The effects of temperature-cycling ramp-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package's (SnAgCu) lead-free solder joints on a FR-4 printed circuit board (PCB) subjected to various ramp times (0.5, 1, 5, 10, and 15 minutes) for two different ranges of cycling temperatures, namely, from 0°C to 100°C and from -25°C to 125°C. For all the cases, the dwell-time at peak cycling temperatures (0°C, 100°C, -25°C and 125°C) is 15 minutes.
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