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ION BEAM SYNTHESIS OF SiC ON INSULATOR STRUCTURES

机译:绝缘体结构上SiC的离子束合成

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摘要

In this work, we present a highly versatile alternative approach for the fabrication of SiC on insulator (SiCOI) material, based on the ion beam synthesis (IBS) technology. Combined with a bond and etch back technique, IBS has allowed the synthesis of high crystalline quality β-SiC on Insulator layers with interfaces free of voids or bubbles. The flexibility of ion implantation has also allowed the extension of the IBS technology to the synthesis of polycrystalline SiC on insulator (Poly-SiCOI) structures by direct conversion of polycrystalline Si on insulator layers. As another application of IBS, n-doped SiC layers have been synthesized with a novel method based on P~+ pre-doping of the Si wafers before the IBS of SiC. Our electrical data, together with the absence of additional stress related to P-implant suggests that this technique could be suitable to avoid effects related to the ion implantation damage in the SiC lattice.
机译:在这项工作中,我们提出了一种基于离子束合成(IBS)技术的绝缘体上SiC(SiCOI)材料制造的通用替代方法。结合结合和回蚀技术,IBS允许在绝缘体层上合成高结晶质量的β-SiC,且界面上没有空隙或气泡。离子注入的灵活性还允许IBS技术扩展到通过在绝缘体层上直接转换多晶硅来在绝缘体(Poly-SiCOI)结构上合成多晶SiC。作为IBS的另一种应用,已经基于在SiC的IBS之前对Si晶片进行P〜+预掺杂的新颖方法合成了n掺杂的SiC层。我们的电学数据以及与P注入无关的附加应力表明,该技术可能适合避免与SiC晶格中的离子注入损伤相关的影响。

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