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Matte-finish Solder Joints after Lead-free Wave Soldering

机译:无铅波峰焊后的哑光焊点

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摘要

Most joints soldered using lead-free alloys exhibit a dull or frosty appearance, which differs from the smooth, bright, shiny surfaces of tin/lead solders. This article looks at several reasons for this phenomenon. Most joints soldered with lead-free solders exhibit a dull or frosty appearance. This differs from the smooth, bright, shiny surfaces experienced with tin/lead solders. This is typical of SAC alloys (tin/silver/copper) commonly used in lead-free soldering applications. There are a number of reasons for this occurrence. One reason is that these lead-free alloys contain three different elements, and thus three eutec-tics, during solder solidification. These eutectics each have their own melting point and solidification behavior.
机译:大多数使用无铅合金焊接的接头都表现出钝化或霜冻的外观,这与锡/铅焊料的光滑,明亮,发亮的表面不同。本文着眼于这种现象的几种原因。用无铅焊料焊接的大多数接头都表现出钝化或霜冻的外观。这不同于锡/铅焊料所经历的光滑,明亮,发亮的表面。这是通常在无铅焊接应用中使用的SAC合金(锡/银/铜)的典型代表。发生这种情况的原因有很多。原因之一是这些无铅合金在焊料固化过程中包含三种不同的元素,因此包含三种共晶材料。这些共晶分别具有自己的熔点和凝固行为。

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