Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

机译：通过热建模调查无铅焊点可靠性

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices - organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

机译：本文介绍了两种不同材料连接的焊接接头可靠性和热机械建模的理论，这些方法通常用于电子设备 - 有机FR4和两个陶瓷材料AL2O3和ALN。研究了组合有机 - 有机，有机陶瓷，陶瓷 - 陶瓷，与共晶SNPB焊料连接或无铅焊料SnAGCU。

著录项

来源
《European Microelectronics and Packaging Conference Exhibition》|2005年||共5页
会议地点
作者
Jindrich Bulva; Marek Novotny; Ivan Szendiuch; IMAPS;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类半导体技术;
关键词
thermomechanical modelling; ANSYS; reliability;

机译：热机械造型;ANSYS;可靠性;

相似文献

外文文献
中文文献
专利

1. Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag [J] . ZHOU Ping, HU Bing-ting, ZHOU Jie-min, 中南大学学报（英文版） . 2009,第003期

机译：无铅焊料Sn-3.5Ag的本构模型参数拟合和焊点热循环可靠性的有限元分析
2. SOLDER CREEP-FATIGUE MODEL PARAMETERS FOR SAC & SNAG LEAD-FREE SOLDER JOINT RELIABILITY ESTIMATION [J] . Werner Engelmaier The Journal of the Reliability Analysis Center . 2011,第2期

机译：用于SAC和SNAG无铅焊点接头可靠性估计的焊点蠕变疲劳模型参数
3. An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2 2014;Applications in Fatigue Reliability Predictions for SnPb and Lead-Free Solders [J] . Ghorbani H. R., Spelt J. K. IEEE Transactions on Advanced Packaging . 2007,第4期

机译：无引线芯片电阻器中焊点的弹性-蠕变分析模型：2014年第2部分； SnPb和无铅焊料的疲劳可靠性预测中的应用
4. Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling [C] . Jindrich Bulva, Marek Novotny, Ivan Szendiuch, European Microelectronics and Packaging Conference Exhibition . 2005

机译：通过热建模调查无铅焊点可靠性
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Preparation of Lead-free Composite Powder Solder Paste and Study on Reliability of Lead-free Solder Joint [O] . 王建 2012

机译：无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

摘要

著录项

相似文献

相关主题

期刊订阅