ASSESSING THE RELIABILITY OF AREA ARRAY CONNECTORS

摘要

With the proliferation of high speed products entering the market place at such a rapid pace, designers are examining alternative methods to incorporate these high speeds into their designs and ultimately into their products. In larger, more complex products, designers are creating “density islands” or daughter cards that join onto larger more complex boards. In order to link these daughter cards to the motherboard, designers are using recently designed connectors which mimic their BGA component counterparts. There are many advantages in implementing these connectors and daughter cards into their designs. First of all, it can simplify the motherboard design, thereby reducing its cost. Secondly, it allows the designer to retain all the high speed signals in a smaller, more confined region so that the signals travel shorter distances, resulting in better signal integrity during data manipulations. Furthermore, connectors of this type reduce processing steps at contract manufacturers. Connectors of this type are soldered to the board with the rest of the components during mass reflow. Previously, connectors would either require a wave solder process or a pressfit operation. The manufactur-ability and reliability of one Mezzanine connector has been presented in previous papers. In this paper, reliability testing of a second Mezzanine connector and a BGA socket will be presented using the IPC 9701as a guideline.