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ION BEAM SYNTHESIS OF SiC ON INSULATOR STRUCTURES

机译:绝缘结构SiC的离子束合成

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摘要

In this work, we present a highly versatile alternative approach for the fabrication of SiC on insulator (SiCOI) material, based on the ion beam synthesis (IBS) technology. Combined with a bond and etch back technique, IBS has allowed the synthesis of high crystalline quality β-SiC on Insulator layers with interfaces free of voids or bubbles. The flexibility of ion implantation has also allowed the extension of the IBS technology to the synthesis of polycrystalline SiC on insulator (Poly-SiCOI) structures by direct conversion of polycrystalline Si on insulator layers. As another application of IBS, n-doped SiC layers have been synthesized with a novel method based on P~+ pre-doping of the Si wafers before the IBS of SiC. Our electrical data, together with the absence of additional stress related to P-implant suggests that this technique could be suitable to avoid effects related to the ion implantation damage in the SiC lattice.
机译:在这项工作中,基于离子束合成(IBS)技术,我们提出了一种高度通用的替代方法,用于在绝缘体(SicoI)材料上制造SiC。结合粘合和蚀刻后部技术,IBS允许在绝缘体层上合成高结晶质量β-SiC,其具有无空隙或气泡的界面。离子植入的柔韧性也允许IBS技术延长在绝缘体(多晶硅)结构上合成多晶Si,通过在绝缘层上的多晶硅直接转化。作为IBS的另一个应用,已经用基于SiC的IBS之前的P〜+预掺杂的新方法合成了N掺杂的SiC层。我们的电气数据与与p植入有关的额外压力表明,这种技术可能适合于避免与SiC格子中的离子植入损伤相关的效果。

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