Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints

摘要

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing intermetallic compounds (IMCs) and their redeposition at the interfaces. The size and volume fraction of Au-containing IMCs dispersed in the solder bulk increased with decreasing the solder joint dimensions. For the small solder joint with 300 µm solder ball, the (Au,Ni)Sn4 IMCs redeposited to the interfaces after thermal aging at 150℃ for 9 days, but this was not observed for the other two solder joints with large solder volume. This results also indicate that the redeposition of (Au,Ni)Sn4 is closely associated with the migration of Cu towards the interfaces.