Multi-chip package comprises package substrate having bond fingers, first chip having first bonding pads on its center portion, insulating support structures, bonding wire, and second chip with second bonding pads disposed over bonding wire

摘要

A multi-chip package comprises a package substrate (200) having bond fingers (220), a first chip (210) having first bonding pads on its center portion, insulating support structures (260) formed on the first chip, a bonding wire (230) connected between bond fingers and first bonding pads, and a second chip having second bonding pads disposed over the bonding wire and overlying the insulating support structures. A multi-chip package comprises a package substrate having bond fingers, a first chip having first bonding pads on its center portion, insulating support structures formed on the first chip located outward of the first bonding pads, a bonding wire connected between one of the bond fingers and at least one of the first bonding pads, and a second chip having second bonding pads disposed over the bonding wire and overlying the insulating support structures. The first chip is disposed on the package substrate. Independent claims are also included for: (A) a method of forming a multi-chip package, comprising providing a package substrate having bond fingers, mounting a first chip on the package substrate, forming insulating support structures on the first chip located outward of the center bonding pads, electrically connecting one of the bond fingers with center bonding pads using a bonding wire, and stacking a second chip over the bonding wire and overlying the insulating support structures; and (B) a wafer level packaging method comprising providing a wafer having integrated circuit chips, forming insulating support structures on at least one of the chips, and singulating the chips.