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The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging

召开年：2006
召开地：Rosemont, IL(US)
出版时间：-

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1.ASSEMBLY CHALLENGES OF PACKAGE-ON-PACKAGE (PoP)

机译：组装对包装（PoP）的组装挑战
- 作者：Richard Boulanger
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Package-on-Package;
- PoP;
- Fluxing;
- High-speed assembly;
2.MANAGING RISK IN OUTSOURCED PRODUCT DEVELOPMENT AND MANUFACTURING

机译：外包产品开发和制造中的风险管理
- 作者：Larry Fleming
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
3.EMS ACQUISITION INTEGRATION – CREATING OPERATIONAL SYNERGY WHILE STAYING ALIGNED WITH ACQUIRED CUSTOMER EXPECTATIONS

机译：EMS采购集成–在保持与获得的客户期望保持一致的同时，实现操作协同
- 作者：Todd M. Baggett
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
4.RAPID POWER CYCLING OF Pb-FREE SOLDERED COMPONENTS

机译：无铅焊接部件的快速功率循环
- 作者：Nathan Blattau;Danko Priimak;Joelle Arnold;Craig Hillman
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- failure;
- power;
- fatigue;
- thermal cycling;
- SnAgCu;
- SnNiCu;
- solder;
5.TRACER DIFFUSION IN WHISKER-PRONE TIN PLATINGS

机译：晶须-锡镀层中的示踪剂扩散
- 作者：Thomas A. Woodrow
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- tin whiskers;
- isotopes;
- diffusion;
6.CONNECTING THE UNCONNECTED - BROADBAND WIRELESS ACCESS TECHNOLOGIES AND NETWORK

机译：连接未连接的–宽带无线访问技术和网络
- 作者：Xin Meng
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
7.LEAD FREE PERFORMANCE OF FA-18 ELECTRONICS THROUGH MANUFACTURE

机译：制造过程中FA-18电子的无铅性能
- 作者：Matthew Hamand
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead free;
- legacy;
- through hole;
- wave solder;
8.LIFE PREDICTION AND DAMAGE EQUIVALENCY FOR SHOCK SURVIVABILITY OF ELECTRONIC COMPONENTS

机译：电子元件的冲击寿命的寿命预测和损伤当量
- 作者：Pradeep Lall;Dhananjay Panchagade;Deepti Iyengar;Jeff Suhling
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Shock;
- Vibration;
- Drop-Impact;
- Ball-Grid Arrays;
- Life-Prediction;
- Reliability;
9.JCAA/JG-PP LEAD-FREE SOLDER TESTING FOR HIGH RELIABILITY APPLICATIONS: -55°C to +125°C THERMAL CYCLE TESTING

机译：适用于高可靠性应用的JCAA / JG-PP无铅焊料测试：-55°C至+ 125°C热循环测试
- 作者：David Hillman;Ross Wilcoxon
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free;
- JCAA/JGPP;
- Solder;
- Reliability testing;
10.EVALUATION OF CONFORMAL COATINGS AS A TIN WHISKER MITIGATION STRATEGY, PART II

机译：作为锡晶须迁移策略的保形涂层评估，第二部分
- 作者：Thomas A. Woodrow;Eugene A. Ledbury
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- tin whiskers;
- conformal coatings;
- mitigation;
11.ELECTROMIGRATION OF SNPB FLIP CHIP SOLDER BUMPS WITH THICK NI/CU UNDER BUMP METALLIZATION

机译：厚金属化下厚镍/铜对SNPB倒装芯片焊锡的电沉积
- 作者：Chun-Hong Chen;Chih Chen;Eric Lin;Yi-Cheng Liu;Paul Chen
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Electromigration;
- Flip-chip solder joints;
- Ni under bump metallization;
12.KEY ISSUES IN SUPPORTING CUSTOMERS NOT TRANSITIONING TO LEAD FREE

机译：支持客户过渡到无铅的关键问题
- 作者：Curt Williams
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free;
- EMS;
- RoHS;
- Obsolescence;
- Legacy Products;
13.VOIDS IN SOLDER JOINTS

机译：焊接接头中的空隙
- 作者：Raiyo F. Aspandiar
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Voids;
- PCB;
- IMC;
- Lead-free;
- BGA;
- solder joint;
14.IMPROVED BGA SHOCK AND BEND PERFORMANCE USING CORNER GLUE EPOXIES

机译：使用角胶环氧树脂改善BGA的冲击和弯曲性能
- 作者：Michael Kochanowski;Brian Toleno
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- corner glue;
- epoxy;
- BGA;
- shock;
- bend;
15.PROCESS CHARACTERIZATION OF THE 01005 (ENGLISH) COMPONENT PACKAGE

机译：01005（英语）组件包装的工艺特性
- 作者：Tom Borkes;Lawrence Groves
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
16.ASSESSING THE RELIABILITY OF AREA ARRAY CONNECTORS

机译：评估区域阵列连接器的可靠性
- 作者：Heather McCormick;George Riccitelli
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- BGA Connectors;
- BGA socket;
17.RELIABILITY STUDY AND SOLDER JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS

机译：各种SnAgCu陶瓷球网格（CBGA）几何形状和合金的可靠性研究和焊接接头的微观结构
- 作者：Marie Cole;Matthew Kelly;Mario Interrante;Gregory Martin;Christian Bergeron;Mukta Farooq;Mark Hoffmeyer;Simin Bagheri;Polina Snugovsky;Zohreh Bagheri;Marianne Romansky
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- SAC CBGA;
- SnAgCu CBGA;
- mixed assembly;
18.INFLUENCE OF PACKAGE CONSTRUCTION AND BOARD DESIGN VARIABLES ON THE SOLDER JOINT RELIABILITY OF SnPb AND Pb-FREE PBGA PACKAGES

机译：封装结构和电路板设计变量对SnPb和无铅PBGA封装的焊接接头可靠性的影响
- 作者：Brian Vaccaro;Dan Gerlach;Richard Coyle;Richard Popowich;John Manock;Heather McCormick;George Riccitelli;Debra Fleming
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead Free;
- PBGA;
- Reliability;
19.COOLING RATE OPTIMIZATION AND RELIABILITY OF Pb-FREE Sn-Ag-Cu STACKED BGA MODULES

机译：无铅Sn-Ag-Cu叠层BGA模块的冷却速率优化和可靠性
- 作者：R. Kinyanjui;M. Abtew;K. Sprinkle
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Undercooling;
- BGA Stack modules;
- Cooling rate;
20.EFFECTS OF PLASMA PRETREATMENT ON FLIP CHIP AND CSP SUBSTRATE LEVEL ASSEMBLY YIELD AND RELIABILITY

机译：等离子体预处理对倒装芯片和CSP基质水平组件产量和可靠性的影响
- 作者：Daniel Baldwin;Paul Houston;Brian Lewis
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Plasma;
- Underfill;
- Flip Chip;
- Reliability;
- Yield;
21.RELIABILITY OF SPACE FLIGHT CRYSTAL CONTROLLED OSCILLATOR USING LEAD-FREE SURFACE MOUNT TECHNOLOGY

机译：使用无铅表面安装技术的空间飞行晶体控制振荡器的可靠性
- 作者：Todd H. Treichel
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- lead-free;
- crystal oscillator;
- reliability;
- space;
- aerospace;
- tin-whisker;
22.DOE RESULTS FOR LEAD-FREE SOLDER PROCESS DEVELOPMENT FOR HARSH ENVIRONMENT CONSIDERATIONS

机译：针对恶劣环境考虑的无铅焊料工艺开发的DOE结果
- 作者：Lance A. Brack;Mradul Mehrotra;Emmanuel J. Siméus;Stephen R. Stegura;Martin L. Weakley;Adam S. Reynolds;Martin L. Scionti;William C. Thomas
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- WEEE;
- RoHS;
- Pb-Free;
- Lead-Free;
- Soldering;
- Tin/Silver/Copper (SnAgCu) or SAC;
- Ball Grid Array (BGA);
- Solder Reflow Profile;
- Wave Soldering;
23.SOLDER PASTE INSPECTION STUDY WITH SPI AND AXI

机译：用SPI和AXI进行焊膏检验研究
- 作者：Zhen (Jane) Feng;Alex Garcia;Thomas Munnerlyn;Walid Meliane;Scott Kingery;Murad Kurwa
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- SPI;
- AXI;
- 2DX;
- attribute data;
- variable data;
- comparison;
24.JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C to +80°C THERMAL CYCLE TEST

机译：JCAA / JG-PP无铅焊料项目：-20°C至+ 80°C的热循环测试
- 作者：Thomas A. Woodrow
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- thermal cycling;
- lead-free solders;
- reliability;
25.FAILURE MECHANISM OF SAC 305 AND SAC 405 IN HARSH ENVIRONMENTS AND INFLUENCE OF BOARD DEFECTS INCLUDING BLACK PAD

机译：SAC 305和SAC 405在恶劣环境中的破坏机理以及包括黑垫在内的板缺陷的影响
- 作者：Polina Snugovsky;Zohreh Bagheri;Heather McCormick;Simin Bagheri;Craig Hamilton;Marianne Romansky
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-Free;
- microstructure;
- intermetallic;
- solder joints;
- reliability;
- brittle fracture;
26.MECHANICAL TESTING OF SOLDER JOINT ARRAYS VERSUS BULK SOLDER SPECIMENS

机译：焊点阵列与本体焊点标本的机械测试
- 作者：Robert Darveaux
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Mechanical Testing;
- Lead Free Solder;
- Creep;
- Finite Element Analysis;
- Fatigue Life Prediction;
27.BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER – A PRELIMINARY REVIEW, PART THREE

机译：BGA焊料与孔内填充，VIA填充，表面处理和无铅焊料的空隙相关性–初步审查，第三部分
- 作者：Chrys Shea;Rahul Raut;Lou Picchione;Quyen Chu;Nicholas Tokotch;Paul Wang
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- BGA;
- Voiding;
- Lead-Free;
- Via-In-Pad;
- Via Fill;
28.AGING INDUCED VOID FORMATION AND ITS IMPACT ON THE MECHANICAL INTEGRITY OF SOLDER TO BARE Cu OR ENIG BGA SURFACE FINISHES

机译：时效诱发的空洞形成及其对焊料与裸露的Cu或ENIG BGA表面的机械完整性的影响
- 作者：B. Vaccaro;J. Osenbach;S. Gasper-Gerlach;G. Libricz;R. Shook;A. Amin;J.Goodelle;J. Kilgarriff;Weidong Xie
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- BGA;
- Reliability;
- Surface Finish;
- Voids;
29.LEVEL 2 RELIABILITY ASSESSMENT OF THE SLC? PACKAGE USING 90nm SILICON TECHNOLOGY

机译：SLC的等级2可靠性评估？使用90nm硅技术的封装
- 作者：Nicole Butel
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- BGA;
- SLC;
- solder joints;
- ENIG;
- CuSOP;
30.APPLICABILITY OF VARIOUS Pb-FREE SOLDER JOINT ACCELERATION FACTOR MODELS

机译：各种无铅焊点加速因子模型的适用性
- 作者：Ron Zhang;Jean-Paul Clech
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- SAC;
- Acceleration Factor;
- Solder Joint Reliability;
- Compact Strain Energy Model;
- Finite Element Model;
31.NOVEL SACX SOLDERS WITH SUPERIOR DROP TEST PERFORMANCE

机译：新型SACX焊剂具有出色的落差测试性能
- 作者：Weiping Liu;Ning-Cheng Lee
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- lead-free;
- SnAgCu;
- SAC;
- solder;
- drop test;
- fragility;
- reliability;
32.PROCESS DESIGN AND DEVELOPMENT FOR STENCIL PRINTING REPRESENTATIVE FEATURES OF A MICRO BATTERY CURRENT COLLECTOR LAYER

机译：微电池电流收集器层钢印代表特征的工艺设计与开发
- 作者：Sameer Paranjape;Saurabh Nanavati;David L. Wells
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- micro battery;
- current collector layer;
- stencil printing;
- solder paste;
- silver epoxy;
33.PLANAR MICROVOIDING IN LEAD-FREE SECOND-LEVEL INTERCONNECT SOLDER JOINTS

机译：无铅第二级互连焊接接头中的平面微气泡
- 作者：Muffadal Mukadam;Norman Armendariz;Raiyo Aspandiar;Mike Witkowski;Victor Alvarez;Andrew Tong;Betty Phillips;Gary Long
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- SMT;
- PCB;
- Second Level Interconnect (SLI);
- Voids;
- Planar microvoids;
- Lead-free;
- Immersion Ag;
- Galvanic corrosion;
34.EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS

机译：加速存储环境对沉浸式银涂层印刷电路板可焊性的影响
- 作者：Paul Vianco;Edwin Lopez;R. Wayne Buttry;Alice Kilgo;Samuel Lucero
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Solderability;
- immersion silver;
- storage environments;
- printed circuit boards;
35.NANOTECHNOLOGY AND ROOM TEMPERATURE ASSEMBLY

机译：纳米技术和室温装配
- 作者：Alan Rae;Andrew Skipor
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
36.EMERGING OPPORTUNITIES AND CHALLENGES FOR HIGH FREQUENCY BROADBAND COMMUNICATIONS

机译：高频宽带通信的新兴机遇和挑战
- 作者：Rudy Emrick;Steve Franson;John Holmes;Bruce Bosco;Steve Rockwell
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
37.A UNIQUE PROCESS THAT ELIMINATES SOLDER DROSS

机译：消除焊锡划痕的独特工艺
- 作者：Daniel (Baer) Feinberg;P. Kay Metal;Fein-Line Associates
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
38.REWORK SYSTEM-TO-SYSTEM PERFORMANCE CHARACTERIZATION

机译：重做系统对系统的性能表征
- 作者：Al Cabral
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- rework;
- repair;
- performance;
- matching;
39.LARGE AREA ARRAY PACKAGE LEAD-FREE REWORK STUDY

机译：大面积阵列包装无铅返工研究
- 作者：David Geiger;Damone Phanavong;Todd Castello;Dongkai Shangguan
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- lead-free;
- SnAgCu alloy;
- rework;
- area-array;
40.LEAD-FREE SOLDER ASSEMBLY FOR MIXED TECHNOLOGY CIRCUIT BOARDS

机译：混合技术电路板的无铅焊料组装
- 作者：David Suraski;Karl Seelig
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
41.EFFECT OF INERT ATMOSPHERE REFLOW AND SOLDER PASTE VOLUME ON THE MICROSTRUCTURE AND MECHANICAL STRENGTH OF MIXED Sn-Ag-Cu AND Sn-Pb SOLDER JOINTS

机译：惰性气体回流和焊膏体积对混合的Sn-Ag-Cu和Sn-Pb焊点的组织和力学强度的影响
- 作者：Mulugeta Abtew;Robert Kinyanjui;Narong Nuchsupap;Thanarkhom Chavasiri;Net-Hin Yingyod;Paiboon Saetang;Jakrit Krapun;Kriangsak Jikratoke
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
42.A STUDY OF COPPER DISSOLUTION IN Pb-FREE SOLDER FOUNTAIN SYSTEMS

机译：无铅焊料喷泉体系中铜溶解的研究
- 作者：Fritz Byle;Denis Jean;Dale Lee
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
43.USING UNDERFILLS TO ENHANCE DROP TEST RELIABILITY OF Pb-FREE SOLDER JOINTS IN ADVANCED CHIP SCALE PACKAGES

机译：使用底料来增强高级芯片级封装中无铅焊料接头的跌落测试可靠性
- 作者：Brian Toleno;Dan Maslyk;Tom White
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- underfill;
- reliability;
- WLCSP;
- drop testing;
44.RHEOLOGICAL EFFECTS IN UNDERFILL JET-DISPENSING

机译：未装满弹药的流变效应
- 作者：Vinod Mohan;Paul Morganelli;Ph.D.;Bryon Stevens;Brian Wheelock
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
45.IMPORTANCE OF ROBUST TEST METHODS FOR ACHIEVING RoHS COMPLIANCE

机译：鲁棒测试方法对实现RoHS合规性的重要性
- 作者：William Olson;Ph.D.
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- RoHS;
- WEEE;
- Material Test Standard;
46.INVESTIGATION OF THE FORWARD AND BACKWARD COMPATIBILITY OF SOLDER ALLOYS WITH COMPONENT FINISHES FOR HASL AND OSP PCB FINISH

机译：含HASL和OSP PCB涂饰剂成分的焊料合金的前向和后向兼容性研究
- 作者：Anand Kannabiran;Elavarasan T. Pannerselvam;Prof. S. Manian Ramkumar
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
47.PORTABLE XRF FOR ROHS COMPLIANCE AND Pb-FREE SOLDERING

机译：符合RoHS要求和无铅焊接的便携式XRF
- 作者：Kimberley A. Russell;Drew Hession-Kunz;Brendan Connors
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- RoHS;
- Portable XRF;
- Pb Solders;
48.EFECTIVE LEAN SIX SIGMA DEPOYMENT IN A GLOBAL ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT

机译：全球电子制造服务环境中有效的六个西格玛部署
- 作者：Harjinder Ladhar
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
49.A NEW ENVIRONMENTALLY BENIGN METHOD FOR LEAD-FREE SOLDER DEFLUXING

机译：一种无铅焊锡膏的环保新方法
- 作者：Albert J. Mastrangelo;Susan Chute;Jay Soma;Robert Sell;Christine Fouts
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free;
- cleaning;
- vapor degreasing;
- cosolvent;
50.CHALLENGES TO DOING BUSINESS IN ASIA EFFECTIVELY

机译：有效地在亚洲开展业务的挑战
- 作者：Franz-Josef Kahlen
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Asian market strategies;
- logistics;
- production;
- en-route processing;
51.RoHS IMPLEMENTATION IN A CONTRACT ELECTRONICS MANUFACTURING ENVIRONMENT

机译：合同电子制造环境中的RoHS实施
- 作者：Amol S. Kane;Eric P. Griffen;D.L Santos;Ph.D.
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- RoHS;
- WEEE;
- lead-free;
- Material Declarations;
- Moisture Sensitivity;
52.AN EXPERIMENTAL METHOD TO INVESTIGATE TRUE STRESS DURING THE FATIGUE OF LEAD-FREE SOLDERS

机译：无铅焊料疲劳过程中研究真实应力的实验方法
- 作者：Milos Dusek;Chris Hunt
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- fatigue;
- stress;
- solder joints;
53.PRECISION COATING DEPOSITION TECHNIQUES FOR CONFORMAL COATING APPLICATIONS

机译：保形涂层应用中的精密涂层沉积技术
- 作者：Stuart Erickson
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
54.FLIP CHIP INTEGRATION OF A LARGE FORMAT ARRAY OF MOEMS DEVICES FOR SPACE INFRARED ASTRONOMY

机译：空间红外天体的大型Moemo设备格式数组的倒装芯片集成
- 作者：Christine A. Allen;John Abrahams;Nick Costen;Larry Hess;Mary Li;Timothy Miller;S. Harvey Moseley;James Pontius;David Puckett;Eric Schulte;Christian Zincke
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- microshutter array;
- room temperature singlesided indium bump bonding;
- flip-chip bonding;
- MOEMS;
55.A SIMULTANEOUS AND SELECTIVE MICROWAVE SUPPORTED SOLDERING TECHNOLOGY

机译：同时选择性微波支持的焊接技术
- 作者：Mathias Nowottnick;Wolfgang Scheel;Uwe Pape;Rolf Diehm;Joachim Wiese;Wolfgang Kempe;Marcel Mallah;Manfred Suppa;Peter Fink
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
56.FIRST ORDER FAILURE MODEL FOR LEADLESS CERAMIC CHIP DEVICES WITH PB-FREE SOLDER

机译：无铅焊料的无铅陶瓷芯片的一阶故障模型
- 作者：Nathan Blattau;Craig Hillman
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- failure;
- model;
- analytical;
- fatigue;
- thermal cycling;
- resistor;
- SnAgCu;
- solder;
57.A STUDY OF COPPER DISSOLUTION DURING LEAD FREE PTH REWORK USING A THERMALLY MASSIVE TEST VEHICLE

机译：热大规模试验车对无铅PTH加工中铜溶解的研究。
- 作者：Craig Hamilton;Polina Snugovsky;Matthew Kelly
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Cu dissolution;
- PTH rework;
- Sn-Ag-Cu;
- process window;
58.SOLIDIFICATION BEHAVIOUR OF LEAD-FREE ALLOYS AND ITS RELATIONSHIP TO THEIR PERFORMANCE AS PRACTICAL SOLDERS

机译：无铅合金的凝固行为及其与实际焊料性能的关系
- 作者：Keith Sweatman;Tetsuro Nishimura
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free solders;
- solidification;
- eutectics;
59.NEW COATING TECHNOLOGIES AND ADVANCED TECHNIQUES IN CONFORMAL COATING

机译：保形涂层的新涂层技术和先进技术
- 作者：Michael Szuch;Alan Lewis;Hector Pulido
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Conformal coating;
- jet coating;
- film coat;
- trimode;
- flow coating;
- bead;
- swirl;
- monofilament;
60.ASSEMBLY PROCESS RESEARCH ON 01005 CHIP COMPONENTS IN LEAD-FREE SYSTEM

机译：无铅系统中01005芯片组件的装配过程研究
- 作者：Syber Chen;Xi Cao;Junwen Jin;Fujiang Sun
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 01005;
- Miniaturization;
- Assembly Process Window;
- Lead Free;
61.PROCESS DEVELOPMENT FOR 01005 LEAD-FREE PASSIVE ASSEMBLY: STENCIL PRINTING

机译：01005无铅无源装配的工艺开发：钢印
- 作者：Joe Belmonte;Vatsal Shah;Rita Mohanty;Ph.D.;Tim Jensen;Ron Lasky;Ph.D.;Jeff Bishop
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 01005;
- passives;
- passive assembly;
- lead free passive assembly;
62.AN EXPERIMENTAL STUDY OF PRESS-FIT INTERCONNECTION ON LEAD FREE PLATING FINISHES

机译：无铅镀层压配合互连的实验研究
- 作者：Ila Pal;Elena Smolentseva
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- press-fit terminal;
- RoHS;
- lead free;
- plated through hole;
- interconnection;
- testing standards;
- Kelvin measurements;
- pin retention force;
63.LEAD-FREE HAND SOLDERING: NEW TECHNOLOGIES FOR ENHANCING THE WEAKEST LINK IN THE LEAD-FREE REWORK AND REPAIR PROCESS CONTROL CHAIN

机译：无铅手焊：增强无铅返工和维修过程控制链中最弱的联系的新技术
- 作者：Mark Cannon;Bob Klenke;Phil Zarrow
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
64.3D SYSTEM-IN-PACKAGAGE SOLUTION FOR MIXED IC TECHNOLOGY APPLICATIONS

机译：混合IC技术应用的3D封装系统解决方案
- 作者：Vern Solberg
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- MicroContact;
- Chip-Scale;
- Stacked-die;
65.PACKAGING OF POWER LEDS USING THERMOSONIC BONDING OF Au-Au INTERCONNECTS

机译：使用Au-Au互连的热键合封装功率LED
- 作者：Seck-Hoe Wong;Mooi Guan Ng;Mee-Lee Yong;Nooralshikin Hussain;Syivaram Balakrishnan;Khai-Chow Ng;Young-Keat Beh;Shatil Haque
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Au stud bumping;
- thermosonic bonding;
- flipchip die-attach;
- surface mount LED package;
- LED packaging;
66.THE EFFECT OF PACKAGING MATERIAL AND PROCESS ON DEVICE PERFORMANCE OF LIGHT EMITTING DIODE

机译：包装材料和工艺对发光二极管器件性能的影响
- 作者：Hyungkun Kim;Yu-Sik Kim;Jeong Wook Lee;Sukho Yoon;Jaehee Cho;Hyunsoo Kim;Cheolsoo Sone;Yongjo Park
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Light emitting diode;
- thermal property;
- dieattach;
- eutectic solder;
- lifetime;
67.RELIABILITY STUDY OF LEAD-FREE AREA ARRAY PACKAGES WITH TIN-LEAD SOLDERING PROCESSES

机译：锡铅焊接工艺的无铅区阵列包装的可靠性研究
- 作者：Jennifer Nguyen;David Geiger;Daniel Rooney;Ph.D.;Dongkai Shangguan;Ph.D.
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- reliability;
- lead-free;
- SnAgCu alloy;
- mixed alloy;
- backward compatibility;
- backward compatible assembly;
- tin percentage;
- reflow temperature;
68.PROCESS FOR BLIND MICROVIA FILLING AND THROUGH HOLE METALLIZATION OF HIGH DENSITY INTERCONNECTS

机译：高密度互连的盲孔微孔填充和贯穿孔金属化的过程
- 作者：Bob Gallant
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
69.ENABLING HIGH DENSITY SYSTEM IN PACKAGE (SiP) MANUFACTURING AND CONSUMER ELECTRONIC DEVICES THROUGH THE USE OF JETTING TECHNOLOGY TO MINIMIZE SUBSTRATE AREA FOR UNDERFILL

机译：通过使用点胶技术使装填的基板面积最小化，从而在包装（SiP）制造和消费电子设备中启用高密度系统
- 作者：Michael Peterson;Steven J. Adamson
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
70.ON AGING EFFECT OF FLIP CHIP SOLDER BUMPS

机译：倒装锡焊的老化效果
- 作者：Mukul Joshi;Raghunandan Chaware
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Flip Chip BGA (FCBGA);
- Wafer Bumping;
- Intermetallics;
- UBM;
- Aging;
- Reliability.;
71.MANUFACTURING IMPROVEMENTS ENABLED BY NEW LOW-PRESSURE MOLDING PROCESS

机译：新型低压成型工艺带来的制造改进
- 作者：Michael J. Pierce;Reimer Hansen
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
72.RELIABILITY EVALUATION OF PLATED-THROUGH HOLES FOR HIGH DENSITY PWB APPLICATION

机译：高密度印刷电路板应用中贯通孔的可靠性评估
- 作者：Donghyun Kim;Mudasir Ahmad;David Senk;Mason Hu;Sue Teng;Rocky Shih
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
73.HIGH TEMPERATURE LEAD-FREE SOLDERING IMPACT ON END PRODUCT RELIABILITY

机译：高温无铅焊接对最终产品可靠性的影响
- 作者：Vern Solberg
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-Free;
- RoHS;
- Reliability;
74.TIN PEST PHENOMENA: A REAL WORLD TEST SCENARIO

机译：锡虫现象：真实世界的试验场景
- 作者：David Hillman;Mike Schmidt;Bev Christian;Ph.D.
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
75.MATHEMATICAL MODELING OF SOLDER PASTE STENCILING FOR PROCESS CONTROL

机译：用于过程控制的焊锡膏数学建模
- 作者：Tim Wright
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
76.PROCESS CHARACTERIZATION FOR THE ASSEMBLY OF 01005 COMPONENTS

机译：01005组件装配的过程表征
- 作者：Ashok Viswanathan;Krishnaswami Srihari;Ph.D.;Jeffrey D. Schake
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 01005 devices;
- Area Ratio;
- Passives;
- Transfer Efficiency;
77.CORRELATING THE PRESENCE OF POPCORNED BGA DEVICES POST REFLOW WITH SOLDER-BALL DIAMETER MEASUREMENTS FROM X-RAY INSPECTION

机译：将回流的BGA设备的存在与回焊后的X射线球直径测量值进行关联
- 作者：David Bernard;Bob Willis
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Popcorning;
- popcorned;
- BGA;
- lead-free;
- x-ray inspection;
- moisture sensitivity level;
78.RELIABILITY STUDY OF LEAD-FREE SnAgCu SOLDER JOINTS VS. SnPb SOLDER JOINTS IN QFN PACKAGES

机译：无铅SnAgCu焊接接头的可靠性研究。 QFN封装中的SnPb焊料接头
- 作者：Donghyun Kim;Mudasir Ahmad;Sue Teng
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
79.FASTENING HARDWARE USING SURFACE MOUNT TECHNOLOGY

机译：使用表面贴装技术组装硬件
- 作者：Brian G. Bentrim;P.E.
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Fasteners;
- Spacers;
- Standoffs;
- Nuts;
80.BONDING TECHNIQUES IN WAFER FABRICATION

机译：晶圆制造中的键合技术
- 作者：Karthik Tondapu
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Microfabrication;
- MEMS;
- Wafer Bonding;
- Comparison;
81.LEAD FREE WAVE SOLDERING AT ITS BEST

机译：领先的免费波峰焊接
- 作者：Rita Mohanty;Ph.D.;Ken Kirby
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- wave solder process;
- effect of flux;
- wave solder optimization DOE;
82.EFFECT OF OXYGEN CONCENTRATION DURING REFLOW ON TOMBSTONING FOR PASSIVE RESISTORS FOR LEAD-FREE ASSEMBLIES

机译：回流过程中的氧气浓度对无铅组件无源电阻的按键响声的影响
- 作者：Srinivasa Aravamudhan;Marc Apell;Joe Belmonte;Gerald Pham Van-Diep;Jeff Harrell
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-Free;
- Tombstone;
- Reflow Process;
- Nitrogen Reflow;
- 0201s;
- 0401s;
- and Passive Resistors;
83.AGING EFFECTS ON DYNAMIC BEND TEST PERFORMANCE OF Pb-FREE SOLDER JOINTS ON Ni/Au FINISH

机译：Ni / Au精加工中无铅焊料接头动态弯曲试验性能的时效效应
- 作者：Min Ding;Adriana Porras
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- BGA;
- Drop Test;
- Solder Joints;
- Aging;
84.CONFORMAL COATING PROCESS CONTROL AS IT RELATES TO TEMPERATURE AND HUMIDITY

机译：与温度和湿度有关的保形涂层过程控制
- 作者：Timothy Harmon
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- conformal coat;
- viscosity;
- spray performance;
85.MANUFACTURABILITY AND RELIABILITY OF HIGH-SPEED BGA CONNECTORS USING SnPb, MIXED SOLDERING, AND LEAD-FREE PROCESSES

机译：采用SnPb，混合焊接和无铅工艺的高速BGA连接器的可制造性和可靠性
- 作者：Hien Ly;Doug Prosenik;Scott Priore
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Manufacturability;
- BGA;
- BGA connector;
- SMT backplane connector;
- Pb-free;
- mixed soldering;
- rework;
- reliability;
86.DEVELOPMENT OF A 3D WAFER-LEVEL RE-ROUTING USING DIELECTRIC LAMINATION TECHNOLOGY

机译：利用介电层压技术开发3D晶圆级重布线
- 作者：L.Boettcher;A.Ostmann;Dionysios Manessis;David-Dmitry Polityko;H.Reichl
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Wafer-Level-Redistribution;
- CSP;
- 3D;
- epoxy dielectric;
- resin coated copper (RCC);
- vacuum lamination electroless metallization;
- 3D metallization;
- laser drilling;
- Via-in-Via;
- eGrain;
87.DESIGN FOR BGA LEAD-FREE SOLDER JOINT RELIABILITY

机译：BGA无铅焊点可靠性设计
- 作者：Scott K. Buttars
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
88.PACKAGE ON PACKAGE (PoP) STACKING AND BOARD LEVEL RELIABILITY RESULTS

机译：打包包装（PoP）堆叠和板级可靠性结果
- 作者：Lee Smith;Moody Dreiza;Akito Yoshida
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 3D packaging;
- stacked package;
- package on package;
- PoP;
- package stackable very thin fine pitch BGA;
- PSvfBGA;
- system in a package;
- SiP;
- multi-chip package;
- MCP;
- stacked CSP;
- board level reliability;
- BLR;
- solder joint reliability;
- SJR;
89.CONTROL OF THE WARPAGE FOR PACKAGE-ON-PACKAGE (PoP) DESIGN

机译：封装级封装（PoP）设计的翘曲控制
- 作者：Wei Lin;Akito Yoshida;Moody Dreiza;Takahiro Yamashita;Akihide Ishihara
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 3D packaging;
- PoP;
- warpage;
90.MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING

机译：PCB弯曲下BGA焊点的建模和实验相关
- 作者：Anurag Bansal;Yuan Li;Vadali Mahadev
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Bend;
- Flex;
- Solder Joint;
- BGA;
- Brittle Fracture;
91.DEVELOPMENT OF MULTILAYER FLEX SUBSTRATE WITH LIQUID CRYSTAL POLYMER FILM

机译：液晶聚合物薄膜多层柔性基板的研制
- 作者：Hiroyuki Okabe;Nagayoshi Matsuo;Kenji Saito;Kazunori Ueda
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- LCP;
- BGA;
- substrate;
- CSP;
92.EQUALIZING PROCESS CYCLE TIME AND PROCESS THROUGHPUT, THE KEY TO “WORLD CLASS MANUFACTURING”

机译：均衡过程时间和过程吞吐量，这是“世界一流制造”的关键
- 作者：Joe Belmonte;Rita Mohanty
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Throughput;
- Cycle time;
- DPMO;
- First Pass Yield (FPY);
- Rolled Throughput Yield (RTY).;
93.“REWORK” TEST VEHICLES OF JCAA/JG-PP LEAD-FREE SOLDER PROJECT

机译：JCAA / JG-PP无铅焊锡项目的“返工”测试车
- 作者：Ana L. Campuzano-Contreras
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- aerospace;
- military;
- SnPb;
- RoHS;
94.UPDATED SOLDER FATIGUE LIFE PREDICTION MODELS FOR SnAgCu SOLDER JOINTS

机译：SnAgCu焊料接头的更新的焊料疲劳寿命预测模型
- 作者：Ahmer Syed
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- SnAgCu;
- Finite Element Modeling;
- Life Prediction;
- Creep;
- Inelastic Strain;
- Inelastic Energy Density;
95.M3: MULTISCALE ASSEMBLY AND PACKAGING SYSTEM FOR MOEMS

机译：M3：MOEMS的多尺度装配和包装系统
- 作者：Rakesh Murthy;Aditya Das;Dan Popa;Manoj Mittal
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Multi-Scale;
- Robotics;
- Assembly;
- MEMS;
- Packaging;
96.A NEW METHODOLOGY TO PREDICT AND MINIMIZE MOLTEN SOLDER JOINT OPENS AND SHORTS DURING REFLOW

机译：预测和最小化回流期间焊缝开合和短路的新方法
- 作者：Mudasir Ahmad;Ken Hubbard;Sue Teng
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- ball grid array;
- coplanarity;
- eutectic solder;
- finite element analysis;
- high lead solder;
- hydrostatic pressure;
- leadless;
- microelectronics;
- micro lead frame;
- packaging;
- perzyna;
- rigid plastic;
- solder joints;
- shape;
- standoff height;
- surface evolver;
- visco;
97.LEAD-FREE SOLDER ALLOY OPTIMIXATION FOR IMPROVED RELIABILITY

机译：无铅焊料合金优化，提高可靠性
- 作者：H.-J. Albrecht;M. L?ffler
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
98.OPTIMIZED STATIC AND DYNAMIC DRIVING FORCES FOR REMOVING FLUX RESIDUE UNDER FLUSH MOUNTED CHIP CAPS

机译：优化的静态和动态驱动力，用于清除冲孔固定芯片帽下的助焊剂残留物
- 作者：Mike Bixenman;Steve Stach
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
99.LEAD FREE MANUFACTURING, IS IT REALLY NEW?

机译：免费制造铅，这真的是新东西吗？
- 作者：Donald Burr
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
100.MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER

机译：混合冶金：使用SnPb焊料组装的SAC平衡区阵列包装的可靠性
- 作者：Heather McCormick;Polina Snugovsky;Zohreh Bagheri;Simin Bagheri;Craig Hamilton;George Riccitelli;Ramesh Mohabir
- 会议名称：《The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead Free;
- Mixed Joints;
- Backwards Compatibility;