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Gate Bias Dependence of Defect-Mediated Hot-Carrier Degradation in GaN HEMTs

机译:GaN HEMT中缺陷介导的热载流子降解的栅极偏置依赖性

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Monte Carlo analysis of hot-electron degradation in AlGaN/GaN high-electron mobility transistors shows that, for gate voltages corresponding to semi-ON bias conditions, the average electron energy has a spatial peak with ${langle}{rm E}_{rm AVE}{rangle}{sim}{1.5}~{rm eV}$ . The peak is located at the edge of the gate. At this location, the carrier versus energy distribution has a large tail extending over 3 eV. When transferred to the lattice, this energy can cause defect dehydrogenation and device degradation. These results are consistent with the experimental data indicating maximum degradation in the semi-ON bias condition.
机译:蒙特卡洛对AlGaN / GaN高电子迁移率晶体管中热电子降解的分析表明,对于与半导通偏置条件相对应的栅极电压,平均电子能量具有一个空间峰,该峰具有$ {langle} {rm E} _ { rm AVE} {rangle} {sim} {1.5}〜{rm eV} $。峰值位于门的边缘。在此位置,载流子与能量的分布具有较大的尾巴,延伸超过3 eV。当转移到晶格上时,该能量会导致缺陷脱氢和器件性能下降。这些结果与表明在半导通偏压条件下最大降解的实验数据一致。

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