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Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

机译：通过有限元分析预测无铅BGA焊点的热疲劳寿命

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Young-Eui Shin; Kyung-Woo Lee; Kyong-Ho Chang; Seung-Boo Jung; Jaenbsp; Pil Jung;
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1. Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis [J] . Young-Eui Shin, Kyung-Woo Lee, Kyong-Ho Chang Materials transactions . 2001,第5期

机译：用有限元分析预测无铅BGA焊点的热疲劳寿命
2. Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling [J] . Van Nhat Le, Benabou Lahouari, Etgens Victor, Microelectronics & Reliability . 2016,第OCTa期

机译：在热循环下过程产生的空隙对无铅焊点疲劳寿命影响的有限元分析
3. Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices [J] . N. Delmonte, F. Giuliani, P. Cova Microelectronics & Reliability . 2013,第9a11期

机译：表面安装功率器件功率循环期间无铅焊点疲劳寿命的有限元建模和表征
4. Measurement of acceleration factor for lead-free solder (SnAg/sub 3.8/Cu/sub 0.7/) in thermal cycling test of BGA components and calibration of lead-free solder joint model for life prediction by finite element analyses [C] . Andersson, K., Salmela, . 2005

机译：在BGA组件的热循环测试中测量无铅焊料（SnAg / sub 3.8 / Cu / sub 0.7 /）的加速因子，并通过有限元分析校准无铅焊点模型以预测寿命
5. Modeling of Failure Mechanism and Life Prediction of Lead-Free BGA Solder Joint under Repetitive Mechanical Drop Loading. [D] . Jiang, Tong. 2012

机译：重复机械跌落载荷作用下无铅BGA焊点失效机理的建模和寿命预测。
6. A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects [O] . Weiwei Hu, Yaqiu Li, Yufeng Sun, 2016

机译：考虑载荷顺序影响的BGA热疲劳寿命预测模型
7. Fatigue Life Scatter of Lead-Free Solder Joints for Chip Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering) [O] . Hiroki MIYAUCHI, Qiang YU, Tadahiro SHIBUTANI 2009

机译：芯片组件无铅焊点的疲劳寿命散射（<特殊问题>电子设备和机械工程的热电机械可靠性）

Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

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