In this study, an efficient single phase liquid cooling system with the heat dissipation capability of 350 W/cm~2 on a chip of 7mm × 7mm (a total power of 175 W) under the pumping power of 0.1 W is developed and examined. Such a liquid cooling system is proposed for the microelectronic devices with high power chip such as the high performance servers and power amplifies. Our focus in this study is on the efficiency improvement of both the micro-cooler and heat exchanger, which are the major contributors of the full liquid cooling system performance. The accomplishments include the development of the silicon based hybrid micro-cooler combining the merits of both micro-jet array impingement and micro-channel flow cooling technologies and the optimization of the miniaturized heat exchanger with low pressure drop, small footprint area and high heat exchange efficiency.
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