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Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature

     

摘要

The controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire bonding might present opportunities for nanoscale pack-aging and nanodevice design.

著录项

  • 来源
    《安徽地质》|2017年第3期|49-54|共6页
  • 作者单位

    School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, People's Republic of China;

    International Research Institute for Multidisciplinary Science, Beihang University, Beijing 100191, People's Republic of China;

    School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, People's Republic of China;

    School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, People's Republic of China;

    Department of Mechanical Engineering, Tsinghua University, Beijing 100084, People's Republic of China;

    Department of Mechanical Engineering, Tsinghua University, Beijing 100084, People's Republic of China;

    Department of Mechanical Engineering, Tsinghua University, Beijing 100084, People's Republic of China;

    Centre for Advanced Materials Joining, University of Waterloo, Waterloo, ON N2L 3G1, Canada;

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