机译:微电子封装中引线键合和热超声倒装芯片键合的超声功率特性
School of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China;
Key Laboratory of Modem Complex Equipment Design and Extreme Manufacturing of Ministry of Education,Changsha 410083, China;
State Key Laboratory of Digital Manufacturing Equipment and Technology,Huazhong University Science and Technology, Wuhan 430074, China;
School of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China;
Key Laboratory of Modem Complex Equipment Design and Extreme Manufacturing of Ministry of Education,Changsha 410083, China;
School of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China;
Key Laboratory of Modem Complex Equipment Design and Extreme Manufacturing of Ministry of Education,Changsha 410083, China;
ultrasonic power; wedge bonding; thermosonic flip chip; input impedance; failure;