Chip and Wire Assembly and Packaging Facilities for Prototype Microelectronic Integrated Circuits,

摘要

The goal of the report is to provide a realistic and comprehensive cost estimate for two microelectronic chip and wire assembly and final packaging facilities for prototype microelectronic hybrid integrated circuits. An analysis is made of typical costs that should be anticipated for the initial installation,operation,and staffing of chip and wire assembly and packaging facilities. (Modified author abstract)