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LEAD FREE WAVE SOLDERING AT ITS BEST

机译:领先的免费波峰焊接

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摘要

The wave soldering process is one of the processes that is most impacted by the introduction of lead free materials. There are a number of factors to consider when optimizing the wave soldering process (flux type and application methods, preheat temperature, conveyor speed, solder pot temperature, board immersion depth, etc.). How does the introduction of lead free materials impact the wave solder process factors and wave soldering equipment itself? Figure 1 This article will explore the wave solder machine for the best combination of fluxer, preheat and wave configuration that will yield the optimum results in lead free soldering. In addition to the machine configuration the process parameters will be discussed as to establishing a robust process for lead free wave soldering. Solder alloy type, printed circuit board finish, and flux type will also be discussed in general as to what effect they have on the process and what is recommended for lead free.
机译:波峰焊工艺是受无铅材料影响最大的工艺之一。优化波峰焊工艺时,需要考虑许多因素(助焊剂类型和应用方法,预热温度,传送带速度,焊锅温度,板浸入深度等)。无铅材料的引入如何影响波峰焊工艺因素和波峰焊设备本身?图1本文将探讨波峰焊机,以实现助焊剂,预热和波峰配置的最佳组合,这将在无铅焊接中产生最佳结果。除了机器配置之外,还将讨论有关建立无铅波峰焊稳健工艺的工艺参数。通常还将讨论焊料合金的类型,印刷电路板的表面处理和助焊剂的类型,以了解它们对工艺的影响以及无铅的推荐用途。

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