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METHOD OF FORMING GATE RECESS, METHOD OF MANUFACTURING ALGaN/GaN-HEMT, AND ALGaN/GaN-HEMT

机译:形成栅极应力的方法,制造AlGaN / GaN-HEMT的方法以及ALGaN / GaN-HEMT

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a gate recess for suppressing occurrence of variation of a threshold voltage (Vth), to provide a method of manufacturing a normally-off-type AlGaN/GaN-HEMT, and to provide AlGaN/GaN-HEMT.;SOLUTION: By the method of forming the gate recess 20, UV light having energy, where a bandgap energy is equivalent to that of a prescribed semiconductor layer within the semiconductor layer, is applied from the surface of the semiconductor layer changing in a layer direction from a gate opening 19 by photoelectrochemical etching, and at the same time the semiconductor layer of prescribed bandgap energy within the semiconductor layer is etched from the gate opening of an SiN surface protection layer 17.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种形成用于抑制阈值电压(V )变化的栅极凹槽的方法,以提供一种常关型AlGaN / GaN的制造方法。解决方案:通过形成栅极凹部20的方法,施加具有能量的UV光,其中带隙能量等于半导体层内的规定半导体层的能量。从半导体层的表面开始通过光电化学蚀刻从栅极开口19沿层方向改变,并且同时从SiN表面保护层17的栅极开口蚀刻半导体层内具有规定带隙能量的半导体层。 。;版权:(C)2011,日本特许厅和INPIT

著录项

  • 公开/公告号JP2011077122A

    专利类型

  • 公开/公告日2011-04-14

    原文格式PDF

  • 申请/专利权人 OKI ELECTRIC INDUSTRY CO LTD;

    申请/专利号JP20090224521

  • 发明设计人 OKI HIDEYUKI;MARUI TOSHIHARU;

    申请日2009-09-29

  • 分类号H01L29/812;H01L21/338;H01L29/778;H01L21/306;H01L21/3063;H01L21/28;

  • 国家 JP

  • 入库时间 2022-08-21 18:22:33

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