Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill-process and reliability

摘要

Thermal compression bonding (TCB) process in combination with a pre-applied underfill material has been developed and investigated for assembling 20 μm pitch Sn-based micro bumps. It is found bonding force has a profound impact on the joint formation behavior. A low bonding force produces bump joints with heavier underfill entrapment and incompletely reacted solder. A higher bonding force leads to more solder squeezing-out, leaving a thin and completely reacted inter-metallic compound (IMC) layer in the joints. Electrical measurement of the daisy chains on the as-bonded chips does not reveal any significant difference between the samples made with different bonding forces. The reliability of the two types of joints were further studied in two post-bonding tests, namely the resistance measurement of daisy chains at an elevated temperature and stack-level thermo-cycling test. Both tests show a better reliability performance from the bump joints with less underfill entrapment and completely reacted IMC layer.