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IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

召开年：2020
召开地：Singapore(SG)
出版时间：-

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1.Failure analysis using LVP for tolerant design about BEOL parasitic effects in nanoscale technology

机译：利用LVP对纳米技术BEOL寄生效应进行耐受性设计的故障分析
- 作者：Jung-Tae Kim;Yong-Seop Kim;Moo-Jong Hong;Yun-Woo Lee;Eun-Chul Lee;Gab-Soo Han
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
2.Novel methodology for predictive interface reliability analysis in IC packages by a dual experimental and numerical approach

机译：通过双重实验和数值方法对IC包装预测界面可靠性分析的新方法
- 作者：Hertl M.;Weidmann D.;Chauffleur X.;Dubois G.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
3.Non-electrical-contact LSI failure analysis using non-bias laser terahertz emission microscope

机译：使用非偏置激光太赫兹发射显微镜的非电气接触LSI失效分析
- 作者：Nikawa Kiyoshi;Yamashita Masatsugu;Matsumoto Toru;Otani Chiko;Tonouchi Masayoshi;Midoh Yoshihiro;Miura Katsuyoshi;Nakamae Koji
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
4.Surface cleaning method for elimination of Cu-oxide layer formed on Cu film

机译：用于消除在Cu膜上形成的Cu-氧化物层的表面清洁方法
- 作者：Hyun-jin Ju;Yong-Hyuk Lee;Sang-Soo Nho;Eun-Hey Choi;Sa-Kyun Rha;Youn-Seoung Lee
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
5.Review on induced CDM-ESD test methodologies for flash memory device

机译：临界闪存设备诱导的CDM-ESD测试方法
- 作者：Law Che Seong;Yeoh Lai Seng;Edumban Kaneasan;Lee Meng Chuan;Steven Fan Choo Kean
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
6.Wire bonding, bumping assembly related failures improvements

机译：引线键合，凸起和组装相关的故障和改进
- 作者：Lim Y. K.;Yuan S.;Tan J. B.;Yeo A.;Hua Y. N.;Rao N. R.;Siah S. Y.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
7.The field modulation effect of fluoride plasma treatment on blocking characteristics of AlGaN/GaN HEMT

机译：氟化物等离子体处理对AlGaN / GaN HEMT阻断特性的现场调制效应
- 作者：Young shil Kim;O Gyun Seok;Min Woo Ha;Min Koo Han
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
8.Study of C4F8 gas for etch process in slow erase failure of flash memory devices

机译：闪存器件缓慢擦除蚀刻过程中C4F8气体的研究
- 作者：Sang il Hwang;Kim Yeong sil;Ki chae Yoon;Sang kwon Kim;Young sun Ko
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
9.Geometric-component modeling in charge-pumping technique

机译：电荷泵技术中的几何组件建模
- 作者：Djezzar B.;Tahi H.;Benabdelmoumen A.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
10.Fault localization using infra-red lock-in thermography for SOI-based advanced microprocessors

机译：用于基于SOI的高级微处理器的红外线锁定热成像故障定位
- 作者：Tan M.C.;Tay M.Y.;Qiu W.;Phoa S.L.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
11.Photographic distinction of defects in multicrystalline Si by spectroscopic electroluminescence

机译：光谱电致发光荧光缺陷的摄影区分
- 作者：Kudo Kohei;Suzuki Hiroyoshi;Matsumoto Toru;Sugimura Emi;Tani Ayumi;Tsujii Shinichiro;Takamoto Soichiro;Fuyuki Takashi
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
12.Unipolar resistive switching and retention of RTA-treated zinc oxide (ZnO) resistive RAM

机译：UniPolar电阻切换和RTA处理的氧化锌（ZnO）电阻RAM的保持性
- 作者：Cheng-Li Lin;Shu-Ching Wu;Chi-Chang Tang;Yi-Hsiu Lai;Syuan-Ren Yang;Shich-Chuan Wu
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
- RTA treatment;
- Resistive RAM (RRAM);
- Resistive switching;
- Switching cycle;
- Zinc oxide (ZnO);
13.Mechanical property characterization of cu-Sn-In intermetallic thin films using microcantilevers

机译：Cu-Sn-用微电子金属间薄膜的力学性能特征
- 作者：Sasangka W.A.;Gan C.L.;Thompson C.V.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
14.Back-side De-processing using CMP for bulk silicon 40-nm graphics processors

机译：使用CMP为散装硅40-NM图形处理器的背面解扫处理
- 作者：Wei M.S.;Teo C.W.;Chong H.B.;Lim S.H.;Narang V.;Chin J.M.;Ong M.C.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
15.Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs

机译：3D-ICS的金属金属的非破坏性力学表征
- 作者：Made Riko I;Gan Chee Lip
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
16.Impact of line spacing on microstructure and texture in damascene Cu interconnects

机译：线间距对大胆Cu互连微观结构和纹理的影响
- 作者：Guo F.;Chen L.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
17.Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

机译：X射线MICROCT在非破坏性故障分析和包装施工表征中的应用
- 作者：Cason Morgan;Estrada Raleigh
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
18.Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion

机译：由于金属间氧化和腐蚀，金和铜球键失败
- 作者：Breach C. D.;Hun Shen Ng;Lee Teck Kheng;Holliday R.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
19.3D LSI and reliability

机译：3D LSI和可靠性
- 作者：Koyanagi Mitsumasa
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
20.Experimental insights on the degradation and recovery of pMOSFET under non-uniform NBTI stresses

机译：非均匀NBTI应力下PMOSFET降解和回收的实验见解
- 作者：Yandong He;Ganggang Zhang
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
21.3D current path in stacked devices: Metrics and challenges

机译：3D堆叠设备中的电流路径：指标和挑战
- 作者：Kor H.B.;Infante F.;Perdu P.;Gan C.L.;Lewis D.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
22.Characterization and modeling of NBTI stress, recovery, material dependence and AC degradation using R-D framework

机译：NBTI应力，恢复，材料依赖性和AC利用R-D框架的表征及建模
- 作者：Mahapatra S.;Islam A. E.;Deora S.;Maheta V. D.;Joshi K.;Alam M A.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
23.Surface roughness metrology study on flip-chip substrate

机译：倒装芯片衬底的表面粗糙度计量研究
- 作者：Ong M.C.;Lim S.H.;Zhao X.L.;Chin J.M.;Wang S.R.;Sun W.X.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
24.Phase transformation of programmed NiSi electrical fuse: Diffusion, agglomeration and thermal stability

机译：编程的NISI电气保险丝的相位变换：扩散，聚集和热稳定性
- 作者：Park Jongwoo;Kang Han-Byul;Gun-Rae Kim;Min Kim
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
- Ni agglomeration;
- TEM;
- eFuse;
- electromigration;
- phase transformation;
- resistance;
25.Advanced failure analysis of memory devices

机译：内存设备的高级故障分析
- 作者：Li Susan X.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
26.Landscape for semiconductor analysis: Issues and challenges

机译：半导体分析景观：问题和挑战
- 作者：Kim Kinam;Park Gyeong-Su
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
27.Interconnect processes and reliability for RF technology

机译：互连的RF技术的过程和可靠性
- 作者：Gambino J.P.;Anderson F.;Cooney E.;He J.;Bolam R.;Webb B.C.;Cabral C.;Shaw T.;Vanslette D.
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2011年
28.SIMS Analysis Methodology to Determine Sc Diffusion in Silicon Oxide

机译：SIMS分析方法确定SC扩散在氧化硅中
- 作者：Yun Wang;Kian Kok Ong;Han Wei Teo;Li Hong Li;Poh Chuan Ang;Zhi Qiang Mo
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2018年
- Silicon;
- Films;
- Ions;
- Sputtering;
- Annealing;
- Rough surfaces;
- Surface roughness;
29.Seebeck Effect Imaging to Improve Short Defect Localization

机译：Seebeck效果成像以提高短缺缺陷定位
- 作者：Ming Guo;JingLong Li
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2018年
- Metals;
- Thermoelectricity;
- Imaging;
- Laser beams;
- Silicon;
- Lenses;
- Semiconductor lasers;
30.Digital Block Defect Localization using in-depth Circuit Analysis for Electrical Verification and Fault Isolation Correlation

机译：数字块使用深入电路分析进行电气验证和故障隔离相关的数字块缺陷定位
- 作者：Ronald Apolinaria;David Joseph Rimbon;Em Julius De La Cruz
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2018年
- Metals;
- Circuit faults;
- Failure analysis;
- Circuit analysis;
- Multiplexing;
- Integrated circuits;
- Lenses;
31.From Automotive to Space qualification: Overlaps, gaps and possible convergence

机译：从汽车到空间资格：重叠，差距和可能的收敛
- 作者：R. Enrici Vaion;M. Medda;A. Mancaleoni;G. Mura
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2018年
- Reliability;
- Qualifications;
- Stress;
- Automotive engineering;
- Standards;
- Integrated circuits;
- Failure analysis;
32.Proposal of local deep level transient spectroscopy using super-higher-order scanning nonlinear dielectric microscopy and 2-dimensional imaging of trap distribution in SiO2/SiC interface

机译：使用超高级扫描非线性介电显微镜和SIC界面中陷阱分布的二维成像的局部深度瞬态透射光谱的提议
- 作者：Norimichi Chinone;Ryoji Kosugi;Yasunori Tanaka;Shinsuke Harada;Hajime Okumura;Yasuo Cho
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
33.Advanced fault isolation techniques for 3D packaging

机译：3D包装的先进故障隔离技术
- 作者：Y. Chen;P. Lai;Q. Shi
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
34.Determining the root cause of a neighbouring-cell-interaction-induced latch-up failure event

机译：确定相邻小区交互引起的闩锁失败事件的根本原因
- 作者：H. W. Ho;Wendy W. Y. Lau;S. H. Goh;B. L. Yeoh;M. Seungje;R. He;Jeffrey Lam
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
35.IGBT collector-emitter failure mechanism

机译：IGBT收集器 - 发射器故障机制
- 作者：S. S. Lee;W. K. Tham;C. K. Ang
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
36.Recent advances of RTN technique towards the understanding of the gate dielectric reliability in trigate FinFETs

机译：rtn技术对理解Trige Finfet中介电可靠性的研究
- 作者：Steve S. Chung
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Logic gates;
- MOSFET circuits;
- Stress;
- Dielectrics;
- Two dimensional displays;
- Charge carrier processes;
- Current measurement;
37.Study on copper diffusion barrier materials by Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)

机译：飞行时间二次离子质谱法（TOF-SIMS）铜扩散阻挡材料研究
- 作者：Yun Wang;Han Wei Teo;Kian Kok Ong;Zhi Qiang Mo;Si Ping Zhao
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
38.Failure analysis on MEMS resonator device in wafer fabrication

机译：晶圆制造中MEMS谐振器装置的故障分析
- 作者：H. P. Ng;N. Y. Xu;Angela Teo;G. B. Ang;A. C. T. Quah;Dayanand;C. Q. Chen;Z. H. Mai;J. Lam
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
39.Optimized trapezoid FIB sample preparation method for dielectric nanocharacterization

机译：优化梯形FIB样品制备方法，用于介电纳米特征
- 作者：C. Guedj;E. Martinez
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Milling;
- Strain;
- Dielectrics;
- Ion beams;
- Microscopy;
- Energy loss;
- Electron traps;
40.Challenges and improvement of reliability in advanced wafer level packaging technology

机译：先进晶圆级包装技术的挑战与可靠性的挑战
- 作者：Seung Wook Yoon
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
41.Failure analysis on corrosion induced Cu-Al bond failures

机译：腐蚀诱导Cu-Al债券失败的失败分析
- 作者：Xuanlong Chen;Liyuan Liu
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Corrosion;
- Failure analysis;
- Ions;
- Bonding;
- Chemicals;
- Anodes;
- Wires;
42.Failure analysis on IDDQ negative current issue

机译：IDDQ负电流问题的失败分析
- 作者：Ismail Hashim
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
43.Nanoscale homogeneity and degradation process of two dimensional atomically thin hexagonal boron nitride dielectric stacks

机译：二维原子薄六边形氮化硼介质叠层的纳米级均匀性和降解过程
- 作者：Yanfeng Ji;Chengbin Pan;Fei Hui;Yuanyuan Shi;Lanlan Jiang;Na Xiao;Enric Grustan-Gutierrez;Luca Larcher;Mario Lanza
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Dielectrics;
- Dielectric breakdown;
- Hafnium compounds;
- Films;
- Two dimensional displays;
- Graphene;
- Electrodes;
44.Fast backside fault isolation for parametric issue in Ball Grid Array (BGA) packages by selective area thinning

机译：通过选择区域变薄，球网格阵列（BGA）套件中参数问题的快速背面断层隔离
- 作者：Foo Loke Sheng;Lee Weng Hong;Wan Abdul Rahman Othman
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Circuit faults;
- Pins;
- Failure analysis;
- Substrates;
- Scanning electron microscopy;
- Performance evaluation;
45.Surface elemental quantification of Au-Pd pre-plated leadframe by means of X-ray Photoelectron Spectroscopy

机译：借助于X射线光电子谱的Au-Pd预镀引线框架的表面元素数量
- 作者：Y. Y. Kee;S. R. Esa;B. A. Rahim;W. A. W. Ismail
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Lead;
- Energy resolution;
- Gold;
- Deconvolution;
- Metrology;
- Spectroscopy;
- Palladium;
46.Localization techniques for finding embedded defects in stacked die package

机译：用于在堆叠芯片包装中找到嵌入式缺陷的本地化技术
- 作者：Lai-Seng Yeoh;Kok-Cheng Chong;Susan Li
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
47.Strategies to determine failure mechanism of devices that recovered during analysis

机译：确定分析期间恢复的设备故障机制的策略
- 作者：L. T. Tan;C. H. Liew;Akeel Nazakat;Jethro Tan;W.F. Kho
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Layout;
- Photonics;
- Probes;
- Microscopy;
- Object recognition;
- Circuit faults;
48.Sleep mode IDDQ failure analysis in 28nm mobile application

机译：28nm移动应用中的睡眠模式IDDQ失败分析
- 作者：Gang Qian;Parker Miao;SoonFatt Ng
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Implants;
- Integrated circuits;
- SRAM cells;
- Layout;
- Failure analysis;
- Mobile applications;
49.Time-of-Flight Secondary Ion Mass Spectrometry profiling for arsenic in silicon dioxide matrix

机译：二氧化硅基质中砷的飞行时间二次离子质谱分析
- 作者：Han Wei Teo;Yun Wang;Zhi Qiang Mo;Si Ping Zhao
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Arsenic;
- Silicon;
- Silicon compounds;
- Decision support systems;
- Failure analysis;
- Integrated circuits;
- Sensitivity;
50.Detection of solder bump marginal contact resistance degradation using 4-point resistance measurement method

机译：使用4分电阻测量方法检测焊料凸块边缘接触电阻劣化
- 作者：Moon Seungje;D. Nagalingam;A. C. T. Quah;G. B. Ang;H. P. Ng;Angela Teo;N. Y. Xu;Z. H. Mai;J. Lam
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
- Resistance;
- Metals;
- Voltage control;
- Regulators;
51.Combinational logic analysis case studies using laser voltage probing

机译：组合逻辑分析案例研究采用激光电压探测
- 作者：Winson Lua;Gopinath Ranganathan;Venkat Krishnan Ravikumar;Angeline Phoa
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
52.From IC debug to hardware security risk: The power of backside access and optical interaction

机译：从IC调试到硬件安全风险：背面访问和光学交互的功率
- 作者：C. Boit;S. Tajik;P. Scholz;E. Amini;A. Beyreuther;H. Lohrke;J. P. Seifert
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Integrated circuits;
- Integrated optics;
- Frequency measurement;
- Optical imaging;
- Security;
- Silicon;
- P-n junctions;
53.Electrostatic Discharge (ESD) and Electrical Overstress (EOS) — The state of the art for methods of failure analysis, and testing in components and systems

机译：静电放电（ESD）和电气过客（EOS） - 用于故障分析方法的技术技术，以及组件和系统中的测试
- 作者：Steven H. Voldman
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
54.DdProber: Self-sensing AFM type Nano-prober

机译：DDPROB：自感AFM型纳米探针
- 作者：R. Shioda;Y. Amano;K. Ikezawa;Y. Nakamura;T. Kasahara
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
55.Failure analysis of power integrated modules and its challenges

机译：电力集成模块的故障分析及其挑战
- 作者：E.J. De La Cruz;N. T. Yusof;W. Y. Wong;N. I. Mohd Arifen
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
56.Fault isolation of die level crystal defect failure mechanism through OBIRCH analysis and micro-probing

机译：模液晶体缺陷失效机制的故障隔离通过obirch分析和微探测
- 作者：N. S. Lee;F. K. Yong
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Transistors;
- Substrates;
- Current measurement;
- Crystals;
- Layout;
- Microscopy;
57.Experimental techniques on the understanding of the charge loss in a SONOS nitride-storage nonvolatile memory

机译：关于桑索氮化物储存非易失性记忆中电荷损失的实验技术
- 作者：E. R. Hsieh;H. T. Wang;Steve S. Chung;Wayne Chang;S. D. Wang;C. H. Chen
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Logic gates;
- SONOS devices;
- Programming;
- Current measurement;
- Electron traps;
- Loss measurement;
58.Auger method to characterize metal oxides on titanium tungsten barrier layer for copper pad

机译：螺旋辊在铜垫上表征金属氧化物的螺旋辊的方法
- 作者：Wan Tatt Wai;Yong Foo Khong;Zakaria Nurhanani;Faiss Simon
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
59.Combining current imaging, EBIC/EBAC, and electrical probing for fast and reliable in situ electrical fault isolation

机译：结合电流成像，EBIC / EBAC和电气探测，以便快速可靠地实现原位电阻隔离
- 作者：Stephan Kleindiek;Klaus Schock;Andreas Rummel;Michael Zschomack;Pascal Limbecker;Andreas Meyer;Matthias Kemmler
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Scanning electron microscopy;
- Probes;
- Failure analysis;
- Electron beams;
- Circuit faults;
60.Exploration of electromigration and Joule heating effect associated with un-silicided N+ poly

机译：与Un-硅化N + Poly相关的电迁移和焦耳加热效果的探索
- 作者：X. F. Zhao;M. Zhang;W. T. Chien
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
61.Logic circuit analysis and TEM inspection of IDDQ logic leakage

机译：IDDQ逻辑泄漏的逻辑电路分析和TEM检查
- 作者：Ang Chung Keow;Yong Foo Khong
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
62.Addressing the sample preparation challenges in failure analysis of wafer level chip scale package mounted inside a customer camera module

机译：解决安装在客户摄像机模块内的晶圆级芯片秤包的故障分析中的样品制备挑战
- 作者：Jason H. Lagar;Rudolf A. Sia
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
63.Dynamic digital modulation thermal measurement for package fault isolation

机译：打包故障隔离的动态数字调制热测量
- 作者：Aparna Mohan;Wen Qiu;Bernice Zee;R. A. Falk;Tram Pham
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
64.Effect of thickness on microstructure and texture in Cu thin films for interconnects

机译：厚度对互连Cu薄膜微观结构和质地的影响
- 作者：L. Chen
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
- Three-dimensional displays;
65.Automotive customer returns tilted die resolution

机译：汽车客户返回倾斜的模具分辨率
- 作者：Andrew C. Sabate;Azhar Hamid;Dineshwaran Naidu Gunalan
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Erbium;
- Failure analysis;
- Integrated circuits;
- Decision support systems;
66.Simulation assisted uncovering and understanding of complex failures in 28nm microprocessor devices

机译：仿真辅助揭示和了解28nm微处理器设备中复杂故障的理解
- 作者：Dnyan Khatri;Vinod Narang;Mun Yee Ho;Komal Pandey;Ran Yu
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Transistors;
- Resistance;
- Failure analysis;
- Semiconductor process modeling;
- Contact resistance;
- Implants;
- Silicides;
67.Reliability and risk assessment from accelerated test result and field modeling: Delamination issue case study for automotive analog parts and sensors

机译：来自加速测试结果和现场建模的可靠性和风险评估：用于汽车模拟零件和传感器的分层问题案例研究
- 作者：Corinne Berges;Adeline Feybesse;Wan Abdul Rahman Othman
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
68.Decapsulation of copper wire devices with high Tg mold compound using microwave induced plasma

机译：使用微波诱导等离子体用高TG模具化合物的铜线装置的解膜
- 作者：J. Tang;J. Wang;T. H. Tan;M. Endo;K. M. Ng;L. C. Lee;C. I. M. Beenakker
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Wires;
- Copper;
- Etching;
- Silver;
- Compounds;
- Electromagnetic compatibility;
- Standards;
69.Improvement of top-down delayering techniques on advanced technology nodes

机译：高级技术节点上的自上而下延迟技术的改进
- 作者：Tomá? Hrn?í?;Huei Hao Yap;Efrat Moyal;Janet Teshima
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
- Milling;
70.Understanding testing for dynamic fault isolation of microprocessors

机译：了解微处理器动态故障隔离的测试
- 作者：Venkat Krishnan Ravikumar
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Circuit faults;
- Built-in self-test;
- Random access memory;
- Failure analysis;
- Discrete Fourier transforms;
- Integrated circuits;
- Microscopy;
71.Open/resistive defect localization using OBIRCH technique

机译：使用Obirch技术开放/电阻缺陷定位
- 作者：Song Jinrong;Fan Diwei;Wang Winter;Wen Gaojie;Tian Li;Qi Changyan
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Logic gates;
- Failure analysis;
- Resistance;
- Integrated circuits;
- Current measurement;
- Tin;
- Resistors;
72.FBGA 55nm SOC PLL failure analysis through OBIRCH

机译：FBGA 55nm SoC PLL通过obirch失效分析
- 作者：Lau Kok Heng;Liew Chiun Ning
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Phase locked loops;
- Logic gates;
- Integrated circuits;
- Failure analysis;
- Electrostatic discharges;
- Circuit faults;
- Wires;
73.Wear-out failure modes and mechanism analysis of self-ballasted LED lamps via after-sale service data

机译：售后服务数据通过售后LED灯磨损失效模式及机理分析
- 作者：Y. G. Yoon;J. P. Hyung;U. H. Jeong;S. I. Chan;J. S. Jang
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
- World Wide Web;
74.A method to simulate fluorine outgas and Al bond pad corrosion in wafer fab

机译：晶圆厂模拟氟籽棒和Al键焊盘腐蚀的方法
- 作者：Yanjing Yang;Xintong Zhu;Ramesh Rao Nistala;Siping Zhao;Jinsong Xu
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Erbium;
75.Dynamic NBTI simulation coupling with self-heating effect in SOI MOSFETs

机译：动态NBTI仿真耦合与SOI MOSFET中的自热效果
- 作者：Xiangbin Li;Chenyue Ma;Lining Zhang;Fu Sun;Xinnan Lin;Mansun Chan
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- CMOS technology;
- Integrated circuit modeling;
- Data models;
- Failure analysis;
- Stress;
- Analytical models;
76.Study on fab environment induced Al and Cu metal corrosion by TEM failure analysis

机译：TEM失效分析研究Fab环境诱导的Al和Cu金属腐蚀
- 作者：Binghai Liu;Zhihong Mai;Jeffrey Lam;Zhao Yuzhe;Tan Pik Kee
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Metals;
- Corrosion;
- Failure analysis;
- Diffraction;
- Surface morphology;
- Contamination;
- Iodine;
77.A review on degradation physics of high power LEDs in outdoor applications

机译：高功率LED在户外应用中的降解物理研究综述
- 作者：Cher MingTan;Preetpal Singh
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Light emitting diodes;
- Degradation;
- Moisture;
- Reliability;
- Failure analysis;
- Humidity;
- Stress;
78.BGA packaged IC sample preparing for electrical failure analysis

机译：BGA包装IC样品准备电气故障分析
- 作者：Quande Zhang;Yi Che;Jinglong Li;Binghai Liu
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
79.Performance of 7nm stress-engineered nFinFETs based on stressors consideration for different channel material

机译：基于对不同通道材料的压力考虑7nm应力工程的NFInfet的性能
- 作者：N. A. F. Othman;S. F. Wan Muhammad Hatta;N. Soin
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
80.Differential C-AFM system for semiconductor failure analysis

机译：用于半导体故障分析的差分C-AFM系统
- 作者：Xinhua Zheng;Yu Thi Han;Pei Hong Seah;Guan Siong Lee;Kheaw Chung Chng
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
81.Reliability and failure analysis of MEMS/NEMS switches

机译：MEMS / NEMS交换机的可靠性和故障分析
- 作者：Chengkuo Lee
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
- Silicon;
- Computer crime;
- Molecular beam epitaxial growth;
82.Automatic processing scheme for low laser invasiveness electro optical frequency mapping mode

机译：低激光侵入电光频率映射模式的自动处理方案
- 作者：A. Boscaro;S. Jacquir;K. Sanchez;H. Terada;P. Perdu;S. Binczak
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Power lasers;
- Laser modes;
- Wavelet transforms;
- Laser theory;
- Optical filters;
- Optical imaging;
83.Failure analysis defect localization of a metal stringer defect on a monolithic step-up DC-DC converter

机译：单片升压DC-DC转换器上金属纵梁缺陷的失效分析缺陷定位
- 作者：Rowin V. Galarce;Francis Nikolai Lupena;Benedict Jimenez;Siew Mei Teo
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
84.Simulation assisting EMMI technical to locate defect on capacitor in integrated circuit failure analysis

机译：仿真辅助EMMI技术在集成电路故障分析中定位电容器的缺陷
- 作者：Gaojie Wen;Li Tian;Diwei Fan;Jinrong Song;Jun Ren;Dong Wang;Xiaocui Li
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Capacitors;
- Integrated circuit modeling;
- Analytical models;
- Failure analysis;
- Feedback circuits;
85.Three-dimensional AES of segregated materials on a gold pad

机译：金垫上的偏见材料的三维AES
- 作者：Tatsuya Uchida;Akihiro Tanaka;Kenichi Tsutsumi;Nobuyuki Ikeo
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Energy resolution;
- Spatial resolution;
- Spectroscopy;
- Energy measurement;
- Integrated circuits;
- Failure analysis;
- Visualization;
86.Failure mechanisms in encapsulated copper wire-bonded devices

机译：封装铜线粘结装置中的失效机制
- 作者：Subramani Manoharan;Gopal KrishnanRamaswami;F. Patrick McCluskey;Michael G. Pecht
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Wires;
- Copper;
- Compounds;
- Performance evaluation;
- Corrosion;
- Etching;
- Failure analysis;
87.Imaging of strain from deep trenches using X-Ray Diffraction Imaging (XRDI)

机译：使用X射线衍射成像（XRDI）对深沟的菌株的成像
- 作者：J. P. Gambino;Y. Watanabe;Y. Kanuma;B. Greenwood;D. Price;A. Suwhanov;S. Hose;O. Whear
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
- Erbium;
88.Mitigation of thin wafer handling issues in TSV (Through Silicon Via) fabrication for advanced packaging applications

机译：TSV（通过硅通孔通孔）制造中的薄晶片处理问题的减轻，用于高级包装应用
- 作者：V. N. Sekhar;Ren Qin;Sunil Wickramanayaka
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
89.Resolution of missing silicide layer on P-type MOSFET caused by water droplet

机译：水滴引起的P型MOSFET上缺失硅化物层的分辨率
- 作者：Siew Mei Teo;Khairul Aiman Md Yusof;Noorsyuhada Hat
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
- Erbium;
90.Developments in SPM technologies for semiconductor failure analysis

机译：SPM技术的开发半导体故障分析
- 作者：Wanxin Sun
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
91.Nanoprobing on the SRAM static noise margin (SNM) soft fail analysis

机译：纳米诡计上SRAM静态噪声裕度（SNM）软失败分析
- 作者：C. Q. Chen;P. T. Ng;Francis Rivai;Y. Z. Ma;P. K. Tan;H. Tan;Jeffery Lam;Z. H. Mai
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
92.Effect of grade doping buffer layer on SEE failure in VDMOSFET

机译：等级掺杂缓冲层对VDMOSFET中检测失败的影响
- 作者：Yunpeng Jia;Ling Peng;Hongyuan Su;Dongqing Hu;Yu Wu
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Buffer layers;
- Doping;
- Semiconductor process modeling;
- Electric fields;
- Ions;
- MOSFET;
- Threshold voltage;
93.Sample preparation technique for the revelation of a semiconductor dopant using an FE-SEM

机译：使用Fe-SEM的半导体掺杂剂启示的样品制备技术
- 作者：Takeshi Sunaoshi;Shuichi Takeuchi;Atsushi Kamino;Masahiro Sasajima;Hiroyuki Ito
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;
94.Field-dependent degradation mechanisms in GaN-based HEMTs

机译：GaN的血管血管依赖性降解机制
- 作者：M. Meneghini;G. Meneghesso;I. Rossetto;J. Bartholomeus;F. Rampazzo;C. De Santi;D. Bisi;E. Zanoni
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
95.Case study of flash memory failure analysis for page erase fail

机译：页面擦除闪存故障分析的案例研究失败
- 作者：M. Guo;M. Masuda;Y. Che;C. Y. Qi;X. Z. Wang;X. C. Li;R. Chen;H. R. Di;L. Shan
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
96.Fast and efficient method to detect probe mark and wire bond induced pad damage

机译：快速有效地检测探头和线键诱导焊盘损坏的方法
- 作者：Jethro Tan;Gary H. G. Chan;W. F. Kho
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
97.Voltage choosing of OBIRCH for finger metal structure

机译：手指金属结构烟灰电压选择
- 作者：LinMeng Yang;Bobby Chan;Gang Qian;LiLung Lai;Rui Fang
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
98.Logics of Failure Analysis: 20 Years of rules of the Rue Morgue

机译：失败分析逻辑：20年的rue Morgue规则
- 作者：G. Mura;M. Vanzi
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
99.Application of MOSFET characteristic measurement for electrical isolation of open defect on device level in failure analysis

机译：MOSFET特性测量在失效分析中对缺陷电气隔离电气隔离的应用
- 作者：Li Tian;Xuejian Qian;Gaojie Wen;Jinrong Song;Hao Zhang;Diwei Fan;Dong Wang
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Decision support systems;
- Failure analysis;
- Integrated circuits;
100.Case study of leakage/short on PCB after biased-HAST

机译：偏差后PCB泄漏/短路案例研究
- 作者：Ke-Ying Lin;Sharon Chen
- 会议名称：《IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits》 | 2016年
- Failure analysis;
- Integrated circuits;
- Decision support systems;