RAPID POWER CYCLING OF Pb-FREE SOLDERED COMPONENTS

摘要

To better understand the fatigue behavior of Pb-free solders, extensive thermal cycling tests should be conducted. The number of chambers required to conduct such testing is unreasonable and very few tests of this type have been performed. DfR Solutions has developed a test apparatus capable of conducting six different thermal cycles simultaneously using board power cycling and forced air cooling. Printed wiring boards (PWBs) are heated via copper traces integrated into the middle layers of the board. A low level DC signal measures the temperature of the board and adjusts the heating pulse or cooling fans accordingly. The result is uniform and precise thermal cycling of each board individually.