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Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Comparison of Lead-Free Solder and Sn/Pb Eutectic Solder for Mountability.

机译：PB免焊期焊接技术的现状及问题。无铅焊料和Sn / Pb共晶焊料的可安装性的比较。

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Junichi INOUE;
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年度 1996
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1. Development of new no-flow underfill materials for both eutectic Sn-Pb solder and a high temperature melting lead-free solder [J] . Haiying Li, Johnson A., Wong C.P. IEEE Transactions on Components and Packaging Technologies . 2003,第2期

机译：开发用于共晶Sn-Pb焊料和高温熔融无铅焊料的新型无流动底部填充材料
2. A Finite-Element-Based Methodology for Evaluating Solder Electromigration Current Limits of Sn/Pb Eutectic Solder Bumps [J] . Dauksher W., Eaton D. H., Rowatt J. D. IEEE transactions on device and materials reliability . 2008,第1期

机译：基于有限元的Sn / Pb共晶焊锡焊料电迁移电流极限评估方法
3. TRENDS IN WETTABILITY STUDIES OF Pb-FREE SOLDERS. BASIC AND APPLICATION. PART II. RELATION BETWEEN SURFACE TENSION, INTERFACIAL TENSION AND WETTABILITY OF LEAD-FREE Sn-Zn AND Sn-Zn-Bi-Sb ALLOYS [J] . K. BUKAT, Z. MOSER, W. GASIOR Archives of Metallurgy and Materials . 2008,第4期

机译：无铅焊料润湿性研究的趋势。基础和应用。第二部分无铅Sn-Zn和Sn-Zn-Bi-Sb合金的表面张力，界面张力与可湿性的关系
4. AN EVALUATION OF FATIGUE DAMAGE IN LOW-CYCLE RANGE FOR SN-3.5AG, SN-0.7CU LEAD-FREE SOLDERS AND SN-PB EUTECTIC SOLDER USING IMAGE PROCESSING TO SURFACE FEATURE [C] . Takehiko Takahashi, Susumu Hioki, Ikuo Shohji, Advances in Electronic Packaging 2005 pt.C . 2005

机译：基于图像特征的SN-3.5AG，SN-0.7CU无铅焊料和SN-PB共晶焊料在低循环范围内的疲劳损伤评估
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

机译：Sn-Bi-In-Ga四元合金低温无铅焊料的计算热力学辅助开发
7. Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Present Situation for Lead Free Solder Alloy Development. [O] . Tetsuya OKUNO, Osamu MUNEKATA 1996

机译：PB免焊期焊接技术的现状及问题。无铅焊料合金发育现状。

Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Comparison of Lead-Free Solder and Sn/Pb Eutectic Solder for Mountability.

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