Robust Packaging For MEMS Sensors Using Plastic Moulding

摘要

The development of a robust system-in-package (SiP) technology for MEMS sensors is reported in this paper. The MEMS sensor and the application-specific integrated circuit (ASIC) chip are stacked together on a quad-flat no-leads (QFN) substrate. Wire-bonding is used to realize the electrical connections and the compressive plastic moulding is employed to achieve the packaging of the sensors. The robust and reliability of the package are also verified by several reliability tests, such as mechanical shock (MS), temperature cycling (TC), high-temperature storage (HTS) and highly accelerated stress test (HAST).