PROBLEM TO BE SOLVED: To provide a solder-joint part fatigue life prediction system for performing fatigue life prediction on a lead-free solder-joint part with high accuracy without requiring expertise.;SOLUTION: This system is equipped with a storage part 50 stored with dimension data on a radical model of a semiconductor package, a storage part 51 stored with structure expression data on lead-free solder, a storage part 53 stored with fatigue strength data on a lead-free solder material, and a processing part 20. The processing part 20 prepares analysis model data by changing the dimension data on the radical model; performs stress analysis on the semiconductor package mounted on a substrate, based on the analysis model data, the structure expression data, deformation characteristics on the semiconductor package and substrate material, and temperature cycle conditions; calculates a transient strain rate component and a steady-state strain rate component; calculates an equivalent non-elastic strain quantity at a strain-centered position; and thereby calculates a fatigue life.;COPYRIGHT: (C)2004,JPO&NCIPI
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