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Laser processing, properties, and theoretical modeling of cobalt disilicide/silicon, titanium nitride/silicon, silicon/titanium nitride/silicon, and copper/titanium nitride/silicon heterostructures.

机译:二硅化钴/硅,氮化钛/硅,硅/氮化钛/硅和铜/氮化钛/硅异质结构的激光加工,性能和理论模型。

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摘要

This dissertation describes experimental results and a theoretical model on the growth and characterization of thin film heterostructures useful for fabrication of advanced semiconductor devices. The dissertation combines novel materials processing with advanced materials characterization and modeling, and it involves a new mechanism of thin film growth, coined as domain epitaxy. A pulsed laser physical vapor deposition technique was employed to fabricate CoSi{dollar}sb2{dollar}/Si, TiN/Si, Si/TiN/Si, and Cu/TiN/Si heterostructures. Impetus for choosing these materials systems stemmed from the need of low resistivity ohmic contacts and interconnections which are stable at high operating temperatures, and the need for higher packing density in advanced ultra large scale integrated circuits.; For room temperature deposited CoSi{dollar}sb2{dollar} samples, the crystal structure is amorphous which is transformed to single crystal CoSi{dollar}sb2{dollar} after annealing at 650{dollar}spcirc{dollar}C for 20 minutes with a sheet resistance of 8 {dollar}Omega{dollar}/{dollar}square{dollar}. At a substrate temperature of 600{dollar}spcirc{dollar}C, the CoSi{dollar}sb2{dollar} is epitaxial on (100) Si substrate with a cube-on-cube orientation relation and a sheet resistance of 4 {dollar}Omega{dollar}/{dollar}square{dollar}. For TiN/Si heterostructure, the epitaxial growth of smooth TiN film was obtained at a substrate temperature of 600{dollar}spcirc{dollar}C and at a pulse energy density of 6-8 joules.cm{dollar}sp{lcub}-2{rcub}{dollar}. The TiN/Si(100) heterostructure has a resistivity of 15 {dollar}muOmega{dollar}-cm with a cube-on-cube orientation relation with the substrate. For Cu/TiN/Si heterostructures, the growth mechanism of copper films on TiN is strongly dependent on the pulse rate and the substrate temperature. At a pulse rate of 15 Hz, copper grows three-dimensionally on TiN with the island sizes ranging from 0.3-1.5{dollar}mu{dollar}m depending upon the substrate temperatures. At 30 Hz, copper grows uniformly on TiN with no detectable channels or holes and with a cube-on-cube orientation of the films with the substrate. The epitaxial Si/TiN/Si heterostructure was grown at a substrate temperature of 600{dollar}spcirc{dollar}C with a cube-on-cube epitaxial orientation relation.; CoSi{dollar}sb2{dollar} and Si have small lattice mismatch (misfit {dollar}sim{dollar}1.2%). Such small mismatch allows lattice matching to be favored because the coherency strains are small. The epitaxial growth in large lattice mismatch systems e.g. TiN/Si (misfit {dollar}sim{dollar}24.6%), Cu/TiN (misfit {dollar}sim{dollar}15.8%), and Si/TiN (misfit {dollar}sim{dollar}24.6%) were obtained by domain epitaxial growth. In these cases, there are 4-to-3 match in unit cells for TiN/Si structure and 7-to-6 match for Cu/TiN structure giving rise to remaining lattice misfits of only 4.0 and 0.6% respectively. A theoretical modeling was performed for Si/TiN/Si heterostructures to demonstrate that domain epitaxy is, in fact, the energetically favorable mechanism for epitaxial growth of these two films on the Si substrate.
机译:本文描述了可用于制造先进半导体器件的薄膜异质结构的生长和表征的实验结果和理论模型。本文将新颖的材料加工与先进的材料表征和建模相结合,并提出了一种新的薄膜生长机理,即域外延。采用脉冲激光物理气相沉积技术来制造CoSi {sb2} / Si,TiN / Si,Si / TiN / Si和Cu / TiN / Si异质结构。选择这些材料系统的动力源于在高工作温度下稳定的低电阻欧姆接触和互连的需求,以及在先进的超大规模集成电路中更高的封装密度的需求。对于室温下沉积的CoSi {dollar} sb2 {dollar}样品,晶体结构是非晶态的,在650℃下退火20分钟后,其转变为单晶CoSi {dollar} sb2 {dollar}。薄层电阻为8 {dollar}Ω{dollar} / {dollar} square {dollar}。在衬底温度为600 spC时,CoSi dol sb 2 dol在(100)Si衬底上外延,其立方对立方取向关系和薄层电阻为4 dol欧米茄{dollar} / {dollar} square {dollar}。对于TiN / Si异质结构,在衬底温度为600 {spcirc {dollar} C且脉冲能量密度为6-8焦耳时,获得了光滑的TiN薄膜的外延生长。cm{dollar} sp {lcub}- 2 {rcub} {dollar}。 TiN / Si(100)异质结构的电阻率为15 {μmOmega} {cm3} -cm,与基板的立方对立方取向关系。对于Cu / TiN / Si异质结构,TiN上铜膜的生长机理在很大程度上取决于脉冲速率和衬底温度。在15 Hz的脉冲速率下,铜在TiN上三维生长,其岛尺寸取决于基板温度,范围为0.3-1.5μm。在30 Hz时,铜在TiN上均匀生长,没有可检测到的通道或孔,并且带有基材的薄膜的立方对立方取向。外延Si / TiN / Si异质结构在600spC的衬底温度下以立方对立方外延取向关系生长。 CoSi {dollar} sb2 {dollar}和Si的晶格失配很小(misfit {dollar} sim {dollar} 1.2%)。由于相干应变小,因此这种小的失配使得有利于晶格匹配。大型晶格失配系统中的外延生长例如获得了TiN / Si(不匹配的{sim}(美元)24.6%),Cu / TiN(不匹配的{sim}(美元} 15.8%)和Si / TiN(不匹配的sim(美元)24.6%)。通过域外延生长。在这些情况下,TiN / Si结构的晶胞匹配为4到3,而Cu / TiN结构的晶胞匹配为7到6,导致剩余的晶格失配分别仅为4.0%和0.6%。对Si / TiN / Si异质结构进行了理论建模,以证明域外延实际上是在硅衬底上这两个膜的外延生长的能量有利机理。

著录项

  • 作者

    Chowdhury, Rina.;

  • 作者单位

    North Carolina State University.;

  • 授予单位 North Carolina State University.;
  • 学科 Engineering Materials Science.; Physics Condensed Matter.
  • 学位 Ph.D.
  • 年度 1995
  • 页码 142 p.
  • 总页数 142
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

  • 入库时间 2022-08-17 11:49:33

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