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On the mechanism for interface trap generation in MOS transistors due to channel hot carrier stressing

机译:关于由于沟道热载流子应力而在MOS晶体管中产生界面陷阱的机制

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The classical concept and theory suggest that the degradation of MOS transistors is caused by interface trap generation resulting from "hot carrier injection." We report three new experiments that use the deuterium isotope effect to probe the mechanism for interface trap generation in n-MOS transistors in the presence of hot hole and electron injection. These experiments show clearly that hot carrier injection into the gate oxide exhibits essentially no isotope effect, whereas channel hot electrons at the interface exhibit a large isotope effect. This leads to the conclusion that channel hot electrons, not carriers injected into the gate oxide, are primarily responsible for interface trap generation for standard hot carrier stressing.
机译:经典的概念和理论表明,MOS晶体管的退化是由“热载流子注入”导致的界面陷阱产生引起的。我们报告了三个新的实验,这些实验使用氘同位素效应来探测在存在热空穴和电子注入的情况下n-MOS晶体管中界面陷阱产生的机理。这些实验清楚地表明,将热载流子注入到栅氧化物中基本上不表现出同位素效应,而在界面处的沟道热电子表现出较大的同位素效应。这得出结论,沟道热电子而不是注入栅极氧化物的载流子,主要负责界面陷阱的产生,从而产生标准的热载流子应力。

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