Board on chip package for high frequency integrated circuit, has silicon chip with core including copper wires having build-up layers, which are structured, such that copper wires on substrate is directly accessible in canal for wire bonds

摘要

Package has a silicon chip, fixed with its active side to a substrate (12), including a core having copper wires (15.1, 15.2) on both sides. Build-up layers (16.1, 16.2) with copper wire (17.1, 17.2) are found on the copper wires (15.1, 15.2). Build-up layers are structured on ball side by pressure and back etching process, so that the copper wires (17.1, 17.2) on the substrate is directly accessible in canal for wire bonds.