For packaging of silicon components with high spatial selectivity and small heat affected zone (HAZ) laser transmission bonding (LTB) of silicon-silicon compounds using the intermediate layer system copper-titanium is investigated. The bonds are realized by using a cw-thulium fiber laser (wavelength 1940 nm). Several process parameters, like laser intensity, feed rate and contact pressure, are analyzed and optimized during the investigation. Also varying layer thicknesses for titanium and copper are compared in order to analyze their influence on the LTB process. Results are examined regarding the tensile strength measured by using tensile test. Occuring bond failures during the experiments are described and methods for avoiding these are discussed. Micrographs are analyzed in order to investigate the bond zone by SEM. Specimens bonded with corresponding standard bond process using the same layer system and bond geometry are used in order to compare the results.
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