Lead-free solder is characterized in that the lead-free solder contains Ag of 1.2 mass % through 4.5 mass %, Cu of 0.25 mass % through 0.75 mass %, Bi of 1 mass % through 5.8 mass %, Ni of 0.01 mass % through 0.15 mass % and Sn as the remainder. These addition amounts allow to be further improved the common solder properties such as wettability, shear strength properties and the like, in addition to the thermal fatigue resistance.
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