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IEEE Electronics Packaging Technology Conference

召开年：2013
召开地：Singapore(SG)
出版时间：-

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1.Packaging Induced Stress Effects Investigations on 40nm CMOS Technology Node: Measurements and Optimization of Device Shifts

机译：包装诱导应力效应40nm CMOS技术节点的调查：设备偏移的测量和优化
- 作者：Komi Atchou EWUAME;Pierre-Olivier BOUCHARD;Vincent FIORI;Sebastien GALLOIS-GARREIGNOT;Karim INAL;Clement TAVERNIER
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
2.A Comparative Study of the Relative Performances of the Sinter-Silver Die Attach Materials

机译：烧结银模具附着材料相对性能的比较研究
- 作者：Quan Qi
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
3.Development of Compliant Cu Pillar for Flip Chip Package

机译：倒装芯片封装兼容Cu支柱的开发
- 作者：Boo Yang Jung;F. X. Che;Jong-Kai Lin
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
4.Electromigration in Hybrid Bonding Interconnects for 3-D IC Impact of the diffusion barrier

机译：混合粘接互连的电迁移，用于三维IC撞击的延伸屏障
- 作者：S. Moreau;Y. Beilliard;P. Coudrain;D. Bouchu;L. Di Cioccio;L. Arnaud
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
5.Component embedding platform for thin profile SiP, POP and fan-out WLP

机译：组件嵌入式平台薄型SIP，POP和FAN-OUT WLP
- 作者：Risto Tuominen;Arun Gowda;Paul McConnelee
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
6.Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill-process and reliability

机译：20μm间距微凸块的热压缩粘合，具有预应用的欠填充工艺和可靠性
- 作者：Teng Wang;Joke De Messemaeker;Vladimir Cherman;Alvin Chow Chee Kay;Francisco Cadacio Jr.;Mireille Matterne;Veerle Simons;Myriam Van De Peer;Alicja Lesniewska;Olalla Varela Pedreira;Carine Gerets;Kenneth June Rebibis;Eric Beyne
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
7.A New Configurable Sintered Interconnect QFN Package for High Performance, High Lead Count and Low Cost Applications

机译：用于高性能，高铅计数和低成本应用的新型可配置烧结互连QFN封装
- 作者：Manoj Nachnani;Phil Rogren;Yuhao Sun
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
8.3D Package Failure Analysis Challenge and Solution

机译：3D包失败分析挑战和解决方案
- 作者：Fu Chao;Li Xiaomin;Justin Kow
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
- 3D X-Ray;
- TSV;
- 3D Package;
- Failure Analysis;
- SEM;
- FIB;
- TEM;
- EBSD;
9.Process and Challenges of Ultra-thick Spin-On Photoresist

机译：超厚旋转光致抗蚀剂的过程和挑战
- 作者：Soon Wee Ho;Soon Ann Sek;Boon Long Lau;Vempati Srinivasa Rao;Tai Chong Chai
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
10.Mitigation of Warpage for Large 2.5D through Silicon Interposer (TSI) Package Assembly

机译：通过硅插入器（TSI）封装组件减轻大型2.5D的翘曲
- 作者：Mian Zhi Ding;Zhaohui Chen;Sharon Pei Siang Lim;Vempati Srinivasa Rao;Jong-Kai Lin
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
11.Influence of Acid Copper Plating Additives on Void Formation during High Temperature Storage

机译：高温储存过程中酸性铜电镀添加剂对空隙形成的影响
- 作者：Ronizan bin Mohd Salleh;Lai Chin Yung
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
12.Highly Thermal Conductive Transparent Die Attach Material for LEDs

机译：高热导电透明模具安装LED材料
- 作者：Kai Zhang;Jie Li;Xinfeng Zhang;Matthew Ming-Fai Yuen;Lisa Liu;Yuhua Lee;Cheng Sheng Ku;Chuiming Wan;Zhaoming Zeng;Guowei David Xiao
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
13.Characterisation of adhesive bonds for ingestible biomedical applications

机译：可摄取生物医学应用的粘合剂粘合的特征
- 作者：Gerard Cummins;M. P. Y. Desmulliez
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
14.Electrically Conductive Adhesives for Demanding Temperature Cycling Environment with Water Immersions

机译：导电粘合剂用于苛刻的温度循环环境与水沉浸式
- 作者：Sanna Lahokallio;Janne Kiilunen;Laura Frisk
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
15.Thermal Cycling Reliability Analysis of an Anisotropic Conductive Adhesive Attached Large-Area Chip with Area Array Configuration

机译：具有面积阵列配置的各向异性导电粘合剂附加大面积芯片的热循环可靠性分析
- 作者：Janne Kiilunen;Sanna Lahokallio;Laura Frisk
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
16.Development of a Jet-based Si Micro-cooler with Multiple Drainage Micro-Trenches

机译：开发基于喷射的SI微冷却器，具有多个引流微型沟槽
- 作者：Yong Han;Boon Long Lau;Gongyue Tang;Xiaowu Zhang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
17.High Temperature Resistant Ni-Sn Transient Liquid Phase Sintering Bonding for New Generation Semiconductor Power Electronic Devices

机译：新一代半导体电力电子器件的高温耐耐耐力Ni-Sn瞬态液相烧结键合
- 作者：Hongliang Feng;Jihua Huang;Jie Zhang;Xiaodong Zhai;Xingke Zhao;Shuhai Chen
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
18.2.5D IC Fault Isolation Using the Time Domain Reflectometry Analysis

机译：2.5D使用时域反射测量分析的IC故障隔离
- 作者：Shu-Hua Lee;Yu-Hsiang Hsiao;Ping-Feng Yang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
19.Development of Highly Efficient 5GHz-band CMOS Class-E Power Amplifier Module

机译：开发高效的5GHz频段CMOS Class-E功率放大器模块
- 作者：Kyohei Eto;Kizuku Takemoto;Haruichi Kanaya
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
20.A Study Balancing Physical Properties for an Optimized Thermal Interface Material

机译：用于优化的热界面材料的研究平衡物理性质
- 作者：Lyndon Larson;Xiao Dong Wang;Yin Tang;Adriana Zambova
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
21.High Volume EMI-Shielding Process for LGA and BGA Components

机译：LGA和BGA组件的高批量EMI屏蔽工艺
- 作者：Jared Pettit;Alman Law;Alex Brewer;John Moore
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
22.Development of high reliability lead-free solder joint dispersed IMC pillar

机译：开发高可靠性无铅焊点分散的IMC柱子
- 作者：Yawara Hayashi;Ikuo Shohji;Yusuke Nakata;Tomihito Hashimoto
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
23.Assessment on Palladium-coated Copper Wire Bonding for 28nm Cu/low-k Chips: Al Bond Pad and NiPd Bond Pad

机译：钯涂覆铜线键合的评估为28nm Cu / Low-K芯片：Al键焊盘和NiPd键合垫
- 作者：Leong Ching Wai;Dhayalan Mariyappan;Chee Guan Koh;Tai Chong Chai
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
- CuPd;
- Low-K dielectric;
24.Improving the cleaning process in copper wire bonding by adapting bonding parameters

机译：采用粘接参数改善铜线键合中的清洁过程
- 作者：Simon Althoff;Andreas Unger;Walter Sextro;Florian Eacock
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
25.Advanced Wafer Level Technology: Enabling Innovations in Mobile, IoT and Wearable Electronics

机译：先进的晶圆级技术：在移动，物联网和可穿戴电子产品中实现创新
- 作者：Seung Wook Yoon;Boris Petrov;Kai Liu
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
26.Micro-channel Heat Sink with Multiple Interactive Pressure-Driven or Electro-osmotic Flows

机译：微通道散热器，具有多个交互式压力驱动或电渗透流量
- 作者：Yong Han;Boon Long Lau;Gongyue Tang;Xiaowu Zhang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
27.Low-Order Model-Based Feedforward for High-Speed Jitter-Free Tray Indexing Applications

机译：用于高速抖动托盘索引应用的低阶模型的馈电
- 作者：Si-Lu Chen;Xiaocong Li;Chek Sing Teo;Kok Kiong Tan
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
28.Comparison of Properties of Thermo-Compression Bonded 3D Stacks Using a Liquid and a Dry-Film Wafer Level Underfills

机译：使用液体和干膜晶片底部填充物热压缩3D叠层性能的比较
- 作者：F. F. C. Duval;T. Wang;G. Capuz;C. Gerets;R. A. Miller;K. J. Rebibis;E. Beyne
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
29.Residual Stress Evaluation of Flip-Chip Bonding with Non-Conductive Films on Organic Substrate and Silicon Interposer by Piezo-Sensor Embedded Test Element Group Chips

机译：用压电传感器嵌入式测试元件组芯片与有机基材上的非导电膜与非导电膜的倒装芯片粘合的残余应力评估
- 作者：Toshio Enami;Kyosuke Nanami;Osamu Horiuchi;Young-Gun Han;Hajime Tomokage
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
- Residual stress;
- Non-conductive film;
- Flip-chip bonding Silicon interposer;
30.Study on Failure Mode and Mechanism of Bond Pad under Cu Ball Bonding Process using Wire Pull Test and Finite Element Modeling

机译：用电线拉动试验和有限元模拟Cu球键合工艺粘接垫失效模式及机理研究
- 作者：F. X. Che;Leong Ching Wai;Hsiang-Yao Hsiao;T. C. Chai
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
31.Titanium Disilicide Formation for Detection of Temperature Drift and Oxygen Leak in Rapid Thermal Processing Tool

机译：用于检测温度漂移和快速热处理工具中氧气泄漏的钛二硅化物形成
- 作者：Neelakandan Sivanantham;Chai Chun Hoo;Lim Wei Hong;Sae Tae Veera
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
- Titanium Disilicide;
- Silicidation;
- RTP process control;
- GaAs Alloying;
- RTA;
- O_2 leak;
32.MODELING AND SIMULATION OF THE ULTRASONIC WIRE BONDING PROCESS

机译：超声钢丝键合工艺的建模与仿真
- 作者：Tobias Meyer;Andreas Unger;Simon Althoff;Walter Sextro;Michael Brokelmann;Matthias Hunstig;Karsten Guth
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
33.Thermocompression Flip Chip Bonding Optimization for Pre-Applied Underfill

机译：预施加底部填充的热压倒装芯片键合优化
- 作者：Horst Clauberg;Alireza Rezvani;Daniel Buergi;Tom Colosimo;Guy Frick;Oranna Yauw;Tom Strothmann;Bob Chylak
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
34.Co-process Technology of the TSV and Embedded IC for 3D heterogeneous IC Integration

机译：三维异构IC集成的TSV和嵌入式IC的共工艺技术
- 作者：Jong-Min Yook;Seong-Ryul Kim;Won-Cheol Lee;Dong-Su Kim;Jun-Chul Kim
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
35.<200 nm Wafer-to-Wafer Overlay Accuracy in Wafer Level Cu/SiO_2 Hybrid Bonding for BSI CIS

机译：<200 nm晶圆到晶圆覆盖精度晶圆级Cu / SiO_2混合键合的BSI CIS
- 作者：B. Rebhan;M. Bernauer;T. Wagenleitner;M. Heilig;F. Kurz;S. Lhostis;E. Deloffre;A. Jouve;V. Balan;L. Chitu
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
36.Thermal Resistance Measurement of Discrete Capacitors

机译：离散电容器的热阻测量
- 作者：Zoltan Sarkany;Gabor Farkas;Marta Rencz
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
37.Solder Paste Corrosivity Assesment: Bono Test

机译：焊膏腐蚀性伴侣：Bono测试
- 作者：Celine Puechagut;Anne-Marie Laugt;Emmanuelle Guene;Richard Anisko
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
- About four to six key words or four phrases in alphabetical order;
- Separated by commas;
38.Validation of New Approach of Modelling Traces by Mapping Mechanical Properties for a Printed Circuit Board Mechanical Analysis

机译：通过绘制印刷电路板机械分析来验证建模迹线的新方法
- 作者：Vamsi Krishna Yaddanapudi;Sivasubramani Krishnaswamy;Rajiv Rath;Rohith Gandhi
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
39.Cu-Cu Bonding by Ag Nanostructure at Low Temperature of 180°C

机译：通过180℃的低温α纳米结构键合Cu-Cu键合
- 作者：Ziyu Liu;Qian Wang;Jian Cai;Guisheng Zou;Lei Liu;Daozhi Shen;Lin Tan
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
40.Robust Packaging Solutions through Innovative Designs in Clip-QFN

机译：通过Clip-QFN的创新设计强大的包装解决方案
- 作者：Roxanna Samson;Ruby Ann Camenforte;Lorraine Duldulao
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
41.Impact of Backside Processing on C-V Characteristics of TSV Capacitors in 3D Stacked IC Process Flows

机译：背面处理对3D堆叠IC工艺流动C-V电容C-V特性的影响
- 作者：Joeri De Vos;Michele Stucchi;Anne Jourdain;Eric Beyne;Jash Patel;Kath Crook;Mark Carruthers;Janet Hopkins;Huma Ashraf
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
42.High-Lead Die Attach Printing Paste for Power Package Assembly

机译：用于动力包装组件的高引线模具接头印刷浆料
- 作者：Zhang Ruifen;Baquiran Joseph Aaron Mesa;Teo Keng Wei
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
43.Modeling and Design Solutions to Overcome Warpage Challenge for Fan-Out Wafer Level Packaging (FO-WLP) Technology

机译：用于克服扇出晶圆级包装（FO-WLP）技术克服翘曲挑战的建模与设计解决方案
- 作者：F. X. Che;David Ho;Mian Zhi Ding;Xiaowu Zhang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
44.An Efficient Single Phase Liquid Cooling System for Microelectronic Devices with High Power Chip

机译：具有高功率芯片的微电子器件有效的单相液冷却系统
- 作者：Gongyue Tang;Yong Han;Boon Long Lau;Xiaowu Zhang;Daniel MinWoo Rhee
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
45.Degradation Mechanism of CuPd Wire in High Temperature Hermetically Sealed Electronics

机译：高温气密密封电子杯丝的降解机理
- 作者：K. Y. Au;Xiaowu Zhang;Z. H. Chen;T. Steve Riches
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2015年
46.Understanding of within Chip variation of optical appearance of Aluminum Pads

机译：理解铝垫光学外观芯片变化
- 作者：Lim Wei Lee;Mario Stefenelli;Agala Joel Baldevia;Napetschnig Evelyn
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Adhesives;
- Image color analysis;
- Layout;
- Ions;
- Metals;
- Microscopy;
- Wires;
47.Solder Joint Reliability Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties

机译：考虑粘弹性材料性能的扇出晶圆级包装（FOWLP）的焊接接头可靠性模拟
- 作者：Zhaohui Chen;Xiaowu Zhang;Sharon Pei Siang Lim;Simon Siak Boon Lim;Boon Long Lau;Yong Han;Ming Chinq Jong;Songlin Liu;Xiaobai Wang;Yosephine Andriani
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Soldering;
- Creep;
- Strain;
- Electromagnetic compatibility;
- Dielectrics;
- Reliability;
48.Research on Feedforward Control in the linear motor direct drive XY two-dimensional platform

机译：线性电机直接驱动XY二维平台的前馈控制研究
- 作者：He Yunbo;HE ZuoXiong;Gao Jian;Cui Chengqiang;Yang Zhijun;Tang Hui;Chen Yun;Zhang Kai;Chen Xun
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Permanent magnet motors;
- Synchronous motors;
- Permanent magnets;
- Feedforward systems;
- Mathematical model;
- Motion control;
49.Temporary Bonding Material Study for Room Temperature Mechanical Debonding with eWLB Wafer Application

机译：室温临时粘接材料研究与EWLB晶圆应用的机械借助
- 作者：Seiya Masuda;Yu Iwai;Mitsuru Sawano;Kotaro Okabe;Kazuto Shimada;CAPARAS Jose Alvin;Won Kyoung Choi
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Bonding;
- Cleaning;
- Temperature measurement;
- Solvents;
- Wafer bonding;
- Lasers;
- Coatings;
50.High-resolution Time-domain Reflectometry Analysis in Back-end-of-line (BEOL) by Recursive Circuit Modelling

机译：通过递归电路建模，高分辨率时域反射测量分析在线后端（BEOL）
- 作者：Yang Shang;Makoto Shinohara;Rahul Babu Radhamony;Joanna Kiljan;Alan Wu
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
51.Laser hybrid integration on silicon photonic integrated circuits with reflected grating

机译：反射光栅硅光子集成电路的激光混合集成
- 作者：Yu SUN;Man ZHAO;Juan WEI;Fengman LIU;Haiyun XUE;Huimin HE;Liqiang CAO
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Couplings;
- Gratings;
- Optical fibers;
- Fiber gratings;
- Silicon;
52.A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging

机译：等温老化过程中瞬态液相粘合的Cu-Sn金属间化合物生长速率研究
- 作者：So-Eun Jeong;Seung-Boo Jung;Jeong-Won Yoon
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Aging;
- Preforms;
- Bonding;
- Intermetallic;
- Scanning electron microscopy;
- Photomicrography;
- Compounds;
53.Design of Micro-sensors for Measuring Localised Stresses during Fan-Out Wafer Level Packaging (FOWLP) Processes

机译：用于测量扇出晶圆级包装（FOWLP）过程中局部应力测量的微传感器的设计
- 作者：Xiaowu Zhang;Zhaohui Chen;Boon Long Lau;Yong Han;Sharon Pei Shang Lim;Simon Siak Boon Lim;Ming Chinq Jong;Sharon Seow Huang Lim
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Stress;
- Sensor arrays;
- Layout;
- Stress measurement;
- Packaging;
- Wafer scale integration;
54.Kirkendall Voids Improvement in Thin Small No Lead Package

机译：KIRKENDALL在薄的小没有引脚包装中的改进
- 作者：Lay Yeap Lim;Yao Huang Huang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Plating;
- Copper;
- Chemicals;
- Programmable logic arrays;
- Additives;
- Nickel;
- Contamination;
55.Low Stress Solution of Anodic Bonding Technology with SW-YY? Glass for Sensitive MEMS

机译：用SW-yy 阳极粘合技术的低应力解决方案，用于敏感MEMS的玻璃
- 作者：Xiaodong Hu;Piotr Mackowiak;Manuel Baeuscher;Yucheng Zhang;Bei Wang;Ulli Hansen;Simon Maus;Oliver Gyenge;Oswin Ehrmann;Klaus-Dieter Lang;Ha-Duong Ngo
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Bonding;
- Glass;
- Silicon;
- Micromechanical devices;
- Stress;
- Pressure sensors;
56.Spray cooling enhancement studies using dielectric liquid

机译：使用介电液喷雾冷却增强研究
- 作者：Ranjith Kandasamy;Pengfei Liu;Huicheng Feng;Teck Neng Wong;Kok Chuan Toh
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Cooling;
- Heating systems;
- Heat transfer;
- Liquids;
- Temperature measurement;
- Dielectric liquids;
57.SIPI Co-Sim: Signal Performance of Super Speed Differential I/O with Power Referencing Design

机译：SIPI CO-SIM：带有功率参考设计超速差分I / O的信号性能
- 作者：Li Wern Chew;Paik Wen Ong
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Rails;
- Routing;
- Layout;
- Couplings;
- Degradation;
- Voltage measurement;
- Electronics packaging;
58.Development of a Flexible Printed Multi-Functional Sensor Platform for Medical Applications

机译：开发用于医疗应用的灵活的印刷多功能传感器平台
- 作者：David Choong Sze Wai;Ruiqi Lim;Maria Ramona Ninfa Bautista Damalerio;Weiguo Chen;Ming-Yuan Cheng
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Ink;
- Force;
- Temperature sensors;
- Electrodes;
- Impedance;
- Gold;
- Temperature measurement;
59.Preparation and mechanical characterization of Ni-Fe-P coating for power electronics

机译：电力电子镀镍涂层的制备与力学特性
- 作者：Zhiwen Chen;Fan Yang;Hao Zheng;Juan Peng;Sheng Liu;Li Liu
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Coatings;
- Loading;
- Plating;
- Erbium;
- Substrates;
- Temperature distribution;
60.Wafer Level Reliability Characterization of 2.5D IC packages

机译：2.5D IC封装的晶圆级可靠性表征
- 作者：Jayasanker Jayabalan;Jong Ming Chinq;Vivek Chidambaram;Sharon Lim Pei Siang;Calvin Chua Hung Ming;Surya Bhattacharya
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Probes;
- Semiconductor device reliability;
- Field programmable gate arrays;
- Stress;
- Electrical resistance measurement;
61.Critical Surface Quality Inspection And Analysis Of Precision Optical Components Fabricated Using CMP Methods

机译：临界表面质量检测与CMP方法制造精密光学元件的分析
- 作者：Pamidighantam V Ramana;M K Gupta;G Krishna Rao;G. D. Purnachandra;I. Abdul Rashed;S Ramana
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- grinding;
- image processing;
- optical fabrication;
- optical images;
- optical prisms;
- optical testing;
- polishing;
- quality control;
- surface finishing;
- surface roughness;
- surface topography measurement;
62.Effect of the Strengthening Mechanism on the Response of a Solder Alloy to Strain Rate and Ageing

机译：强化机理对焊料合金对应变率和衰老响应的影响
- 作者：Wayne Ng;Tetsuya Akaiwa;Pavithiran Narayanan;Keith Sweatman;Tetsuro Nishimura;Takatoshi Nishimura
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Strain;
- Aging;
- Solids;
- Stress;
- Substrates;
- Intermetallic;
63.Challenges and Approaches of 2.5D high density Flip chip interconnect on through mold interposer

机译：通过模具插入器互连2.5D高密度倒装芯片互连的挑战和方法
- 作者：Sharon Pei-Siang LIM;Ser Choong Chong;Wen Wei Seit;Tai Chong Chai
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Flip-chip devices;
- Bonding;
- Metals;
- Semiconductor device measurement;
- Soldering;
64.Dynamic Bending Reliability Analysis of Flexible Hybrid Integrated Chip-Foil Packages

机译：柔性混合集成芯片箔包装的动态弯曲可靠性分析
- 作者：N Palavesam;E Yacoub-George;W Hell;C Landesberger;C Kutter;K Bock
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Wiring;
- Reliability;
- Bonding;
- Vehicle dynamics;
- Flip-chip devices;
- Resistance;
- Electronics packaging;
65.One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material

机译：一种微米镶嵌可用于使用光敏介电材料的扇出晶片级包装的再分布
- 作者：Warren W. Flack;Robert Hsieh;Ha-Ai Nguyen;John Slabbekoorn;Samuel Suhard;Andy Miller;Akito Hiro;Romain Ridremont
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Dielectrics;
- Polymers;
- Resistors;
- Numerical analysis;
- Silicon;
- Dielectric materials;
- Lithography;
66.Design and optimization of the 10Tbps optical transmission system

机译：10Tbps光传输系统的设计与优化
- 作者：Huimin He;Man Zhao;Fengman Liu;Haiyun xue;Yu Sun;Liqiang cao
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
67.Development of Thermal Test Package for Data Center Micro-Fluid Cooling Characterization

机译：用于数据中心微流体冷却表征的热试套装的研制
- 作者：Yong Han;Boon Long Lau;Gongyue Tang;Sharon Seow Huang Lim;Xiaowu Zhang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Heating systems;
- Temperature sensors;
- Temperature measurement;
- Electronic packaging thermal management;
- Cooling;
68.Void Defect Formed in Wiping Step of Gravure Printing

机译：在凹版印刷中形成的空隙缺陷
- 作者：Z. H. Cen;X. C. Shan;B. Salam;L. S. Rachel Tan;J. Wei
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Ink;
- Printing;
- Viscosity;
- Microscopy;
- Nanoparticles;
- Consumer electronics;
- Shape;
69.Simulation And Electrical Characterization Of A Novel 2D-Printed Incontinence Sensor With Conductive Polymer PEDOT:PSS For Medical Applications

机译：具有导电聚合物PEDOT的新型2D印刷失禁传感器的仿真与电气表征：医疗应用PSS
- 作者：Manuel Baeuscher;Bei Wang;Xiaodong Hu;Piotr Mackowiak;Norman Merchau;Oswin Ehrmann;Martin Schneider-Ramelow;Klaus-Dieter Lang;Ha-Duong Ngo
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Analytical models;
- Solid modeling;
- Capacitance;
- Permittivity measurement;
- Electrodes;
- Dielectrics;
70.EPIC Via Last on SOI Wafer Integration Challenges

机译：史诗通过SOI晶圆集成挑战
- 作者：Woon Leng Loh;Qin Ren
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Through-silicon vias;
- Silicon;
- Etching;
- Plating;
- Fabrication;
- Resists;
- Electronics packaging;
71.Laser Drilling of Thru Mold Vias (TMVs) for FOWLP Application

机译：用于FOWLP应用的激光钻孔通孔（TMV）
- 作者：Vasarla Nagendra Sekhar;Daniel Ismael Cereno;David Ho;Vempati Srinivasa Rao
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Laser beams;
- Dielectrics;
- Laser ablation;
- Laser theory;
- Semiconductor lasers;
72.Enabling Pb-Free Flip Chip QFN Technology: Understanding Kirkendall Voiding and Factors Affecting Its Formation During Bump Process

机译：启用PB无铅芯片QFN技术：了解撞击过程中kirkendall空缺和影响其形成的因素
- 作者：Rafael Jose L. Guevara;Jose Arvin M. Plomantes;Ruby Ann D. Mamangun
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Impurities;
- Copper;
- Aging;
- Flip-chip devices;
- Tin;
- Reliability;
73.High Density Interconnection for Heterogeneous Integration on FOWLP Platform

机译：FOWLP平台异构集成的高密度互连
- 作者：Chai Tai Chong;Lim Teck Guan;David Ho;Chong Ser Choong;Che Faxing;Surya Bhattacharya
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Packaging;
- Electronics packaging;
- Soldering;
- Bandwidth;
- Silicon;
- Compounds;
74.A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

机译：多热点IC的低计算成本和准确的热量计算方法
- 作者：Daixing Wang;Yudan Pi;Wei Wang;Yufeng Jin
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
75.A Hybrid Laser Integration Approach for Miniature Photonic Sensors

机译：微型光子传感器的混合激光积分方法
- 作者：Jifang Tao;Chong Ser Choong;Tao Sun;Hong Cai;Navab Singh;Yuandong Gu
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Diode lasers;
- Semiconductor lasers;
- Micromechanical devices;
- Lenses;
- Bonding;
- Optical coupling;
- Optical sensors;
76.Fine Pitch Cu to Cu interconnects for 2.5D Packaging

机译：用于2.5D包装的Cu互连细准Cu
- 作者：Ling Xie;Ser Choong Chong
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Bonding;
- Plating;
- Field programmable gate arrays;
- Force;
- Packaging;
- Three-dimensional displays;
77.How my Electronic housing’s material should be decided: A thermal point of view study to understand the impact of material on internal air temperature

机译：如何确定我的电子住房的材料：一种热点，以了解材料对内部气温的影响
- 作者：Nitesh Kumar Sardana;Kratika Shrivastava
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Plastics;
- Heat sinks;
- Metals;
- Convection;
- Atmospheric modeling;
- Temperature measurement;
78.Surface Planarization of Polymeric Interlayer Dielectrics for FOWLP Applications

机译：禽类应用聚合物层间电介质的表面平坦化
- 作者：Soojung Kang;Yejin Kim;Ayoung Moon;Sangwon Lee;Sarah Eunkyung Kim;Sungdong Kim
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Pressing;
- Surface topography;
- Polymers;
- Planarization;
- Dielectrics;
- Integrated circuit interconnections;
79.High bonding strength of silver sintered joints on non-precious metal surfaces by pressure sintering under air atmosphere using micro-silver sinter paste

机译：使用微银烧结浆料，通过压力烧结在非贵金属表面上的银烧结接头的高粘合强度
- 作者：Ly May Chew;Wolfgang Schmitt;Monique Dubis
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Silver;
- Nickel;
- Substrates;
- Bonding;
- Surface treatment;
- Silicon;
- Atmosphere;
80.Constitutive Behaviour of Single Lap Joint of Sintered Silver Paste

机译：烧结银膏单圈关节的组成型行为
- 作者：Xu Long;Chongyang Du;Wenbin Tang;Yongchao Liu;Yao Yao;Fengrui Jia
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Strain;
- Silver;
- Microstructure;
- Films;
- Temperature;
- Stress;
- Nanoparticles;
81.Extending Cooling Limit of Automotive Camera Advanced Driver Assistance Based Under Usage Conditions

机译：基于使用条件，扩展了汽车摄像机高级驾驶员辅助的冷却极限
- 作者：Gamal Refai-Ahmed;Hoa Do;Arun Vr Varadarajan Rajagopal;Anthony Torza;Brian Philofsky
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Cameras;
- Solar heating;
- Heat transfer;
- Numerical models;
- Field programmable gate arrays;
- Automobiles;
- Electronic packaging thermal management;
82.Effect of Bond Pad Surface Finish on AuSn Solder Bumping Using Laser Solder Jetting

机译：使用激光焊接喷射粘接焊盘表面饰面对AUSN焊料撞击的影响
- 作者：Norhanani Binte Jaafar;Chong Ser Choong
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Gold;
- Surface treatment;
- Aging;
- Shearing;
- Surface emitting lasers;
83.Development of cost effective Copper overburden removal for Via-Last TSV fabrication

机译：开发经济高效的铜覆盖覆盖普通TSV制造的开发
- 作者：Qin REN;Woon Leng LOH;Xiang Yu WANG
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Through-silicon vias;
- Fabrication;
- Surface treatment;
- Resistance;
- Copper;
- Electrical resistance measurement;
- Filling;
84.K-band SATCOM Receiver Modules: System Design, Analysis and Test using the M3-Approach

机译：K-BAND SATCOM接收器模块：使用M3方法进行系统设计，分析和测试
- 作者：Christian Tschoban;Brian Curran;Jacob Reyes;Ivan Ndip;Marco Rossi;Klaus-Dieter Lang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Mixers;
- Radio frequency;
- Receivers;
- Gain;
- K-band;
- Noise measurement;
- Packaging;
85.Dual-attached SMT Capacitor Configurations for Small Form Factor and Single-ended Devices

机译：用于小型系列和单端设备的双连接SMT电容配置
- 作者：Chin Lee Kuan;Sameer Shekhar;Amit K. Jain
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Capacitors;
- Capacitance;
- Copper;
- Electronics packaging;
- Load flow;
- Impedance;
- Surface impedance;
86.Experimental and Numerical Study on Silicon Die Strength and its Impact on Package Reliability

机译：硅模具强度的实验和数值研究及其对封装可靠性的影响
- 作者：E. Gourvest;I. Raid;O. Robin;C. Trouiller;S. Gallois-Garregnot;J-E. Luan
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Silicon;
- Blades;
- Sawing;
- Loading;
- Solid modeling;
- Finite element analysis;
- Stress;
87.Mechanical Characterization of MEMS-Microphones by Means of Nanoindentation and Coupled Finite Element Analysis

机译：纳米狭窄和耦合有限元分析MEMS麦克风的力学表征
- 作者：Jan Albrecht;Marie Weissbach;Matthias Vobl;Ulrich Krumbein;Sven Rzepka
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Springs;
- Stress;
- Microphones;
- Finite element analysis;
- Load modeling;
- Micromechanical devices;
- Geometry;
88.Enhancing Bump Thick Resist Lithography: Establishing Process Controls to Eliminate Copper Pillar Footing

机译：增强凸起厚抗抗性光刻：建立过程控制以消除铜柱基础
- 作者：Jose Arvin M. Plomantes;Ruby Ann D. Mamangun;Armando T. Clarina;Rafael Jose L. Guevara
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Resists;
- Standards;
- Lithography;
- Copper;
- Heat transfer;
- Cooling;
- Heating systems;
89.A Novel Double-layered Heat Sink for High Power Electronics

机译：用于高功率电子产品的新型双层散热器
- 作者：Yicang Huang;Mingliang Xu;Hui Li;Shengnan Shen;Shiyue Ma
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Heat sinks;
- Thermal resistance;
- Heat transfer;
- Coolants;
- Pins;
- Temperature distribution;
90.Investigation of the solder void defect in IC semiconductor packaging by 3D computed tomography analysis

机译：3D计算机断层扫描分析研究IC半导体包装中焊剂空隙缺陷的研究
- 作者：Lai Chin Yung
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- X-ray imaging;
- Copper;
- Three-dimensional displays;
- Soldering;
- Photonics;
- Inspection;
- Substrates;
91.Cracking failure of Cu pillar bump caused by electromigration and stress concentration under thermo-electric coupling loads

机译：在热电耦合负载下电迁移和应力集中引起的Cu柱凸块的破裂
- 作者：Si Chen;Zhizhe Wang;Bin Zhou;Yunfei En;Yun Huang;Bin Yao
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Cavity resonators;
- Electromigration;
- Current density;
- Stress;
- Couplings;
- Microstructure;
- Finite element analysis;
92.Effect of the laser parameters, epoxy mold compound properties and mold tool surface finishing on mark legibility of encapsulated IC package

机译：激光参数，环氧树脂复合性能和模具刀具表面精加工在封装IC封装的标记易读性上
- 作者：Lim Ming Siong;Chai Yuan Tat
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Compounds;
- Lasers;
- Inspection;
- Rough surfaces;
- Surface roughness;
- Integrated circuits;
- Resins;
93.Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

机译：晶圆级通过聚合物光学通孔（TPOV），实现了高吞吐量的光学窗口制造
- 作者：J. Hamelink;Z. Huang;R. H. Poelma;R. Kropf;M. Gallouch
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Electronics packaging;
- Conferences;
94.Low-temperature Cu-Cu bonding by self-reduction of particle-free Ag ion paste

机译：通过自我减少颗粒Ag离子浆料的低温Cu-Cu键合
- 作者：Junjie Li;Tielin Shi;Guanglan Liao;Zirong Tang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Bonding;
- Ions;
- Nanoparticles;
- Heating systems;
- Substrates;
- Metals;
- Packaging;
95.Post processing of a SiNy-based photonic stack above a CMOS imager sensor

机译：CMOS成像传感器上方的SIN Y 基于光子叠层的处理
- 作者：Nga. P. Pham;Hemant K. Tyagi;Bert Du Bois;Rita Van Hoof;Gillis Winderickx
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Photonics;
- Mirrors;
- Optical waveguides;
- Optical resonators;
- Optical imaging;
- Optical sensors;
- Fabrication;
96.Correlating Printing Performance of Solder Paste with Its Rheology

机译：用流变学相关性焊膏的印刷性能
- 作者：Saurabh Shrivastava;Ansuman Das;Sathiyanarayanan C
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Printing;
- Metals;
- Strain;
- Stress;
- Rheology;
- Powders;
- Viscosity;
97.Study of polysilsesquioxane dielectric for the use of multi-structured redistribution layers in fan-out wafer level packaging applications

机译：扇出晶圆级包装应用中多结构再分配层使用多结构再分配层的多晶硅硅氧烷电介质研究
- 作者：Changmin Song;Sungdong Kim;Sarah Eunkyung Kim
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Curing;
- Dielectric constant;
- Packaging;
- Dielectric losses;
- Wafer scale integration;
98.Robust Packaging For MEMS Sensors Using Plastic Moulding

机译：用于MEMS传感器的鲁棒包装使用塑料模塑
- 作者：Guoqiang Wu;Leong Ching Wai;Beibei Han;Daw Don Cheam;Peter Hyun Kee Chang;Navab Singh;Yuandong Gu
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Micromechanical devices;
- Substrates;
- Wires;
- Reliability;
- Packaging;
- Bonding;
- Sensors;
99.Mechanics of Copper Wire Bond Failure due to Thermal Fatigue

机译：热疲劳引起的铜线粘结失效的力学
- 作者：Subramani Manoharan;Nga Man Jennifa Li;Chandradip Patel;Stevan Hunter;Patrick McCluskey
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Wires;
- Stress;
- Strain;
- Electromagnetic compatibility;
- Compounds;
- Neck;
- Electronic packaging thermal management;
100.A Modified Unequal Wilkinson Power Divider Using T-Shaped Transformers

机译：使用T形变压器改进的不等威尔金森功率分频器
- 作者：Ren-Fu Tsai;Pu-Hua Deng;Ting-Jung Chang
- 会议名称：《IEEE Electronics Packaging Technology Conference》 | 2019年
- Impedance;
- Power dividers;
- Filtering theory;
- Microstrip;
- Electronics packaging;
- Dielectric measurement;
- Frequency conversion;