle FIB De-layering for Embedded Defect and PVC Fault Isolation Analysis
机译:
用于嵌入式缺陷和PVC故障隔离分析的闪烁角纤维解层
作者:
Yi Qiang Shen
;
Ye Chen
;
Kok Wah Lee
;
Jie Zhu
;
Zhi Qiang Mo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Milling;
Ion beams;
Laser ablation;
Inspection;
Surface treatment;
Scanning electron microscopy;
Chemicals;
57.
An Electrical Failure Analysis (EFA) Flow to Quantitatively Identify Invisible Defect on Individual Transistor: Using the Characterization of Random Dopant Fluctuation (RDF) as an Example
机译:
电气故障分析(EFA)流动以定量识别单个晶体管上的无形缺陷:使用随机掺杂剂波动(RDF)的表征作为示例
作者:
J.H. Lee
;
Y.M. Shcu
;
C.C. Wu
;
Y.M. Liu
;
Y.C. Chou
;
S.C. Chin
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Resource description framework;
Voltage measurement;
SPICE;
Doping;
Electric variables;
FinFETs;
58.
Sample Preparation Methodology for SIMS Analysis on Polar Pattern Failure
机译:
SIMS分析对极性图案故障的样品制备方法
作者:
Li Hong Li
;
Poh Chuan Ang
;
Han Wei Teo
;
Sharon Lee
;
Karmila Binte Abdullah
;
Zhi Qiang Mo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Etching;
Polyimides;
Optical imaging;
Chemicals;
Contact resistance;
Ions;
Microscopy;
59.
Ultra-thin Bulk Silicon Thinning for Visible Light Probing with High Numerical Aperture Solid Immersion Lens Laser Imaging
机译:
用于可见光探测的超薄散装硅薄,具有高数字孔径固体浸没镜头激光成像
作者:
Teo Wee Siang
;
Samuel Wei
;
Chris Richardson
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Milling;
Silicon;
Tools;
Testing;
Solids;
Lenses;
Imaging;
60.
Achieving Simplified Biasing Conditions with Pin Reduction Approach to enhance Static Fault Localization Capability
机译:
通过引脚还原方法实现简化的偏置条件,以提高静态故障定位能力
作者:
SJ. Moon
;
A.C.T. Quah
;
D. Nagalingam
;
K.H. Yip
;
C.Q. Chen
;
Y.S. Tam
;
P.T. Ng
;
HP. Ng
;
G.B. Ang
;
J.C. Lam
;
Z.H. Mai
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Pins;
Probes;
Failure analysis;
Foundries;
Hardware;
Wires;
Integrated circuits;
61.
Failure Analysis Case Studies on Wafer Edge Failure due to Process Uniformity Issue
机译:
失败分析案例研究晶圆边缘故障引起的工艺均匀性问题
作者:
N.Y. Xu
;
H.P. Ng
;
G.B. Ang
;
C.Q. Chen
;
A. Teo
;
A. Jerome
;
Y.S Tam
;
Y. Li
;
Z.H. Mai
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Metals;
Foundries;
Tools;
Etching;
Failure analysis;
Integrated circuits;
Pins;
62.
Distributed ESD Protection Network for Millimetre-Wave RF Applications
机译:
用于毫米波RF应用的分布式ESD保护网络
作者:
Aihua Dong
;
Hang Li
;
Kalpathy Sundaram
;
Linfeng He
;
Srivatsan Parthasarathy
;
Javier A. Salcedo
;
Jean-Jacques Hajjar
;
Sirui Luo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Electrostatic discharges;
Radio frequency;
Inductors;
Robustness;
Capacitance;
Performance evaluation;
Thyristors;
63.
New Method for Enhancing Photon Emission Measurements Similar to 2D-Tomography
机译:
用于增强与2D层析成像相似的光子发射测量的新方法
作者:
I. Vogt
;
A. Glowacki
;
U. Kerst
;
P. Perdu
;
T. Nakamura
;
C. Boit
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Photonics;
Tomography;
Temperature measurement;
Image resolution;
Optical imaging;
Ring oscillators;
Biomedical optical imaging;
64.
Copper Wire Bond Optimization for Power Devices
机译:
电力设备铜线键合优化
作者:
T. Pinili
;
R. Manolo
;
A. Denoyo
;
B. Yabut
;
D. Moore
;
B. Cowell
;
J. Jenson
;
K. Truong
;
J. Gambino
;
R. Watkins
;
W. Qin
;
G. Brizar
;
J. De Clerq
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Wires;
Bonding;
Gold;
Copper;
Intermetallic;
Compounds;
65.
Low Frequency Detector for Enhanced Laser Voltage Probing and Imaging Applications at Slow Speeds
机译:
低频检测器,用于增强激光电压探测和成像应用以缓慢的速度
作者:
Winson Lua
;
Venkat Krishnan Ravikumar
;
Angeline Phoa
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Detectors;
Signal to noise ratio;
Bandwidth;
Standards;
Logic gates;
Sensitivity;
Laser noise;
66.
High Voltage InGaN/GaN/AlGaN RTD Suitable for ESD Protection Applications of GaN/InGaN-based Devices and ICs Validated by Simulation Results
机译:
适用于基于GaN / Ingan的设备的ESD保护应用的高压Ingan / GaN / AlGaN RTD和通过仿真结果验证的IC
作者:
Zhang Haipeng
;
Geng Lu
;
Lin Mi
;
Zhang Zhonghai
;
Lü Weifeng
;
Wang Xiaoyuan
;
Wang Ying
;
Zhang Qiang
;
Bai Jianling
;
Wang Dejun
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Electrostatic discharges;
Satellite broadcasting;
Transportation;
Electric fields;
Integrated circuits;
Mathematical model;
High-voltage techniques;
67.
From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging
机译:
从PCB到BEOL:3D X射线显微镜用于高级半导体封装
作者:
Cheryl Hartfield
;
Christian Schmidt
;
Allen Gu
;
Stephen T. Kelly
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Three-dimensional displays;
X-ray imaging;
Spatial resolution;
Nanoscale devices;
Imaging;
Failure analysis;
68.
2.5D Package Modelling for Short Circuit Failure Analysis by High-Resolution Time-domain Reflectometry
机译:
2.5D高分辨率时域反射测量仪的短路故障分析封装型号
作者:
Yang Shang
;
Makoto Shinohara
;
Wen Qiu
;
Bernice Zee
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Integrated circuit modeling;
Reflection;
Loading;
Impedance;
Capacitance;
Time-domain analysis;
Load modeling;
69.
BEOL Reliability for More- Than-Moore Devices
机译:
BEOL可靠性对更多比摩尔设备的可靠性
作者:
Jeff Gambino
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Stress;
Resistors;
Reliability;
Resistance;
Metals;
Qualifications;
Wires;
70.
Application of Si Plasmon Imaging in Semiconductor Failure Analysis
机译:
Si等离子体成像在半导体故障分析中的应用
作者:
Yi Qiang Shen
;
Krishnan Y Ogaspari
;
I Chui Lam Tay
;
Jie Zhu
;
Zhi Qiang Mo
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Silicon;
Plasmons;
Imaging;
Substrates;
Logic gates;
Image resolution;
Energy loss;
71.
Complex Random Telegraph Noise (RTN): What Do We Understand?
机译:
复杂的随机电报噪声(RTN):我们理解什么?
作者:
Runsheng Wang
;
Shaofeng Guo
;
Zexuan Zhang
;
Jibin Zou
;
Dongyuan Mao
;
Ru Huang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Switches;
Couplings;
Logic gates;
Dielectrics;
Semiconductor device modeling;
Nanoscale devices;
MOSFET;
72.
Failure Analysis Techniques for 3D Packages
机译:
3D包的故障分析技术
作者:
F. Altmann
;
S. Brand
;
M. Petzold
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Three-dimensional displays;
Failure analysis;
Frequency measurement;
Microscopy;
Acoustics;
Phase measurement;
73.
Self-heating induced Variability and Reliability in Nanosheet-FETs Based SRAM
机译:
基于SRAM的纳米片 - FET的自加热诱导变异性和可靠性
作者:
Wangyong Chen
;
Linlin Cai
;
Kunliang Wang
;
Xing Zhang
;
Xiaoyan Liu
;
Gang Du
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Human computer interaction;
Integrated circuit reliability;
Integrated circuit modeling;
Degradation;
Random access memory;
Stress;
74.
Resolving Failures with Invalid Emission Site Through Bench Tests Results Evaluation with in-depth Circuit Analysis and Micro-probing
机译:
通过台式测试结果评估与深入电路分析和微探测,解决与无效排放站点的故障。
作者:
Carlo M. Casabuena
;
Em Julius De La Cruz
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Failure analysis;
Microscopy;
Circuit analysis;
Photonics;
Circuit faults;
Registers;
Metals;
75.
Analysis Methods and Strategies of Analog and Mix Signal Circuits in Power IC
机译:
电力IC中模拟和混合信号电路的分析方法和策略
作者:
Gan Chye Siong Kenny
;
Hubert Beermann
;
Stephan Merzsch
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Metals;
Integrated circuits;
Circuit faults;
Plasma measurements;
Transistors;
Plasmas;
Etching;
76.
Study of Phase Shift of Lock-In Thermography and Its Application in 2.5D IC Package
机译:
锁定热成像相移及其在2.5D IC包装中的应用研究
作者:
Yu-Ting Lin
;
Brian Lai
;
Chun-Cheng Tsao
;
Yi-Sheng Lin
;
Yu-Hsiang Hsiao
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Three-dimensional displays;
Delays;
Solid modeling;
Heating systems;
Phase measurement;
Failure analysis;
Integrated circuits;
77.
Detection and Fault Isolation of Elevated Resistive Paths in Copper Pillar (CuP) Flip Chip Package Device
机译:
铜柱(杯子)倒装芯片封装装置升高电阻路径的检测和故障隔离
作者:
C. Ison
;
R. Spurrier
;
M. Somintac
;
R. Asuncion
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Stress;
Passivation;
Qualifications;
Flip-chip devices;
Pins;
Failure analysis;
78.
Elimination of the Hump Current of P-Channel Polycrystalline Silicon Thin-Film Transistor After Positive Bias Stress
机译:
在正偏压后消除P沟道多晶硅薄膜晶体管的驼峰电流
作者:
Yiran Wei
;
Dongli Zhang
;
Mingxiang Wang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Logic gates;
Thin film transistors;
Stress;
Degradation;
Silicon;
Temperature measurement;
79.
Detection and Characterization of Single Near-Interface Oxide Traps with the Charge Pumping Method
机译:
用电荷泵法检测和表征单近界面氧化物疏水膜
作者:
Toshiaki Tsuchiya
;
Masahiro Hori
;
Yukinori Ono
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Logic gates;
Electron traps;
Energy states;
Silicon;
Photonic band gap;
Current measurement;
Semiconductor device measurement;
80.
The OTP Data Retention Improvement on CESL and SAB Film Scheme
机译:
CESL和SAB胶片方案的OTP数据保留改进
作者:
B. A. Tsai
;
S. J. Chang
;
C. S.Ho
;
K. C. Chou
;
I. S. Wei
;
P. H. Tseng
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Nonvolatile memory;
Current distribution;
Sorting;
Programming;
SONOS devices;
Implants;
81.
Quantitative Evaluation of Carrier Distribution in Silicon Solar Cell Using Scanning Nonlinear Dielectric Microscopy
机译:
扫描非线性介电显微镜硅太阳能电池载体分布的定量评价
作者:
Kotaro Hirose
;
Katsuto Tanahashi
;
Hidetaka Takato
;
Yasuo Cho
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Photovoltaic cells;
Silicon;
Charge carrier density;
Standards;
Microscopy;
Capacitance;
Surface topography;
82.
Impact of Wire RC Based on High Voltage SCAN Failure Analysis in 10nm Process
机译:
基于高压扫描故障分析的电线RC对10NM过程的影响
作者:
Ghil-Geun Oh
;
Si-Jeong Kim
;
Kyeong-Ju Jin
;
Shin- Young Jung
;
Brandon Lee
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Clocks;
Metals;
Wires;
Lasers;
Delays;
High-voltage techniques;
Failure analysis;
83.
Investigation of Kirk-Effect Induced Hot-Carrier-Injection in High-Voltage Power Devices
机译:
高压电气设备中KIRK效应诱导热载体喷射的研究
作者:
Y-H. Huang
;
P. J. Liao
;
Y-H. Lee
;
M. J. Chen
;
T.Y. Ho
;
Lucy Chang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Stress;
Degradation;
Human computer interaction;
Logic gates;
Hot carriers;
Impact ionization;
Semiconductor process modeling;
84.
Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy
机译:
WLP中焊接接头的三维(3D)表征使用X射线显微镜
作者:
Jaewon Chang
;
Hyunjun Choi
;
Jinseok Kim
;
Sangkwon Park
;
Yoonkyeong Jo
;
Tae-Young Jeong
;
Myung Soo Yeo
;
Hanbyul Kang
;
Junekyun Park
;
Sangchul Shin
;
Sangwoo Pae
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Soldering;
Resistance;
Failure analysis;
Current density;
Stress;
Cathodes;
Three-dimensional displays;
85.
3D Defect Localization of Stacked Die Devices by Lock-in Thermography (LIT)
机译:
锁定热成像(点亮)3D叠层模具设备的3D缺陷定位
作者:
Yu Chi Wang
;
Ke-Ying Lin
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Pins;
Wires;
Substrates;
X-ray imaging;
Three-dimensional displays;
Circuit faults;
Phase measurement;
86.
Study of Biased Temperature Instabilities in LDMOST technologies
机译:
在LDSMOSE技术中的偏置温度稳定性研究
作者:
Guoqiao Tao
;
R. Koster
;
A. Romanescu
;
S. Theeuwen
;
R. van Dalen
;
H. Bosch
;
Tsung-Miau Wang
;
Shih-Yuan Chen
;
Yu-Fei Jhuang
;
Yung-Wen Cheng
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Logic gates;
Ions;
Stress;
Negative bias temperature instability;
Thermal variables control;
Metals;
Radio frequency;
87.
Electrical Characterization of FEOL Bridge Defects in Advanced Nanoscale Devices Using TCAD Simulations
机译:
使用TCAD模拟高级纳米尺度装置的Feol桥缺陷的电气特性
作者:
Teo Chea Wei
;
Vinod Narang
;
Aaron Thean
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Logic gates;
FinFETs;
Failure analysis;
Bridges;
Computational modeling;
Electric variables;
88.
Investigation on the Vibration Amplitude of Au Bonding Wire Under Mechanical Shock
机译:
机械冲击下Au键合线振动幅度的研究
作者:
Zhibin Wang
;
Chenming Xie
;
Changcheng Wang
;
Xu Wang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Wires;
Electric shock;
Vibrations;
Bonding;
Gold;
Strain;
89.
Study of the Long-Term Electrical Stability of InGaZnO 3-D Film-Profile-Engineered Inverters
机译:
InGazno 3-D膜型材型逆变器长期电稳定性研究
作者:
Chin-I Kuan
;
Horng-Chih Lin
;
Pei-Wen Li
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Inverters;
Thin film transistors;
Fabrication;
Degradation;
Hydrogen;
Threshold voltage;
Tin;
90.
Contaminant and Alcohol Induced Electrochemical Migration of Au Bond in ICs During Low Temperature Operation Test
机译:
低温操作试验期间,污染物和醇诱导Au键在IC中的电化学迁移
作者:
Xuanlong Chen
;
Lan Chen
;
Youliang Wang
;
Daojun Luo
;
Jintao Chen
;
Binruo Zhu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Ions;
Gold;
Methanol;
Electronic countermeasures;
Cathodes;
Failure analysis;
Chemicals;
91.
Spectral Gated Imaging of Dynamic Photon Emission in Mixed-Signal and Power Devices
机译:
混合信号和功率器件中动态光子发射的光谱门控成像
作者:
Zhongling Qian
;
Christof Brillert
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Photonics;
Logic gates;
Delays;
Gratings;
Stress;
Image intensifiers;
92.
Influence of Design Considerations on Hot Carrier Injection Degradation of STI-based LDMOS Transistors
机译:
设计注意事项对基于STI的热载流注射劣化的影响
作者:
A. F. M. Alimin
;
S. F. W. M. Hatta
;
N. Soin
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Degradation;
Stress;
Hot carriers;
Logic gates;
Transistors;
Reliability;
Impact ionization;
93.
Quantitative Imaging of MOS Interface Trap Distribution by Using Local Deep Level Transient Spectroscopy
机译:
采用局部深级瞬态光谱法测量MOS界面陷阱分布的定量成像
作者:
Norimichi Chinone
;
Yasuo Cho
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Capacitance;
Semiconductor device measurement;
Two dimensional displays;
Energy states;
Microscopy;
Filling;
94.
Characterization of Multilayered Ceramic Capacitors via Piezoelectric Force Microscopy
机译:
压电力显微镜的多层陶瓷电容器的表征
作者:
Gerald Pascual
;
Cathy Lee
;
John Paul Pineda
;
Byong Kim
;
Keibock Lee
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Force;
Atomic force microscopy;
Ceramics;
Capacitors;
Electric fields;
95.
Total Ionizing Dose Effects of 1 Mb RfO
2
-based Resistive-Random-Access-Memory
机译:
总电离剂量效应1 MB RFO
2 INF>基于电阻随机存取存储器
作者:
Jinshun Bi
;
Yuan Duan
;
Feng Zhang
;
Ming Liu
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Radiation effects;
Transistors;
Leakage currents;
Hafnium compounds;
Resistance;
Sensors;
Integrated circuit modeling;
96.
Case Study on Crosstalk Failure Analysis of Advanced Mixed-signal Devices
机译:
高级混合信号装置串扰故障分析的案例研究
作者:
Haus Zhang
;
Xiaocui Li
;
Ran Chen
;
Winter Wang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Crosstalk;
Metals;
Bridge circuits;
Layout;
Failure analysis;
Random access memory;
Microscopy;
97.
Study and application on thermal EOP (Electro Optical Probing) / EOFM (Electro Optical Frequency Mapping) technique
机译:
热EOP(电光探测)/ EOFM(电光频率映射)技术的研究与应用
作者:
Chi He
;
Haus Zhang
;
Jinrong Song
;
Power Tian
;
Winter Wang
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Optical imaging;
Optical reflection;
Optical sensors;
Integrated optics;
Thermal analysis;
MOS devices;
Optical switches;
98.
Uniformity of Multilayer Hexagonal Boron Nitride Dielectric Stacks Grown by Chemical Vapor Deposition on Platinum and Copper Substrates
机译:
通过化学气相沉积在铂和铜基材上生长的多层六边形氮化硼介电堆的均匀性
作者:
Fei Hui
;
Xianhu Liang
;
Wenjing Fang
;
Wei Sun Leong
;
Haozhe Wang
;
Hui Ying Yang
;
Yuanyuan Shi
;
Marco A. Villena
;
Jing Kong
;
Mario Lanza
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Substrates;
Boron;
Dielectrics;
Nonhomogeneous media;
Fluctuations;
Conductivity;
Chemical vapor deposition;
99.
Interfacial Adhesion Strength Characterization of SiCOH/TaN Stack by 4-Point-Bending
机译:
4点弯曲SICOH / TAN堆栈的界面粘附强度表征
作者:
Xintong Zhu
;
Xiaoxuan Li
;
Ramesh Rao Nistala
;
Zhi Qiang Mo
;
Meng Meng Chong
;
Xue Song Rao
;
Chim Seng Seet
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Adhesives;
Dielectrics;
Silicon;
Integrated circuits;
Plasmas;
Spectroscopy;
Substrates;
100.
Characterization of Bandgap Engineering on Operative Transistor Devices by Spectral Photon Emission
机译:
通过光谱光子发射对手术晶体管器件带隙工程的表征
作者:
A. Beyreuther
;
I. Vogt
;
T. Nakamura
;
G. G. Fischer
;
B. Motamedi
;
C. Boir
会议名称:
《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》
|
2018年
关键词:
Photonic band gap;
Silicon;
Heterojunction bipolar transistors;
P-n junctions;
FinFETs;
Photonics;
Germanium;
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