A New Method in Creating Carrier Package for Repackage

摘要

In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.